JP2010211083A - Method and device for manufacturing fpd substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the yield of an FPD substrate to be restored, without requiring strict management regarding thickness and density, or the like, of a CVD film in a laser CVD treatment step for reducing the manufacturing cost, in a method for manufacturing the FPD substrate including wiring restoration processing by a laser CVD method of gas window system. <P>SOLUTION: A resin application step of locally applying prescribed insulating resin by a small amount so as to cover a micro-region, including a conductive film part formed on a wiring defect part on the FPD substrate, and a resin curing step of forcedly curing the insulating resin locally applied by the small amount are provided between a wiring defect restoration step and a wiring surface cleaning step; and as a result, a protective film by the insulating resin is formed prior to the wiring surface cleaning step in the micro-region, including the wiring defect restoration part on the FPD substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an FPD (Flat Panel Display) substrate such as a liquid crystal display substrate, a plasma display substrate, and the like, and in particular, an FPD substrate manufacturing method and apparatus including a wiring repair process by a gas window type laser CVD method. About.

  In recent years, with the expansion of FPD (Flat Panel Display) screens, in the manufacturing process of FPD substrates such as liquid crystal display substrates and plasma display substrates, substrates with wiring defects such as disconnection are regarded as defective products. Rather than discarding, the conductive film is locally deposited on the defective part of the wiring by CVD (Chemical Vapor Deposition) method to restore continuity. The said wiring repair process is adopted.

  If the substrate thus subjected to the wiring repair processing is then a liquid crystal display substrate, it is sent to the cell manufacturing process located at the subsequent stage, and a film body such as an alignment film is formed on the circuit surface including the repaired portion of the substrate. On the other hand, if it is a plasma display panel, it is sent to the process located in the subsequent stage, and tungsten carbonyl W (CO) 6 or chromium Cr (CO) 6 etc. is formed on the circuit surface including the repaired portion of the substrate. As a result, the CVD film deposited on the wiring defect portion is firmly held on the substrate (see, for example, Patent Documents 1, 2, and 3). ).

JP 2007-109980 A Japanese Patent No. 2723658 Japanese Patent Laid-Open No. 3109508

  As a CVD method adopted for this type of wiring repair process, a CVD source gas is introduced into a large vacuum chamber in which an object is accommodated, and this is ionized with a high electric field to deposit a CVD film on the object. Instead of the so-called “vacuum chamber system” that is said to be used, a gas window having a lower surface opened and having a laser incident window on the upper surface is locally covered on a wiring defect portion on the substrate, and the inside is purged with a purge gas. While shielding from the outside world, a CVD raw material gas is introduced into the inside to generate a CVD raw material gas atmosphere, and in that state, a laser beam is introduced from a laser incident window to irradiate a wiring defect portion. A so-called “gas window method” is adopted in which a gas is decomposed to deposit a CVD film on a wiring defect portion.

  Here, in general, the “gas window method” CVD method has a higher CVD film deposition speed and higher deposition efficiency than the “vacuum chamber method” CVD method, but the CVD film density and adhesion are high. It has been found by the present inventor that it is low and unstable.

  Therefore, in order to deposit a CVD film satisfying sufficient adhesion strength and electrical continuity on the wiring defect portion on the substrate, it is strictly necessary to perform a laser beam irradiation process, a raw material gas composition, a purge gas composition, etc. Management regarding the film thickness and film density is required.

  In addition, there is a cleaning process for cleaning the substrate surface between such a wiring repair process using the CVD method and a film body generation process (for example, an alignment film generation process) located in the subsequent stage. However, in particular, this type of cleaning process has recently been enhanced in cleaning power because it is necessary to clean an enlarged substrate at a high speed.

  Therefore, the CVD film formed by the above-described wiring repair process has a low adhesion strength due to, for example, lack of laser irradiation time or a failure of the source gas or purge gas, and is relatively easy to peel off. In the above-described cleaning process, the CVD film adhering to the wiring defect portion is peeled off, and the substrate must be discarded any more, thereby reducing the yield.

  On the other hand, in order to surely prevent such peeling of the CVD film, if the source gas concentration is increased more than necessary or the laser irradiation time is increased more than necessary, the adhesion strength of the CVD film increases, Unnecessarily, the processing cost increases and the processing time increases.

  The present invention has been made paying attention to the above-mentioned problems, and its object is to provide an FPD substrate manufacturing method including a wiring repair process by a gas window type laser CVD method, in a laser CVD processing step. The object is to improve the yield of the FPD substrate to be repaired without requiring strict management regarding the thickness, density, etc. of the CVD film, thereby reducing the manufacturing cost.

  Another object of the present invention is to provide an FPD substrate repairing part protective film forming apparatus and an FPD substrate repairing apparatus suitable for carrying out the above-described FPD substrate manufacturing method.

  Other objects and operational effects of the present invention will be easily understood by those skilled in the art by referring to the following description of the specification.

  It is considered that the above technical problem can be solved by a method for manufacturing an FPD substrate having the following configuration.

