TWI334030B - Repair device and repair method - Google Patents

Repair device and repair method Download PDF

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Publication number
TWI334030B
TWI334030B TW096103649A TW96103649A TWI334030B TW I334030 B TWI334030 B TW I334030B TW 096103649 A TW096103649 A TW 096103649A TW 96103649 A TW96103649 A TW 96103649A TW I334030 B TWI334030 B TW I334030B
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Taiwan
Prior art keywords
unit
substrate
elevated
probe
disposed
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TW096103649A
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Chinese (zh)
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TW200734656A (en
Inventor
Akihiko Okano
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Laserfront Technologies Inc
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Publication of TWI334030B publication Critical patent/TWI334030B/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components

Description

1334030 九、發明說明: 【發明所屬之技術領域】 本發明係關於一種用以檢測及修復在電路配線中之 復裝置’該裝置係設置於液晶顯示襄置⑽)、電裝顯示面板^ Plasma Display Panel) ’以及其他平面顯示器(FpDs ;1334030 IX. Description of the Invention: [Technical Field] The present invention relates to a composite device for detecting and repairing in a circuit wiring. The device is disposed on a liquid crystal display device (10), and an electrical display panel ^ Plasma Display Panel) 'and other flat panel displays (FpDs;

Displays)的基板等上。· ’ ^anel ^ 【先前技術】 FPD基板最近已在尺寸上增大,而且比起吾棄不良基板 •籲在製造過程中出現的不良基板已變得較不昂貴。電路配線^ 置(修復裝置)係用來修復基板上的缺陷。 乂 、 以下說明修復錢的料前後之製造方法。在此過程 一部分,檢測缺陷並藉由專門用以測試整個基板上的FpD之 . 配線的斷路缺陷Copen-circuit defect)以及短路缺陷 • (short-circuit defect)之電子缺陷檢測裝置(〇s (短/斷路' ^ 試器)或自動影像檢測裝置(A0I裝置:自動光學檢驗裝置 (Automatic Optical Inspection device))以確定其位置:而 檢測與位置測定的結果會在電腦中儲存成資料。修復裝置以此 料為基礎來修復軸。〇S測勒或自動光學檢峨置接著再一次 翬證實缺陷已被正確地修復。因而使製程倒退,而產品產量減少。 近來,為增進產量,已開發出安裴於〇s測試器上之修復裝置。 然而,在製造過程中,僅可使用有限量的空間來放置修復裝置, •而此裝置有儘可⑨縮小體積的需要。此裝置亦必須改善產量並 低成本。 -供ne日專利公報第〇2一〇2947號所揭露之修復裝置係為一配 之習知修復裝置的例子。配備〇s測試器之習知修復 f置3有:一座台’其支撐一已安裝的受測單元,其中座台可移 至探測,置與修復位置,並可加以控制以便於三正交軸上移 動,並在二維平面上旋轉;一測試裝置,藉由外加電力於探測位 1334030 的形式而設置於各@不_方向上。因此,為了檢剩所有 路與短路缺陷,必須使饋電探針頭108與所有的電極墊片接觸。 因此’在上述之習知裝置中,必須將LCD基板移離開支撐架1〇5 一次並加以旋轉,之後並重新安裝在修復裝置上。圖1β顯示的 態中,LCD基板已移離開支撐架1〇5,並在旋轉9〇度德 裝於修復裝置上。 &lt; 然而’上述之習知技術具有以下的缺點。 在上述的習知技術中,FPD基板上的缺陷位置由先前步驟中 設置之0S職純檢測,修縣置基於檢測㈣料而 至缺,位^置,而修復該缺陷。此修復結果再一次回到先前步驟之 0S測試器以確認缺陷是否已正確地被修復。然而,此類 具有以下的缺點:曾修復過之FPD基板repaired = substrate)又回到先前步驟,而增加了工作時間與單元作業時 (tact time)。 ” ’ 曰 —些製造業者最近已提出為修復裝置提供 ί 而,如在圖1所示之f知_ GS測定器 ίπΓ盆f置巾,此習知系統有如下的缺點4要從支撐架上移除 i基t一次並重新安裝基板的步驟;需要轉子裝置(rotor ielice)'财外部旋轉機構之_裝置;所增加钱_增加了 成本,且早凡作業時間進一步地增加。 ·— 【發明内容】 祕ΐΐ月々之目的為提供一修復裝置’其可有效地進入lcd基板上 ^。斤有電路配線、檢測缺陷、並修復缺陷而不移除與重新安裝基 二= 發明之修復裝置包括:一座台,其上安裝了基板;第一與第 探su!者該座台之一表面的第一方向上移動;第-及第二 於該二ί別,於該第一及第二高架,且能夠在與關 弟方向相父的第二方向上移動;以及一修復單元, 7 1334030 板ϊί測料,其設置於該第—高架以便能夠在第 -。其中該第一及第二探針感應器單元中之每一個且 力::ίϊΓ ;夠,第二方向上移動;-探針單元,用以; 該受測單’以及—感應器單元,用以檢測流至 電流,兩者並列於該平台部分上;以及平台驅動單 的轉軸^平台部分繞著在與該座台之—表面正交的方向上 高其中ΐ修鮮元設置於鱗—高架與該第二 Γ二探針感應器單元設置於該第-高架之該 葉:=;ΐ該弟二探針感應器單元設置於該第二高架之該 高架:單元於該第-高架之料^ ,二探;感 探針感應器單元,分別設置於該第-及第: 關”-方向相交之第二以以 用以外加電壓至基板之受測 該其:各個該第-ί第= :刀—月匕夠於第一方向上移動;一探針單元, 早元,以及一感應器單元,用以檢測 針單ί及該感應器單元兩者均並列 著在與,座台之一表面正交轉:二:動該平台部分繞 芊之··其巾該第—探針感魅單元設置於該第-高 竿之;it ’該第二探針感應器單元係、設置於該第二高 木之料、㈣上’該第三赫並靴於 8 3&lt;間’且該修復單,元設置於該f三高架之該第—及第二高架 -高構:其中該第—騎感應11單元餘置於該第 二高架=Ϊ架側上’該第二探針感應、11單元係S置於該第 第二高W架側上’遺第二局架並不位於該第—高架與該 二高架=側ί該修復單元係設置於該第三高架與該第-及第 5^ — 〇 * 座口馬動早 7G ,將該座台、該第一、第 相關之,該座台驅動單元係用以在與平板 路配吉構:f中r基板之受測單元為設置於該基板之電 該受測單元:或第二楝針感應11單元之探針單元與該基板之 流至該點’並於兩點之間外加電壓以檢測電流是否 又測早疋,稭此檢測出電路配線上的短路。 