JP2007178885A - パターンおよび配線パターンならびにそれらの製造法 - Google Patents

パターンおよび配線パターンならびにそれらの製造法 Download PDF

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Publication number
JP2007178885A
JP2007178885A JP2005379508A JP2005379508A JP2007178885A JP 2007178885 A JP2007178885 A JP 2007178885A JP 2005379508 A JP2005379508 A JP 2005379508A JP 2005379508 A JP2005379508 A JP 2005379508A JP 2007178885 A JP2007178885 A JP 2007178885A
Authority
JP
Japan
Prior art keywords
photosensitive resin
resin composition
coating layer
surface coating
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005379508A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007178885A5 (enExample
Inventor
Tatsuro Nagahara
原 達 郎 長
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AZ Electronic Materials Japan Co Ltd
Original Assignee
AZ Electronic Materials Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AZ Electronic Materials Japan Co Ltd filed Critical AZ Electronic Materials Japan Co Ltd
Priority to JP2005379508A priority Critical patent/JP2007178885A/ja
Priority to TW095143669A priority patent/TWI420569B/zh
Priority to US11/640,748 priority patent/US20070148591A1/en
Priority to KR1020060136637A priority patent/KR20070070125A/ko
Publication of JP2007178885A publication Critical patent/JP2007178885A/ja
Publication of JP2007178885A5 publication Critical patent/JP2007178885A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Materials For Photolithography (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electroluminescent Light Sources (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2005379508A 2005-12-28 2005-12-28 パターンおよび配線パターンならびにそれらの製造法 Pending JP2007178885A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005379508A JP2007178885A (ja) 2005-12-28 2005-12-28 パターンおよび配線パターンならびにそれらの製造法
TW095143669A TWI420569B (zh) 2005-12-28 2006-11-27 圖案及配線圖案與彼等之製法
US11/640,748 US20070148591A1 (en) 2005-12-28 2006-12-18 Pattern and wiring pattern and processes for producing them
KR1020060136637A KR20070070125A (ko) 2005-12-28 2006-12-28 패턴 및 배선 패턴과 이들의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005379508A JP2007178885A (ja) 2005-12-28 2005-12-28 パターンおよび配線パターンならびにそれらの製造法

Publications (2)

Publication Number Publication Date
JP2007178885A true JP2007178885A (ja) 2007-07-12
JP2007178885A5 JP2007178885A5 (enExample) 2008-01-31

Family

ID=38194244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005379508A Pending JP2007178885A (ja) 2005-12-28 2005-12-28 パターンおよび配線パターンならびにそれらの製造法

Country Status (4)

Country Link
US (1) US20070148591A1 (enExample)
JP (1) JP2007178885A (enExample)
KR (1) KR20070070125A (enExample)
TW (1) TWI420569B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011505588A (ja) * 2007-11-20 2011-02-24 イーストマン コダック カンパニー シロキサンを含有するフォトパターン化可能な堆積阻害材料

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120288697A1 (en) * 2011-05-13 2012-11-15 Xerox Corporation Coating methods using silver nanoparticles
TWI617629B (zh) * 2013-05-01 2018-03-11 Jsr股份有限公司 具有凹圖案的基材的製造方法、組成物、導電膜的形成方法、電子電路及電子元件
CN113903873B (zh) 2020-06-22 2023-04-07 京东方科技集团股份有限公司 量子点发光面板、显示装置和制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02254449A (ja) * 1989-03-29 1990-10-15 Konica Corp 湿し水不要の平版印刷版材料
JP2000181069A (ja) * 1998-10-05 2000-06-30 Tonen Corp 感光性ポリシラザン組成物及びパタ―ン化されたポリシラザン膜の形成方法
JP2002243931A (ja) * 2001-02-19 2002-08-28 Canon Inc ブラックマトリクス基板、カラーフィルタ及びその製造方法、液晶素子

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2574180B1 (fr) * 1984-12-04 1987-02-13 Centre Nat Rech Scient Procede et dispositif pour determiner l'angle de contact d'une goutte de liquide posee sur un substrat horizontal solide ou liquide
US4770974A (en) * 1986-09-18 1988-09-13 International Business Machines Corporation Microlithographic resist containing poly(1,1-dialkylsilazane)
JP3238369B2 (ja) * 1998-04-10 2001-12-10 ソニーケミカル株式会社 フォトレジスト用組成物、及びフレキシブルプリント配線板の製造方法
US6790587B1 (en) * 1999-05-04 2004-09-14 E. I. Du Pont De Nemours And Company Fluorinated polymers, photoresists and processes for microlithography
JP3742861B2 (ja) * 2000-08-29 2006-02-08 ダイキン工業株式会社 硬化性含フッ素ポリマー、それを用いた硬化性樹脂組成物および反射防止膜
DE60315824T2 (de) * 2002-03-22 2008-05-15 Mitsubishi Heavy Industries, Ltd. Verfahren zur regenerierung einer lithographischen druckplatte
EP1560070B1 (en) * 2002-10-09 2009-12-30 Nissan Chemical Industries, Ltd. Composition for forming antireflection film for lithography
TWI258635B (en) * 2002-11-27 2006-07-21 Tokyo Ohka Kogyo Co Ltd Undercoating material for wiring, embedded material, and wiring formation method
JP4192737B2 (ja) * 2003-07-15 2008-12-10 セイコーエプソン株式会社 層パターン製造方法、配線製造方法、電子機器の製造方法
JP4697406B2 (ja) * 2004-08-05 2011-06-08 信越化学工業株式会社 高分子化合物，レジスト保護膜材料及びパターン形成方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02254449A (ja) * 1989-03-29 1990-10-15 Konica Corp 湿し水不要の平版印刷版材料
JP2000181069A (ja) * 1998-10-05 2000-06-30 Tonen Corp 感光性ポリシラザン組成物及びパタ―ン化されたポリシラザン膜の形成方法
JP2002243931A (ja) * 2001-02-19 2002-08-28 Canon Inc ブラックマトリクス基板、カラーフィルタ及びその製造方法、液晶素子

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011505588A (ja) * 2007-11-20 2011-02-24 イーストマン コダック カンパニー シロキサンを含有するフォトパターン化可能な堆積阻害材料

Also Published As

Publication number Publication date
US20070148591A1 (en) 2007-06-28
TW200731341A (en) 2007-08-16
KR20070070125A (ko) 2007-07-03
TWI420569B (zh) 2013-12-21

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