That is, the manufacturing method of this FPD substrate is:
Using a gas window type laser CVD method, a conductive film portion formed by deposition of a CVD material is formed on the wiring defect portion on the FPD substrate to restore conduction, thereby repairing the wiring defect portion. Wiring defect repair step;
A wiring surface cleaning step of cleaning the wiring surface of the FPD substrate after the wiring defect is repaired by the wiring defect repairing step by a predetermined cleaning method; and the wiring surface cleaning step of cleaning the wiring surface by the wiring surface cleaning step A film body forming step of further forming a film body on the wiring surface of the FPD substrate to form a film body necessary for the next process,
Between the wiring defect repair step and the wiring surface cleaning step,
A predetermined insulating resin is locally applied on the FPD substrate so as to cover only the conductive coating portion formed on the wiring defect portion on the FPD substrate or a minute region including the conductive coating portion. A resin coating step for applying a small amount;
A resin curing step of forcibly curing the insulating resin applied in a small amount locally on the FPD substrate by the resin coating step;
Thereby, prior to the wiring surface cleaning step, a protective film made of the insulating resin is formed only in the wiring defect repairing portion on the FPD substrate or in a minute region including the wiring defect repairing portion.

  According to such a configuration, prior to the wiring surface cleaning step, a protective film made of the insulating resin is formed in only a wiring defect repairing portion on the FPD substrate or in a minute region including the wiring defect repairing portion. Therefore, even if the conductive CVD film portion formed on the wiring defect portion on the FPD substrate does not have sufficient adhesion and is easily peeled off, Since a further insulating protective film is put on the top, even if strong cleaning is performed in the cleaning process located at the subsequent stage, unless the protective film is peeled off, the CVD film part below it Will not peel off. In addition, since the protective film is insulative, the insulating function of the repaired wiring is also achieved, and there is no possibility that the presence of the protective film leads to abnormal circuit operation. In addition, the presence of the protective film makes it unnecessary to strictly control the adhesion of the CVD film.

  Therefore, according to this method, in the FPD substrate manufacturing method including the wiring repair process by the gas window type laser CVD method, the repair is performed without requiring strict management regarding the thickness or density of the CVD film in the laser CVD process. It is possible to improve the yield of the FPD substrate to be manufactured, thereby reducing the manufacturing cost.

  As a preferred embodiment of the above-described method, the amount of resin applied in the resin application step may be as small as 10 pl (picoliter) or less per one wiring defect repairing portion.

  According to such a configuration, when applied to an assumed normal wiring defect, it is possible to sufficiently cover the CVD film that is the wiring repair portion, while the excess insulating resin spreads to the periphery, There is no occurrence of an abnormal circuit operation due to a dielectric change or the like in the peripheral circuit. In particular, when applied to a liquid crystal FPD substrate, the total thickness of the original wiring thickness, the CVD film thickness for repair, and the protective film thickness for prevention of peeling overlaps with the FPD substrate and the color filter plate. There is also an effect that the gap can be within an allowable range.

  As a preferred embodiment of the above-described method, an ink jet printer head may be used for applying a small amount of the insulating resin in the resin applying step.

  There are various options for applying a small amount of insulating resin, such as a dispenser, a dropping needle, etc. Among them, an ink jet printer head has an insulating property suitable for ink jet. In addition, the discharge amount of the ink jet printer head can be easily controlled to such a minute amount, and can be applied while maintaining non-contact with the object to be applied. Even if it is a CVD film in an easy state, it is possible to reliably apply a small amount of necessary insulating resin dropwise onto it. Further, in the case of an ink jet printer, there is an advantage that the tact time when repeating the coating process is relatively short.

  As a preferred embodiment of the above-described method, the ink jet printer head prevents the ink serving as an insulating resin for forming a protective film from being accidentally spilled and scattered from the printer head during movement. The shutter mechanism may be provided.

  According to such a configuration, the ink that becomes the insulating resin for forming the protective film is inadvertently spilled and scattered from the printer head during the movement, so that the insulating resin is attached to unnecessary portions on the wiring surface. Thus, it is possible to prevent the possibility of abnormal circuit operation.

  As a preferred embodiment of the above-described method, the ink jet printer head is movable between a predetermined retreat position and a coating position along the FPD substrate to be processed, and the retreat The position may be provided with a head cleaning mechanism for cleaning the discharge port of the printer head in a non-contact manner by interlocking ink discharge from the printer head with suction of the discharged ink.

  According to such a configuration, when the printer head returns to the retracted position, the ejection of the ink from the printer head and the suction of the ejected ink are interlocked, so that the ejection port of the printer head is made non-conductive. Cleaning by contact prevents clogging of the ink in the printer head, and in addition to being able to keep ink discharge smoothly and constantly, and because of non-contact cleaning, foreign matter adheres to the tip of the printer head during cleaning. Such a risk can also be prevented.

  As a preferred embodiment of the above-described method, the predetermined insulating resin applied in the resin coating step may be an ultraviolet curable resin, and the resin curing step may include an ultraviolet irradiation treatment.

  As an insulating resin, various options such as a resin containing a volatile component and a thermosetting resin can be considered from the viewpoint of early curing. Among them, an ultraviolet curing resin has a short curing time of 2-3 seconds and is cured. The equipment (ultraviolet lamp) is also easy and can be manufactured at low cost.

  In a preferred embodiment of the above-described method, the FPD substrate is an FPD substrate for a transmissive liquid crystal FPD having a color filter plate facing the wiring surface with a predetermined gap, and in the resin coating step The predetermined insulating resin to be applied may be a transparent resin.

