JP2007149995A - 積層型圧電素子及びその製造方法 - Google Patents

積層型圧電素子及びその製造方法 Download PDF

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Publication number
JP2007149995A
JP2007149995A JP2005342915A JP2005342915A JP2007149995A JP 2007149995 A JP2007149995 A JP 2007149995A JP 2005342915 A JP2005342915 A JP 2005342915A JP 2005342915 A JP2005342915 A JP 2005342915A JP 2007149995 A JP2007149995 A JP 2007149995A
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JP
Japan
Prior art keywords
electrode layer
piezoelectric
layer
electrode
piezoelectric element
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Withdrawn
Application number
JP2005342915A
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English (en)
Japanese (ja)
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JP2007149995A5 (enExample
Inventor
Satoru Miyoshi
哲 三好
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Fujifilm Corp
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Fujifilm Corp
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Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Priority to JP2005342915A priority Critical patent/JP2007149995A/ja
Priority to US11/604,699 priority patent/US20070120448A1/en
Publication of JP2007149995A publication Critical patent/JP2007149995A/ja
Priority to US12/126,459 priority patent/US7765660B2/en
Publication of JP2007149995A5 publication Critical patent/JP2007149995A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
JP2005342915A 2005-11-28 2005-11-28 積層型圧電素子及びその製造方法 Withdrawn JP2007149995A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005342915A JP2007149995A (ja) 2005-11-28 2005-11-28 積層型圧電素子及びその製造方法
US11/604,699 US20070120448A1 (en) 2005-11-28 2006-11-28 Multilayered piezoelectric element and method of manufacturing the same
US12/126,459 US7765660B2 (en) 2005-11-28 2008-05-23 Method of manufacturing a multilayered piezoelectric element having internal electrodes and side electrodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005342915A JP2007149995A (ja) 2005-11-28 2005-11-28 積層型圧電素子及びその製造方法

Publications (2)

Publication Number Publication Date
JP2007149995A true JP2007149995A (ja) 2007-06-14
JP2007149995A5 JP2007149995A5 (enExample) 2008-08-28

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JP2005342915A Withdrawn JP2007149995A (ja) 2005-11-28 2005-11-28 積層型圧電素子及びその製造方法

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US (2) US20070120448A1 (enExample)
JP (1) JP2007149995A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009246253A (ja) * 2008-03-31 2009-10-22 Fujifilm Corp 積層型圧電素子及びその製造方法
JP2015527746A (ja) * 2012-10-15 2015-09-17 コンチネンタル オートモーティヴ ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｏｎｔｉｎｅｎｔａｌ Ａｕｔｏｍｏｔｉｖｅ ＧｍｂＨ スタックとしての電子的な構成素子を製造する方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4593912B2 (ja) * 2003-12-24 2010-12-08 京セラ株式会社 積層型圧電素子およびその製法、並びに噴射装置
DE102008029185A1 (de) * 2008-06-19 2009-12-24 Epcos Ag Piezoelektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Kontaktes
CN102813549B (zh) * 2012-08-27 2014-11-05 杭州电子科技大学 用于超声手术器械的高功率密度压电换能器
CN103258950A (zh) * 2013-05-14 2013-08-21 三星高新电机（天津）有限公司 压电陶瓷元件
DE102013114016A1 (de) * 2013-12-13 2015-06-18 Bürkert Werke GmbH Verfahren zur Herstellung eines Piezostapels
JP2017162956A (ja) * 2016-03-09 2017-09-14 株式会社村田製作所 電子部品及びその製造方法
JP6728260B2 (ja) * 2018-03-22 2020-07-22 株式会社東芝 積層型超音波トランスデューサ及び超音波検査装置
JP6863328B2 (ja) * 2018-04-04 2021-04-21 Tdk株式会社 圧電素子及び振動デバイス
SE545844C2 (en) * 2022-10-17 2024-02-20 Precibeo Ab A drive element with two separate monolithic actuators for an electromechanical motor
US20240113063A1 (en) * 2022-09-30 2024-04-04 Texas Instruments Incorporated Radiator layers for ultrasonic transducers
CN119779539A (zh) * 2024-12-25 2025-04-08 宁波大学 一种基于阵列式pvdf的压电三维力触觉传感器