電路其巾—基板之受測單福設置於該基板之 板之該第—探_應器單元之任—探針單元與該基 接的流是否流至與該基板之該受測單元相連 電路配線,藉此檢測出該電路配線上的斷路。 =_如下結構:針-級之受解福 ;=缺=修復單元㈣-祕絲至較解紅短ϊίΐ ㈣如下結構.其巾—基板之受測單元為設置於該基板之電 元發射—雷射光綠該受測單元之斷路位 置,並猎由化學瘵氧沈積法(CVD)執行修復。 substrate) 〇 =:基:面顯示器基板可為液晶顯示裝置之基板或是ΐ裝 能在與關於該高架之第—&gt; 感應器單元具有-平二方向上鑛。其中探針 用以外加電壓至基板之^^可於k方向上移動;厂探針單元, 流至受測單元之電流,兩者均:二f一感應器單兀’用以檢測 驅動平台部分繞著在與該:台=面=:二Display) on the substrate, etc. · 'anel ^ ^ [Prior Art] FPD substrates have recently increased in size and have become less expensive than the poor substrates that have appeared in the manufacturing process. The circuit wiring (repair device) is used to repair defects on the substrate. 、 , The following describes the manufacturing method before and after the repair of the money. In part of this process, defects are detected and used to test FpD on the entire substrate. Copen-circuit defect of the wiring and short-circuit defect electronic defect detection device (〇s (short) / Open circuit '^ tester' or automatic image inspection device (A0I device: Automatic optical inspection device) to determine its position: the results of detection and position measurement are stored in the computer as data. Based on this material, the shaft is repaired. 〇S measuring or automatic optical inspection and then confirming that the defect has been correctly repaired, thus making the process backward and the product yield is reduced. Recently, in order to increase the output, the safety has been developed. The repair device on the 〇s tester. However, in the manufacturing process, only a limited amount of space can be used to place the repair device, and the device has the need to reduce the volume. The device must also improve the yield. Low-cost. - The repair device disclosed in Japanese Patent Laid-Open Publication No. Hei 2 〇 2947 is an example of a conventional repair device. The conventional repair of the tester has three sets: a stand that supports an installed test unit, wherein the stand can be moved to the detection, set and repair position, and can be controlled to move on the three orthogonal axes. And rotating on a two-dimensional plane; a test device is set in each @不_ direction by applying power in the form of the detection bit 1334030. Therefore, in order to check all the paths and short-circuit defects, the feed probe head must be made 108 is in contact with all of the electrode pads. Therefore, in the above conventional device, the LCD substrate must be moved away from the support frame 1〇5 once and rotated, and then reinstalled on the repairing device. The LCD substrate has been moved away from the support frame 1〇5 and mounted on the repairing device at a rotation of 9 degrees. <Therefore, the above-mentioned prior art has the following disadvantages. In the above-mentioned prior art, on the FPD substrate The defect position is detected by the 0S job set in the previous step, and the repair county fixes the defect based on the detection (four) material, and fixes the defect. The repair result is returned to the previous step of the 0S tester to confirm the defect. Is it already Correctly repaired. However, this type has the following disadvantages: the repaired FPD substrate repaired = substrate) is returned to the previous step, which increases the working time and tact time. " 曰 - Some manufacturers have recently proposed to