  According to such a configuration, since the insulating resin itself is transparent even if the insulating resin spreads on or around the repaired portion (CVD film), it is transparent from the back through the color filter. Even if it is applied to a transmissive liquid crystal FPD, it does not hinder incoming light, and does not cause visual disturbance such as uneven brightness.

  As a preferred embodiment of the above-described method, the thickness of the protective film formed by application of the transparent resin may be 0.5 μm or less.

  According to such a configuration, in particular, when applied to a liquid crystal FPD substrate, the total thickness of the original wiring thickness, the CVD film thickness for repair, and the protective film thickness for preventing peeling is combined with the FPD substrate. There is an effect that it can be within an allowable range with respect to the gap with the color filter plate (a gap of about 2 to 3 μm is required between the TFT substrate and the color filter plate).

  It is considered that the above technical problem can also be solved by an FPD substrate repairing part protective film forming apparatus having the following configuration.

That is, this device
A small amount of a predetermined insulating resin is locally applied on the FPD substrate so as to cover only the conductive coating portion formed on the wiring defect portion on the FPD substrate or a minute region including the conductive coating portion. Resin coating means to perform,
A resin curing means for forcibly curing the insulating resin applied in a small amount locally by the resin coating step,
Thereby, a protective film made of the insulating resin is formed on the wiring defect repairing portion or the minute region including the wiring defect repairing portion on the FPD substrate.

  According to such a configuration, a protective film made of the insulating resin can be formed on the FPD substrate on the fine region including the wiring defect repairing portion or the wiring defect repairing portion. The protective film is formed on the CVD film between the CVD film forming process for wiring repair and the subsequent cleaning process, thereby forming the wiring defect portion on the FPD substrate. Even if the adhesion of the conductive CVD film portion is not sufficient and is easily peeled off, an insulating protective film is further covered on such a conductive CVD film. Even if strong cleaning is performed in the cleaning process located on the stage, the underlying CVD film portion will not be peeled unless the protective film is peeled off. In addition, since the protective film is insulative, the insulating function of the repaired wiring is also achieved, and there is no possibility that the presence of the protective film leads to abnormal circuit operation. In addition, the presence of the protective film makes it unnecessary to strictly control the adhesion of the CVD film.

  Therefore, according to this apparatus, in the manufacturing method of the FPD substrate including the wiring repair process by the gas window type laser CVD method, the repair is performed without requiring strict control regarding the thickness or density of the CVD film in the laser CVD process. It is possible to improve the yield of the FPD substrate to be manufactured, thereby reducing the manufacturing cost.

  It is considered that the above technical problem can be solved also by an FPD substrate repairing device having the following configuration.

That is, this device
A mounting table having a mounting surface for mounting the FPD substrate including the wiring defect to be repaired with the surface requiring repair facing upward;
A support base that is above the mounting surface of the mounting table and is movable to an arbitrary position along the mounting surface;
In the support base,
A wiring repair device for recovering conduction by forming a conductive film portion by deposition of a CVD material on a wiring defect portion on the FPD substrate using a gas window type laser CVD method;
A small amount of a predetermined insulating resin is locally deposited on the FPD substrate so as to cover only the conductive coating portion formed on the wiring defect portion on the FPD substrate or a minute region including the conductive coating portion. An ink jet printer head to be applied;
A curing device for curing an insulating resin that is locally applied in a small amount on the FPD substrate is provided.

  According to such a configuration, the support base is moved so that the wiring repair device, the printer head, and the curing device are sequentially positioned on one wiring defect portion on the FPD substrate. Thus, one or more wiring defect portions included on the FPD substrate can be reliably repaired while the FPD substrate is stationary.

  According to the present invention, a protective film made of the insulating resin is formed prior to the wiring surface cleaning step in only a wiring defect repairing portion on the FPD substrate or a minute region including the wiring defect repairing portion. Even if the conductive CVD film portion formed on the wiring defect portion on the FPD substrate does not have sufficient adhesion and is easily peeled off, Will be covered with an insulating protective film, so even if strong cleaning is performed in the subsequent cleaning process, the underlying CVD film will also peel off unless the protective film is removed. There will be nothing. In addition, since the protective film is insulative, the insulating function of the repaired wiring is also achieved, and there is no possibility that the presence of the protective film leads to abnormal circuit operation. In addition, the presence of the protective film makes it unnecessary to strictly control the adhesion of the CVD film.

  Therefore, according to the present invention, in an FPD substrate manufacturing method including a wiring repair process using a gas window type laser CVD method, the repair is performed without requiring strict management regarding the thickness or density of the CVD film in the laser CVD process. It is possible to improve the yield of the FPD substrate to be manufactured, thereby reducing the manufacturing cost.

1 is an external perspective view of an FPD substrate repair device according to the present invention. It is a flowchart which shows the control content of a FPD board | substrate repair apparatus. It is explanatory drawing of the CVD film deposition process of a FPD board | substrate repair apparatus. It is explanatory drawing of the application | coating process of the insulating resin of a FPD board | substrate repair apparatus. It is explanatory drawing of the insulating resin hardening process of a FPD board | substrate repair apparatus. It is a conceptual diagram which shows the structure of the repairing part protective film production | generation part mounted in a FPD board | substrate repairing apparatus. It is explanatory drawing of the non-contact washing | cleaning mechanism of a printer mechanism. It is explanatory drawing which shows the wiring restoration Example by this invention compared with normal wiring and wiring with a CVD film. It is a graph which shows the height measurement result by a displacement sensor.

  Hereinafter, a preferred embodiment of an FPD substrate manufacturing method including an FPD substrate repair portion protective film forming apparatus and an FPD substrate repair apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

  As described above, the FPD substrate manufacturing method according to the present invention uses a gas window type laser CVD method to form a conductive film portion by depositing a CVD material on a wiring defect portion on the FPD substrate. A wiring defect repairing step for repairing the wiring defect portion by forming a conductive layer, and a wiring surface of the FPD substrate after the wiring defect is repaired by the wiring defect repairing step is subjected to a predetermined cleaning method. A wiring surface cleaning step for cleaning the film, and a film body for forming a film body necessary for the next process by further forming a film on the wiring surface of the FPD substrate after the wiring surface is cleaned by the wiring surface cleaning step. A method of manufacturing an FPD substrate having a forming step, wherein the wiring defect repairing step and the wiring surface cleaning step are performed on the wiring defect portion on the FPD substrate. A resin coating step of locally applying a small amount of a predetermined insulating resin on the FPD substrate so as to cover only the formed conductive film portion or a minute region including the conductive film portion; A resin curing step forcibly curing an insulating resin locally applied in a small amount on the FPD substrate by the step, whereby only a wiring defect repairing portion or a wiring defect repairing portion on the FPD substrate is formed. Prior to the wiring surface cleaning step, a protective film made of the insulating resin is formed in a minute area including the above.

  In the following embodiments, the above-described method is implemented as an FPD substrate repairing apparatus including an FPD substrate repairing part protective film forming device.

  An external perspective view of the FPD substrate repairing apparatus according to the present invention is shown in FIG. As shown in the figure, the FPD board repairing apparatus 1 is arranged in the front-rear direction with the gantry (details will be described later) 3 facing the left and right directions on the mounting table with travel guide (details will be described later) 2. FPD which becomes a processing target with its wiring surface facing upward by making it possible to travel along the gantry 3 along with the gantry 3 so that the support 4 on which various devices for wiring repair are mounted can be traveled. On the substrate, the support table 4 can be XY-scanned.

  The illustrated travel guide-equipped mounting base 2 includes a stone surface plate 201 on which a processing target FPD substrate is placed, and left and right side walls extending in the front-rear direction along left and right side edges on the stone surface plate 201. The guide bases 202 and 203 and two parallel guide rails extending on the left and right guide bases 202 and 203 (that is, two guide rails 204 and 205 on the left guide base 202, And two guide rails 206, 207) on the right guide base 203 and a mount 209 for supporting the stone surface plate 201 via a plurality of vibration isolation mounts 208.

  In addition to the two guide rails 204 and 205, a linear motor stator 210 is attached to the upper surface of the left guide base 202, and a linear scale 211 (not shown) is attached to the outer surface. . Similarly, in addition to the two guide rails 206 and 207, a linear motor stator 212 is attached to the upper surface of the right guide base 203, and a linear scale 213 is attached to the outer surface. The linear scales 211 and 213 read position information by scale readers 214 and 215.

  The illustrated frame 209 is composed of a plurality of leg columns 217 seated on the floor surface via seat plates 216, and an inter-pillar beam 218 that connects adjacent ones of the leg columns 217. Yes. A vibration isolation mount 208 is interposed between the gantry 209 and the stone surface plate 201 so as to correspond to the arrangement of the respective pillars 208. As is well known to those skilled in the art, the anti-vibration mount 208 introduces compressed air to lift the stone surface plate placed thereon with a lifting force corresponding to a preset air pressure. Have.

  The illustrated stone surface plate 201 has a rectangular stone surface plate portion 201a having a predetermined length in the left-right direction and length in the front-rear direction and on which an FPD substrate (not shown) to be processed is placed, and the rectangular shape. It has left and right elongated stone surface plate parts 201b, 201b extending rearward from the left and right sides of the rear end of the stone surface plate part 201a. The left and right guide bases 202 and 203 may extend over the entire length of both sides of the rectangular stone surface plate portion 201a and the left and right elongated stone surface plate portions 201b and 201b extending to the rear thereof. It extends over.

  The relationship between the travel guide-equipped mounting table 2 having the above-described configuration and the gantry 3 will be further described as follows.

  On the left guide base 202, a movable base 301 that is integrated with the linear motor movable element is mounted so as to be able to travel while being guided by the guide rails 204 and 205 by the magnetic force generated between the linear motor and the stator 210. ing. On the right guide base 203, a movable base 302 that is integrated with the linear motor movable element is mounted so as to be able to travel while being guided by the guide rails 206 and 207 by the magnetic force generated between the linear motor and the stator 212. Has been.

  A portal beam member (hereinafter referred to as “gantry beam”) 303 is mounted between the left movable table 301 and the right movable table 302 in a state of being bridged in the left-right direction. A guide rail 304 and a linear motor stator 305 are extended on the side surface of the gantry beam 303, and two guide rails 306 and 307 and a linear motor stator 308 that are parallel to each other are extended on the upper surface.

  On the gantry beam 303, a movable base 309 that is integrated with the movable element of the linear motor is mounted so as to be able to run while being guided by the guide rails 304, 306, and 307 by the magnetic force generated between the stator 305 and 308. ing. The movable table 309 can be mounted with a substrate repair support 4 including various wiring repair devices.