provide 修复 for the repair device, as shown in Figure 1 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The step of removing the i-base once and re-installing the substrate; the rotor device is required to be the device of the external rotation mechanism; the added cost _ increases the cost, and the working time is further increased. Contents] The purpose of the secret moon is to provide a repair device that can effectively enter the lcd substrate. The circuit has wiring, detects defects, and repairs defects without removing and reinstalling the base 2. The invention includes: a platform on which a substrate is mounted; a first and a second probe are moved in a first direction on a surface of the platform; and a second and a second are on the first and second elevated frames, And being movable in a second direction opposite to the direction of Guandi; and a repair unit, 7 1334030, a sheet of material, which is disposed at the first-high shelf so as to be capable of being at - - wherein the first and second probes Each of the sensor units and Force:: ίϊΓ; enough, moving in the second direction; - probe unit for; the test list 'and the sensor unit for detecting the flow to the current, both of which are listed on the platform portion; and the platform The rotating shaft of the driving unit is partially disposed in a direction orthogonal to the surface of the platform, wherein the upper portion is disposed on the scale-elevator and the second second probe sensor unit is disposed on the first-high frame The leaf:=;ΐThe second probe sensor unit is disposed on the elevated shelf of the second elevated frame: the unit is in the first-high shelf material ^, the second probe; the sensing probe sensor unit is respectively disposed in the first - and the "off" - the second of the intersecting directions to apply the applied voltage to the substrate of the test: each of the first -: - knife - moon is moved in the first direction; a probe unit , the early element, and a sensor unit for detecting the needle single and the sensor unit are both juxtaposed on the surface of one of the seats: two: moving the platform partially around The first probe-sensing unit is disposed in the first-high ;; the 'the second probe sensor unit is disposed on the The second high wood material, (4) on the 'the third Hehe boots in 8 3 &lt; between the and the repair order, the element is set in the f three elevated frame - and the second elevated - high structure: where the first ride The sensing 11 unit is left on the second overhead = truss side 'the second probe sensing, and the 11 unit system S is placed on the second high W frame side 'the second local frame is not located in the first The elevated frame and the two elevated frame=side ί, the repairing unit is disposed on the third elevated frame and the first and the fifth and the first 马* 口 马 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 The platform driving unit is configured to cooperate with the flat circuit: the measuring unit of the r substrate is the measuring unit that is disposed on the substrate, or the probe unit of the second unit 11 and the substrate The flow to this point 'and a voltage is applied between the two points to detect whether the current is measured early, and the straw detects a short circuit on the circuit wiring. The circuit of the substrate-measured substrate is disposed on the board of