  As described above, the FPD board repairing apparatus 1 mounts the gantry 3 on the mounting table 2 with the travel guide so that the gantry 3 can run in the front-rear direction and in the left-right direction. By making the support base 4 for traveling in the left-right direction, the support base 4 for substrate repair can be XY-scanned on the FPD substrate to be processed.

  Next, the wiring defect repair device 5 and the protective film forming device 6 mounted on the support 4 will be described with reference to FIGS.

  As shown in FIGS. 3 and 5, a wiring defect repair device for performing a wiring defect repair process by a gas window type laser CVD method on the support base 4 (in the vicinity of the lower end of the front surface in this example). 5 and a protective film forming apparatus 6 for performing a protective film forming process according to the present invention are attached.

  The wiring defect repairing device 5 is known from various documents, and in short, includes a gas window 51, a gas supply / discharge management unit 52, and a laser irradiation optical system 53.

  Although the gas window 51 is shown in a flat plate shape in the drawing, it is actually configured as a cap-like structure having a lower surface opened and a glass window for laser light incidence on the upper surface.

  The gas supply / exhaust management unit 52 introduces purge gas into the gas window 51 and evacuates the gas appropriately, thereby blocking the inside of the gas window 51 from the outside and the inside of the CVD material (metal, conductive). This is for generating a CVD source gas atmosphere around a wiring defect portion in the gas window 51 by introducing a CVD source gas containing a conductive resin and the like and appropriately exhausting it.

  The laser irradiation optical system 53 introduces laser light obtained from a laser light source (not shown) from the laser light incident window on the upper surface of the gas window 51 into the gas window 51, and irradiates the wiring defect portion with this. As a result, the surrounding source gas is decomposed, a CVD film is deposited on the wiring defect portion, and the conduction of the wiring defect portion is recovered.

  3 to 5, reference numeral 82 indicates a CVD film formed in this manner with a slight exaggeration.

  On the other hand, the protective film forming apparatus 6, which is a main part of the present invention, includes an ink jet printer head 63, an ultraviolet irradiation lamp 64, and a shutter plate 65. These elements 63 to 65 are mounted on a support frame 61 that can be moved up and down along the guide rail 62. The support frame 61 is moved up and down along the guide rail 62 by a drive mechanism (not shown).

The ink jet type printer head 63 is attached to the support frame 61 with its ink discharge nozzle facing downward, and a minimum amount of 6 pl (picoliter) can be applied. As such an ink jet type printer head 63, an industrial printer head used for a large-scale printed matter (for example, a large-scale signboard or a package) can be used as it is. In this example, a transparent ultraviolet curable resin having an electric resistance value of 10 ⁵ Ω or more and a viscosity of ⁵ to 15 mPa · s is used as the ink used.

  The ultraviolet irradiation lamp 64 is on the support frame 61 and is attached to the right side of the ink jet printer head 63, and the ultraviolet irradiation direction is downward. The intensity of the ultraviolet light from the ultraviolet irradiation lamp 64 is selected so as to cure the ink made of the ultraviolet curable resin coated on the target liquid crystal FPD substrate P within a few seconds.

  As shown by an arrow 67 in FIG. 6, the shutter plate 65 has a first position that completely closes the nozzle front side of the printer head 63 via the shutter mechanism (schematic diagram) 66, and the nozzle front side of the printer head 63. It is possible to arbitrarily move between the second position without blocking. Therefore, by setting the shutter plate 65 to the first position, even if ink leaks from the tip of the nozzle of the printer head 63 due to vibration during movement of the printer head 63, impact when stopped, or the like, this is below it. Scattering on the FPD substrate P is reliably prevented. On the other hand, by setting the shutter plate 65 to the second position, it is possible to perform a desired small amount of ink application without any trouble.

  Next, an explanatory diagram of the non-contact cleaning mechanism of the printer head is shown in FIG. As described above, the support 4 on which the wiring defect repair device 5 and the protective film forming device 6 are mounted moves in the left-right direction along the gantry beam 303. A non-contact cleaning mechanism for the printer head is provided at one of the left and right ends or both ends of the gantry beam 303 (that is, the retracted position of the printer head 63).

  The non-contact cleaning mechanism is a head heating mechanism that heats the printer head to promote ink flow, an ink pressurization supply mechanism that supplies pressurized ink to the printer head, and a discharge from the printer head. And an ink suction mechanism that forcibly sucks ink.

  As shown in FIG. 7, the head heating mechanism supplies hot water at a predetermined temperature to a heat exchanger (not shown) in the printer head 63 via a hot water outgoing pipe 77c and a hot water return pipe 77d. A hot water circulation device 74 to be supplied is included. As a result, the temperature of the printer head 63 is always kept at a temperature at which the flow state of the ink is maintained.

  The ink pressurization supply mechanism includes an ink storage tank 73 for storing ink, a pressurized air pipe 77a for supplying compressed air to the ink storage tank 73, and pressurized ink pushed out from the ink storage tank 73 by a printer. An ink supply pipe 77b that supplies the head 63 is included. Incidentally, 75 is a pressure regulator for keeping the pressure of the compressed air at a constant pressure, and 76 is a three-way valve for opening and closing the compressed air. As a result, pressurized ink is supplied to the printer head 63.

  The ink suction mechanism is disposed opposite to the front surface of the nozzle of the printer head 63 with an appropriate distance, and has an ink suction opening 71 for forcibly sucking the ink ejected from the nozzle of the printer head 63, and the suction. A waste liquid storage tank 72 for storing the discharged ink, a vacuum suction pipe 77f for vacuum suction of the waste liquid storage tank 72, and an ink suction pipe 77e for guiding the ink sucked through the ink suction opening 71 to the waste liquid storage tank 72 It is comprised including. For this reason, by ejecting ink from the printer head 63 and suctioning the ejected ink, the ejection ports of the printer head 63 can be cleaned in a non-contact manner.

  In other words, in a normal cleaning mechanism that wipes the discharge port of the printer head, there is a risk that foreign matter will adhere to the tip of the nozzle of the printer head or sufficient cleaning will not be performed. According to the novel non-contact cleaning mechanism, such cleaning is performed in a non-contact manner, and ink is sucked while forced ink discharge from the printer head 63 is performed. It becomes possible to wash.

  The operation of the non-contact cleaning mechanism of the printer head may be sufficient to be performed every time the printer head returns from the application position to the retracted position or once every several times.

  Next, the operation of the FPD substrate repair apparatus 1 having the above configuration is shown in the flowchart of FIG. 2, the process explanatory diagrams of FIGS. 3 to 5, the embodiment explanatory diagram of FIG. 8, and the height measurement result of FIG. This will be described in detail with reference to the graph.

  A flowchart showing an outline of the software configuration of the FPD board repairing apparatus is shown in FIG.

  First, the liquid crystal FPD substrate P to be repaired is placed on the rectangular stone surface plate portion 201a of the stage 2 with the traveling guide with the surface to be repaired facing upward (FIGS. 1 and 2). 3).

  Next, a CVD film forming process (step 101) is performed. In this CVD film forming process (step 101), the aim of repairing the wiring defect repairing device 5 is targeted by driving the linear motor on the support base 4 on which the wiring defect repairing device 5 and the protective film forming device 6 are mounted. Move to a position directly above the wiring defect position. During this movement, the shutter plate 65 of the protective film forming apparatus 6 is maintained in a closed state, so that the ink is scattered from the printer head 63 even when there is vibration during movement or impact when stopped. There is nothing.

  After that, using a gas window type laser CVD method, a wiring repair process is performed to restore the conduction by forming a conductive film portion by deposition of CVD material on the wiring defect portion on the FPD substrate P. Is done. Reference numeral 82 shows the CVD film thus formed in a slightly exaggerated manner.

  The CVD film 82 formed in this way often has a thin film thickness, cracks, or a low density unless the management of the irradiated laser beam and the management of the gas sucked and exhausted are performed properly. As a result, a state in which peeling easily occurs occurs. For this reason, conventionally, in the subsequent cleaning process, the CVD film 82 formed with great effort is peeled off, and such a liquid crystal FPD substrate P has to be disposed of. On the other hand, in the present invention, since a protective film forming process described later exists, even such a fragile CVD film 82 can sufficiently withstand the subsequent cleaning process.

  When the CVD film forming process (step 101) is completed in this way, the moving process to the protective film application position (step 102) is subsequently executed. In the movement process to the protective film application position (step 102), as shown by an arrow 41 in FIG. 3, the support 4 is moved rightward by driving the linear motor, as shown in FIG. Then, the printer head 63 of the protective film forming apparatus 6 is stopped at a position located just above the CVD film 82 that has been repaired. Of course, the shutter plate 65 is kept closed during this movement.

  Thus, when the movement process to the protective film application position (step 102) is completed, the shutter opening process (step 103) is subsequently executed. In this shutter opening process (step 103), by driving a shutter mechanism 66 (not shown), the shutter plate 65 is moved to the second position, that is, the position where the front of the nozzles of the printer head 63 is opened. Move. As a result, the ink ejected from the printer head 63 is ready to be applied onto the CVD film 82 on the liquid crystal FPD substrate P.

  Thus, when the shutter opening process (step 103) is completed, the ink jet head lowering process (step 104) is subsequently executed. In this ink jet head lowering process (step 104), a driving mechanism (not shown) is operated to lower the support frame 61, so that the distance from the printer head 63 to the FPD substrate P, which is a printing object, becomes 1 to 2 mm. To approach. The meaning of bringing the printer head 63 close to the object in this way is to prevent the fine ink droplets from deviating from the target position due to the airflow in the printing environment. That is, in this coating process, fine ink droplets of 10 pl (picoliters) or less are used, and therefore the coating position may be deviated from the target position even in the presence of a slight air flow. Is meaningful.

  Thus, when the ink jet head lowering process (step 104) is completed, the protective film coating process (step 105) is subsequently executed. In this protective film coating process (step 105), as described above, a small amount of ink droplets of 10 pl or less are used to cover a predetermined region including the CVD film portion, and an ink made of a transparent ultraviolet curable resin is used. Apply. The ink applied in this manner adheres with a slight extent of spread around the CVD film 82 formed in the disconnected portion. As will be described later, this is cured to become a protective film 83 for the CVD film 82. Note that reference numeral 83a shows an ink drop made of a transparent insulating ultraviolet curable resin discharged (dropped) from the printer head 63 in a slightly exaggerated manner.