the substrate, and the probe unit and the base connected flow flow to the circuit connected to the tested unit of the substrate Wiring, thereby detecting an open circuit on the circuit wiring. =_The following structure: needle-level is solved by the solution; = lack = repair unit (four) - secret silk to more red short ϊ ΐ (4) The following structure. The towel-substrate test unit is the cell emission set on the substrate - The laser light green is the disconnected position of the unit under test, and the hunting is performed by chemical oxygen deposition (CVD). Substrate : =: base: The surface display substrate can be a substrate or an armor of a liquid crystal display device, and can be mined in a direction parallel to the sensor unit of the overhead. The probe can be moved in the k direction by applying a voltage to the substrate; the factory probe unit, the current flowing to the unit under test, both: two f-inductor unit 兀' for detecting the driving platform portion Around with: the table = face =: two

配線 二:電 J 觸單;撿並 示裝置之基板或電槳顯示面板之基基板也可疋液晶顯 =時,藉由下 位於該觉測單元的該探針感應器單元之後,令 二二ί的该受測單元接觸於兩點,於該兩點之間外加電壓凡 ί; 復單;細到鱗時,將該修 12Wiring 2: The electric J touches the single substrate; the base substrate of the display device or the base substrate of the electric paddle display panel can also be displayed after the liquid crystal display = by the lower of the probe sensor unit of the sensing unit, ί The unit under test is in contact with two points, and a voltage is applied between the two points; a single order; when the scale is fine, the repair is performed.

Claims (1)

1334030 十、申請專利範ffi: · 1. 一種修復裝置、,包含: 一座台,其上安裝一基板; 第/、第一咼架,可在沿著該座台之一表面的第一方向上移 動; 第一與第二探針感應器單元,其分別設置於該第一與第二高 架,且能夠在與關於該高架之該第一方向相交之第二方向上移 動;以及1334030 X. Patent application ffi: · 1. A repairing device comprising: a table on which a substrate is mounted; a first/first truss, in a first direction along a surface of the platform Moving; first and second probe sensor units respectively disposed on the first and second overheads and movable in a second direction intersecting the first direction about the overhead; 一修復單元,用以修復該基板之受測單元,其設置於該第一高 架以便能夠在該第二方向上移動; 其中該第—與第二探針感應器單元中之每一者具有: 一平台部分,能夠在該第二方向上移動; h二探-針單元以及—感應11單前者係用以外加電塵至該基 $丨^早兀,後者係用以檢測流至該受測單元之電流,兩者並 列於5亥平台部分上;以及a repairing unit for repairing the tested unit of the substrate, the first elevated frame being disposed to be movable in the second direction; wherein each of the first and second probe sensor units has: a platform portion capable of moving in the second direction; h second probe-needle unit and - induction 11 single former with externally applied electric dust to the base $丨^ early, the latter is used to detect flow to the measured The current of the unit, which is listed on the 5 hai platform part; 一平台驅動單元,用以驅動該平台部分繞著在盥該座台 表面正交之方向上的轉軸旋轉。 /、 2.如申請專利範圍第1項之修復裝置,其中: 之一 該修復單元設置於該第一高架上之該第二高架相對之側上; 該第一探針感應器單元係設置於該第一高架之該第二高架側 上,以及 該第二探針感應器單元係設置於該第二高架之該第一高架側 上。 3.如申請專利範圍第1項之修復裝置,其中: 該修復裝置係設置於該第一高架之該第二高架側上; s亥第一探針感應器單元係與修復單元一體地該並列;以及 該第二探針感應器單元係設置於該第二高架之該第一高架側 22 1334030 上。 4. 一種修復裝置,包含: 一座台,其上安裝一基板; 第一、第二與第三高架,其能夠在沿著座台表面於第一方向上 移動; 第一與第二探針感應器單元,其分別設置於該第一與第二高 架,且能夠於與該高架之該第一方向相交之第二方向上移動;以 ' 及 ^ 一修復單元,用以修復該基板之受測單元,其設置於該第三高 架以便能購在該第二方向上移動;其中 各個該第一與第二探針感應器單元具有: 一平台部分,能夠於該第二方向上移動; 一探針單元以及一感應器單元,前者係用以外加電壓至該基 板之受測單元,後者係用以檢測流至該受測單元之電流,兩者並 列於該平台部分上;以及 一平台驅動單元,用以驅動該平台部分繞著在與該座台之一 表面正交的方向上之轉軸旋轉。 • 5.