  When the protective film application process (step 105) is completed in this way, the inkjet head raising process (step 106) is subsequently executed. In the ink jet head raising process (step 106), the support frame 61 is raised by operating a drive mechanism (not shown) to return the printer head 63 to a predetermined height. During the subsequent movement, the tip of the printer head 63 is moved. Care is taken not to get caught on any convex part of the liquid crystal FPD substrate P.

  In this way, when the inkjet head raising process (step 106) is completed, the shutter closing process (step 107) is subsequently executed. In this shutter closing process (step 107), the shutter plate 65 is closed at the first position, that is, in front of the nozzles of the printer head 63 by the shutter plate 65. Even if ink spills from 63, it returns to a position where it does not scatter on the liquid crystal FPD substrate P.

  In this way, when the shutter closing process (step 107) is completed, the movement process to the UV curing position (step 108) is subsequently executed. In the movement process to the UV curing position (step 108), the support 4 is moved to the left in the figure as shown by the arrow 42 by driving the linear motor, and the coating is applied as shown in FIG. The ultraviolet irradiation lamp 64 is stopped in a state where the ultraviolet irradiation lamp 64 is positioned immediately above the protective film 83 which is the insulating film.

  When the movement process to the UV curing position (step 108) is thus completed, the UV curing process (step 109) is subsequently executed. In this UV curing process (step 109), the ultraviolet irradiation lamp 64 is turned on for a predetermined short time to irradiate the insulating film 83 just formed with ultraviolet rays. When about 1 to 2 seconds elapses due to the irradiation of the ultraviolet rays, the ultraviolet curable resin is cured, and the insulating coating made of the ultraviolet curable resin becomes a strong protective film 83.

  The protective film 83 formed in this manner is extremely strong and firmly adhered to the surface of the FPD substrate P. Therefore, even if a strong cleaning process is performed thereafter, the adhesion state with the liquid crystal FPD substrate P is maintained. Thus, the CVD film 82 formed at the disconnection portion can be strongly protected without being peeled off.

  Therefore, the conductive coating 82 by the gas window type laser CVD method by the wiring defect repairing device 5 is fragile because it is thin, cracked, or has a low density, so that it is easily peeled off as it is. Even in such a case, since the CVD film 82 is prevented from being peeled off by the protective film 83 placed thereon, in the end, in the gas window type laser CVD method in the wiring defect repairing apparatus 5, laser irradiation or Even if the gas management is not strict, the yield of the repaired substrate is not impaired, and the manufacturing cost can be reduced.

  Next, FIG. 8 shows an explanatory diagram showing a wiring repairing example according to the present invention in comparison with normal wiring and wiring with a CVD film, and FIG. 9 shows a graph showing the height measurement results of those wirings by a displacement sensor. ing.

  In FIG. 8A, 81 is a wiring portion, 82 is a CVD film deposited on the disconnected portion of the wiring, and 83 is a protective film formed thereon so as to cover the CVD film portion. Further, a indicates a state in which a CVD correction film is deposited, b indicates a state of a normal FPD wiring, and c indicates a state in which a protective film is deposited on the CVD correction film.

  As is apparent from the figure, the protective film 83 according to the present invention spreads in a substantially oval shape over a very small region including the CVD correction film 82, but a sufficient distance is ensured between adjacent wirings. The reason why such local application is possible is that an ink jet printer head is used and the application amount is limited to 10 pl (picoliter) or less.

  Further, as shown in FIG. 5B, the protective film 83 applied in this way is transparent, so that even if light is applied from behind, the transparent film 83 is maintained in a transparent state, and the luminance in the transmissive FPD There is no risk of unevenness.

  Further, as shown in FIG. 9, the film thickness of the protective film 83 is about 0.25 μm, as is apparent from the comparison between FIG. (0.5 μm or less). As a result, the height from the substrate surface to the top of the protective film is about 1.1 μm, which ensures a sufficient distance of 2 to 3 μm between the TFT substrate and the CF (color filter) substrate. The provision of such a protective film does not hinder the driving of the liquid crystal.

  In the above embodiment, a transparent resin is used as the material of the protective film 83. However, if a self-luminous FPD such as a PDP or an organic EL is targeted, the protective film is not necessarily transparent. There will be no.

  In the above embodiment, the ultraviolet curable resin is used as the material of the protective film that can be forcibly cured. However, it can be forcibly cured by a heat source such as a halogen lamp instead of the thermosetting resin.

  In the above embodiment, an ink jet printer head is used as a means for applying a small amount of the protective film. However, as the minute amount applying means, liquid is dropped one by one through a known dispenser or needle. You may use the dripping needle made.

  In the above embodiment, the present invention is applied to the liquid crystal FPD substrate. However, it is needless to say that the present invention can be applied to other FPD substrates such as a plasma FPD substrate, an organic EL FPD substrate, and the like.

  The present invention is formed for wiring repair in an FPD substrate manufacturing method such as a liquid crystal display substrate, a plasma display substrate, etc., and in particular, an FPD substrate manufacturing method including wiring repair processing by a gas window type CVD method. It can be used for preventing peeling in the subsequent cleaning step of the conductive CVD film.