如申請專利範圍第4項之修復裝置,其中: 該第一探針感應器單元係設置於該第一高架之該第二高架側 上; 該第二探針感應器單元係設置於該第二高架之該第一高架側 &quot; 上; - 該第三高架不位於在該第一高架與該第二高架之間;以及 該修復裝置設置於該第三高架之該第一及第二高架側上。 6.如申請專利範圍第4項之修復裝置,其中: 該第一探針感應器單元係設置於該第一高架之該第二高架側 23 ^34030 上; 該第二探針感應器單元係設置於該第二高架之該第一高架側 該第二尚架不位於在該第一高架與該第二高架之 上該修復裝置設置於該第三高架與該第__及第二高架相對之側 如申%專利範圍第1至6項中任一項之修復裝置, 二其上設置有該座台與該第―、第二與第三高架;以及 么座。鶴早九,用財與辭板棚之該第—方向上移動該 8.如申請專利範圍第!至6項中任一項之修復裝置,其中: ίίΐίΐ受測單元係為設置於該基板上的電路配線;以及 置-或第一板針感應器單元之探針單元與該基板之該受測 觸於J點’並於兩點之間外加電壓以檢測電流是否流至該 又測早7C,藉此檢測出電路配線上的短路。 9· ^申請專利範圍第丨至6項中任—項之修復裝置,其中: 受測單元係為設置於該基板上的電路配線;以及 二探針感應11單狀任—騎單元與該基板之該 供應電流,且另—探針感應器單元之該感 二Γ70測電^疋否流至與該基板之該受測單元相連接的電 路配線,猎此檢測出該電路配線上的斷路。 專第1至6項中任一項之修復裝置,其中: 之文測單元係為設置於基板上的電路配線;以及 缺陷5 y復裝置發射一雷射光束至該受測單元之短路位置並修復 24 1334030 11.如申請專利範圍第1至6項中任一項之修復裝置,其中: 該基板之受測單元係為設置於基板上的電路配線;以及 該+修復裝置發射一雷射光束至該受測單元之斷路位置並藉由 化學黑·氣沈積法來執行修復。 一項之修復裝置,其中該基板 12.如申請專利範圍第1至6項中任 係為平面顯示器基板。 申請翻細第12項之修復裝置,其巾資料線與閘極線係 於该平面顯不器基板中之陣列内以金屬線聯結。 H如^專利顧第12項之修復裝置,射該平_示器基板 係為-液晶顯示裝置之基板或—電漿顯示面板之基板。 15·—-種修復方法,其_如巾請專利範圍第丨至? $裝置來檢顺修復絲難纟上之基板巾雜路,該在 方方向上具有多個形成於其中之電路配線單元^修復 f動該第-與第二探針感應科元之任—個至 &amp;在該第-方向上測試電路配線中下’ 判定短路是碎在:在沿_第_ 二序以 ;針感應器單元之後,令-探針單元與 電流兩2妓兩點之間外加輕,並檢測在該兩點之間流^ 田在孩第一方向上測試電路配線中的短· 判定短路是否存在:在沿著該第二方向旋轉二程序以 f十感應器單元之後,令-探針單元與該,該 於兩點’於該兩點之間外力姻,並檢測在該兩點 25 1334030 26.如申請專利範圍第23或24項的修復裝置,其中. 該基板之該受測單元為設置於該基板上的電/路配狳 復缺 1 探針單元’發射1就束至該受解元之轉位置,並修 2顯7·矛如^板術幽23或24瓣細,其中該基板為平面A platform drive unit for driving the platform portion to rotate about a rotation axis in a direction orthogonal to the surface of the table. 2. The repairing device of claim 1, wherein: the repairing unit is disposed on the opposite side of the second elevated frame on the first elevated frame; the first probe sensor unit is disposed on The second elevated side of the first elevated frame and the second probe sensor unit are disposed on the first elevated side of the second elevated frame. 3. The repairing device of claim 1, wherein: the repairing device is disposed on the second elevated side of the first elevated frame; the first probe sensor unit is integrated with the repairing unit And the second probe sensor unit is disposed on the first elevated side 22 1334030 of the second elevated frame. 4. A repairing apparatus comprising: a table on which a substrate is mounted; first, second and third elevated frames movable in a first direction along a surface of the platform; first and second probe sensing Units are respectively disposed on the first and second overhead frames and are movable in a second direction intersecting the first direction of the overhead frame; and a repair unit for repairing the substrate to be tested a unit disposed on the third overhead to be movable in the second direction; wherein each of the first and second probe sensor units has: a platform portion movable in the second direction; a needle unit and a sensor unit, the former uses a voltage applied to the substrate under test, the latter is used to detect the current flowing to the unit under test, and the two are juxtaposed on the platform portion; and a platform driving unit And driving the platform portion to rotate about a rotation axis in a direction orthogonal to a surface of the one of the stages. 5. The repair device of claim 4, wherein: the first probe sensor unit is disposed on the second elevated side of the first elevated frame; the second probe sensor unit is disposed on The first elevated side of the second elevated frame; the third elevated frame is not located between the first elevated frame and the second elevated frame; and the repairing device is disposed on the first and the third elevated frame On the two elevated side. 6. The repairing device of claim 4, wherein: the first probe sensor unit is disposed on the second elevated side 23^34030 of the first elevated frame; the second probe sensor unit is The second elevated frame is disposed on the first elevated side of the second elevated frame, and the second elevated frame is not disposed on the first elevated shelf and the second elevated shelf. The repairing device is disposed on the third elevated shelf opposite to the first elevated shelf and the second elevated shelf. The repairing device according to any one of the first to sixth aspects of the invention, wherein the seat is provided with the seat, the second, the third and the third elevated; and the seat. Tsuruji Nine, use the financial and resignation shed in the first direction to move the 8. If you apply for patent scope! The repair device of any one of the six items, wherein: the unit to be tested is a circuit wiring disposed on the substrate; and the probe unit of the first or first pin sensor unit and the substrate are tested Touching the J point ' and applying a voltage between the two points to detect whether the current flows to the 7C again, thereby detecting a short circuit on the circuit wiring. 9. The repairing device of the invention of claim 6 to claim 6, wherein: the unit under test is a circuit wiring disposed on the substrate; and the two-probe sensing 11 single-handed-riding unit and the substrate The current is supplied, and the sense sensor of the probe sensor unit flows to the circuit wiring connected to the device under test of the substrate, and the circuit breaker is detected to be disconnected. The repairing device of any one of the items 1 to 6, wherein: the detecting unit is a circuit wiring disposed on the substrate; and the defective 5 y complex device emits a laser beam to a short-circuited position of the tested unit and The repairing device of any one of claims 1 to 6, wherein: the unit under test of the substrate is a circuit wiring disposed on the substrate; and the + repairing device emits a laser beam Repair to the disconnected position of the unit under test and by chemical black gas deposition. A repair apparatus in which the substrate 12 is a flat display substrate as in the first to sixth aspects of the patent application. In the repair device of claim 12, the towel data line and the gate line are connected by a metal wire in an array in the planar display substrate. H is the repair device of the patent item No. 12, and the flat substrate is the substrate of the liquid crystal display device or the substrate of the plasma display panel. 15·—- Kind of repair method, its _ such as the scope of the patent, the scope of the patent? The device is used to inspect the substrate towel miscellaneous path on the repairing wire, and the circuit wiring unit formed in the square direction has a plurality of circuit wiring units formed in the square direction, and the first and second probe sensing elements are used. To & in the first direction of the test circuit wiring, the lower part is judged to be broken: after the ___ second order; after the needle sensor unit, the - probe unit is current between the two points and two points Adding light, and detecting the shortness in the test circuit wiring in the first direction of the