DESCRIPTION OF SYMBOLS 1 FPD board | substrate repair apparatus 2 Mounting stand with a travel guide 3 Gantry 4 Panel repair support base 5 Wiring defect repair apparatus 6 Protection film formation apparatus 7 Non-contact cleaning mechanism 41, 42 The arrow which shows the moving direction of the support base 51 Gas window 52 Gas supply / discharge management unit 53 Laser irradiation optical system 61 Support frame 62 Guide rail 63 Inkjet printer head 64 Ultraviolet irradiation lamp 65 Shutter plate 66 Shutter mechanism 67 Arrow indicating the moving direction of the shutter plate 71 Ink suction opening 72 Waste liquid storage tank 73 Ink storage tank 74 Hot water circulation device 75 Pressure adjustment period 76 Three-way valve 77a Pressure air pipe 77b Ink supply pipe 77c Hot water forward pipe 77d Hot water return pipe 77e Ink suction pipe 77f Vacuum suction pipe 81 Wiring part 82 CVD coating (for disconnection repair)
83 Protective film 83a Ink droplet 201 Stone surface plate 201a Rectangular stone surface plate portion 201b Elongated stone surface plate portion 202, 203 Guide base 204, 205 Guide rail 206, 207 Guide rail 208 Anti-vibration mount 209 Base 210 Linear motor stator 212 Linear motor stator 213 Linear scale 215 Scale reader 216 Seat plate 217 Leg column 218 Beam between legs 301, 302 Movable base 304 Guide rail 305 Stator 306, 307 Guide rail 308 Stator 309 Movable base P Liquid crystal FPD substrate a CVD Film formation part b Normal wiring part c Protective film deposition part

Claims (10)

Using a gas window type laser CVD method, a conductive film portion formed by deposition of a CVD material is formed on the wiring defect portion on the FPD substrate to restore conduction, thereby repairing the wiring defect portion. Wiring defect repair step;
A wiring surface cleaning step of cleaning the wiring surface of the FPD substrate after the wiring defect is repaired by the wiring defect repairing step by a predetermined cleaning method;
A film body forming step of performing a film forming process on the wiring surface of the FPD substrate after the wiring surface is cleaned by the wiring surface cleaning step to form a film body necessary for the next process. A method,
Between the wiring defect repair step and the wiring surface cleaning step,
A predetermined insulating resin is locally applied on the FPD substrate so as to cover only the conductive coating portion formed on the wiring defect portion on the FPD substrate or a minute region including the conductive coating portion. A resin coating step for applying a small amount;
A resin curing step of forcibly curing the insulating resin applied in a small amount locally on the FPD substrate by the resin coating step;
Thereby, a protective film made of the insulating resin is formed prior to the wiring surface cleaning step in only a wiring defect repairing portion or a minute region including the wiring defect repairing portion on the FPD substrate. A method for manufacturing a substrate. 2. The method of manufacturing an FPD substrate according to claim 1, wherein the amount of the resin applied in the resin application step is a very small amount of 10 pl or less per one wiring defect repairing portion. 3. The method of manufacturing an FPD substrate according to claim 2, wherein an ink jet printer head is used for applying a small amount of the insulating resin in the resin application step. The ink jet printer head is provided with a shutter mechanism for preventing ink that becomes an insulating resin for forming a protective film from being accidentally spilled and scattered from the printer head during movement. The manufacturing method of the FPD board | substrate of Claim 3 characterized by the above-mentioned. The ink jet printer head is movable between a predetermined retreat position and a coating position along the FPD substrate to be processed, and the ink discharge from the printer head is at the retreat position. The FPD substrate according to claim 3, further comprising: a head cleaning mechanism for cleaning the discharge port of the printer head in a non-contact manner by interlocking with suction of the ejected ink. Manufacturing method. The predetermined insulating resin applied in the resin application step is an ultraviolet curable resin, and the resin curing step includes an ultraviolet irradiation treatment. FPD substrate manufacturing method. The FPD substrate is an FPD substrate for a transmissive liquid crystal FPD having a color filter plate facing the wiring surface with a predetermined gap, and the predetermined insulating resin applied in the resin applying step is a transparent resin. The method for producing an FPD substrate according to claim 1, wherein The method for manufacturing an FPD substrate according to claim 7, wherein a film thickness of the protective film formed by applying the transparent resin is 0.5 μm or less. A small amount of a predetermined insulating resin is locally applied on the FPD substrate so as to cover only the conductive coating portion formed on the wiring defect portion on the FPD substrate or a minute region including the conductive coating portion. Resin coating means to perform,
A resin curing means for forcibly curing the insulating resin applied in a small amount locally by the resin coating step,
Thereby, a protective film forming apparatus for a repaired part of an FPD substrate, wherein a protective film made of the insulating resin is formed on a wiring defect repairing part or a minute region including the wiring defect repairing part on the FPD board . A mounting table having a mounting surface for mounting the FPD substrate including the wiring defect to be repaired with the surface requiring repair facing upward;
A support base that is above the mounting surface of the mounting table and is movable to an arbitrary position along the mounting surface;
In the support base,
A wiring repair device for recovering conduction by forming a conductive film portion by deposition of a CVD material on a wiring defect portion on the FPD substrate using a gas window type laser CVD method;
A small amount of a predetermined insulating resin is locally applied on the FPD substrate so as to cover only the conductive coating portion formed on the wiring defect portion on the FPD substrate or a minute region including the conductive coating portion. An ink jet printer head to be applied;
An apparatus for repairing an FPD substrate, comprising: a curing device for curing an insulating resin that is locally applied in a small amount on the FPD substrate.

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