child between the two points. · Determining whether the short circuit exists: after rotating the second program to f sensor unit along the second direction, ???the probe unit and the two points between the two points are externally forceed and detected at the two points 25 1334030 26. The repair device of claim 23 or 24, wherein the substrate The unit under test is an electric/road arrangement provided on the substrate, and the probe unit 'transmits 1 to bundle the beam to the position where the solution element is rotated, and repairs 2 and 7 spears. 24 valves are thin, wherein the substrate is flat 28. 如申請專利範圍第27項之修復裝置’其中 金屬線連結於該平面顯示器基板之陣列中。、、'’ /、甲-、、以 29. 如申請專利範圍第27項之修復裝置,其巾該平 係為液晶顯示裝置之基板或電漿顯示面板之基板。、w 土 30 -種修復方法,其利用如申請專利範圍第23或24項之修 ^來=測並修復安裝於座台上之基板中的短路,該基板在 f一方向上具有多個形成於其中之電路配線單元;該修復方法包 移動該探針感應器單元至受測單元; 、&gt;當在該第一方向上測試電路配線中的短路時,藉由下列程序以 =疋短路是否存在:在沿著該第一方向旋轉位於該受測單元的該 抓針感應器單元之後,令一探針單元與該基板上的該受測單元接 觸於兩點,於該兩點之間外加電壓,並檢測在該兩點之間流動的 電流; ,當在該第二方向上測試電路配線中的短路時,藉由下列程序以 巧疋短路是否存在:在沿著該第二方向旋轉位於該受測單元的該 探針感應為單元之後,令一探針單元與該基板的該受測單元接觸 於兩點,於該兩點之間外加電壓,並檢測在該兩點之間流動的電 29 1334030 流;以及 當檢測到短路時,將該修復裝置移動至短路位置並修復該短 路。 . Μ·。。如申請專利範圍第30項之修復方法,其中該基板為一平面顯 不器基板’而資料線與閘極線係以金屬線連結於其陣列中。 32.如申請專利範圍第31項之修復方法’其中將電壓施加於該兩 點之間所在的位置是設置於該資料線或該閘極線的末端部分之鄰 • 近電極墊片,其中該兩點為該探針感應器單元之探針與該基板之 該受測單元相接觸之處。 十一、圖式:28. The repair device of claim 27, wherein the metal wire is attached to the array of planar display substrates. And '', A-, and 29. The repairing device of claim 27, wherein the towel is a substrate of a liquid crystal display device or a substrate of a plasma display panel. , w soil 30 - a repair method, which uses a repair as in claim 23 or 24 to test and repair a short circuit in a substrate mounted on a table, the substrate having a plurality of Wherein the circuit wiring unit; the repair method includes moving the probe sensor unit to the unit under test;, &gt; when testing a short circuit in the circuit wiring in the first direction, whether the short circuit exists by =疋 by the following procedure After rotating the pick-up sensor unit located in the unit under test in the first direction, a probe unit is brought into contact with the unit under test on the substrate at two points, and a voltage is applied between the two points. And detecting a current flowing between the two points; when testing the short circuit in the circuit wiring in the second direction, the following procedure is used to determine whether the short circuit exists: rotating in the second direction After the probe of the unit under test is sensed as a unit, a probe unit is brought into contact with the unit under test of the substrate at two points, a voltage is applied between the two points, and electricity flowing between the two points is detected. 29 1334030 Stream And when the short circuit is detected, the repairing mobile device to fix the short-circuit and short-circuit position. Μ·. . The repair method of claim 30, wherein the substrate is a planar display substrate and the data lines and gate lines are connected to the array by metal lines. 32. The repair method of claim 31, wherein the voltage is applied between the two points is a neighboring/near electrode pad disposed at an end portion of the data line or the gate line, wherein the Two points are where the probe of the probe sensor unit contacts the unit under test of the substrate. XI. Schema: 3030
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