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JPH10290031A (ja) * 1997-04-11 1998-10-27 Nissan Motor Co Ltd 積層型圧電アクチュエータおよびその製造方法
JP2003503859A (ja) * 1999-06-23 2003-01-28 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ディーゼル噴射装置のためのき裂ストッパを備えた圧電多層アクチュエータ及びこの圧電多層アクチュエータを製造する方法
JP2004095593A (ja) * 2002-08-29 2004-03-25 Kyocera Corp 積層型圧電素子及び噴射装置
JP2004186507A (ja) * 2002-12-04 2004-07-02 Denso Corp 積層型圧電素子及びその製造方法
JP2004260136A (ja) * 2003-02-05 2004-09-16 Denso Corp 積層型圧電素子及びその製造方法
JP2005101577A (ja) * 2003-09-01 2005-04-14 Fuji Photo Film Co Ltd 積層構造体及び圧電アクチュエータ、並びに、それらの製造方法
JP2005235878A (ja) * 2004-02-18 2005-09-02 Fuji Photo Film Co Ltd 積層構造体及びその製造方法
JP2005294472A (ja) * 2004-03-31 2005-10-20 Nec Electronics Corp 半導体装置、半導体ウェーハ、およびこれらの製造方法

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US4803763A (en) * 1986-08-28 1989-02-14 Nippon Soken, Inc. Method of making a laminated piezoelectric transducer
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JPH03224281A (ja) 1990-01-30 1991-10-03 Toyota Motor Corp 圧電積層体の製造方法
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JP3929858B2 (ja) 2002-09-04 2007-06-13 京セラ株式会社 積層型圧電素子
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JP4729260B2 (ja) * 2004-02-18 2011-07-20 富士フイルム株式会社 積層構造体及びその製造方法
JP2006093449A (ja) * 2004-09-24 2006-04-06 Fuji Photo Film Co Ltd 積層構造体及び積層構造体アレイ、並びに、それらの製造方法
JP2006093448A (ja) * 2004-09-24 2006-04-06 Fuji Photo Film Co Ltd 積層構造体及び積層構造体アレイ、並びに、それらの製造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10290031A (ja) * 1997-04-11 1998-10-27 Nissan Motor Co Ltd 積層型圧電アクチュエータおよびその製造方法
JP2003503859A (ja) * 1999-06-23 2003-01-28 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング ディーゼル噴射装置のためのき裂ストッパを備えた圧電多層アクチュエータ及びこの圧電多層アクチュエータを製造する方法
JP2004095593A (ja) * 2002-08-29 2004-03-25 Kyocera Corp 積層型圧電素子及び噴射装置
JP2004186507A (ja) * 2002-12-04 2004-07-02 Denso Corp 積層型圧電素子及びその製造方法
JP2004260136A (ja) * 2003-02-05 2004-09-16 Denso Corp 積層型圧電素子及びその製造方法
JP2005101577A (ja) * 2003-09-01 2005-04-14 Fuji Photo Film Co Ltd 積層構造体及び圧電アクチュエータ、並びに、それらの製造方法
JP2005235878A (ja) * 2004-02-18 2005-09-02 Fuji Photo Film Co Ltd 積層構造体及びその製造方法
JP2005294472A (ja) * 2004-03-31 2005-10-20 Nec Electronics Corp 半導体装置、半導体ウェーハ、およびこれらの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009246253A (ja) * 2008-03-31 2009-10-22 Fujifilm Corp 積層型圧電素子及びその製造方法
JP2015527746A (ja) * 2012-10-15 2015-09-17 コンチネンタル オートモーティヴ ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｏｎｔｉｎｅｎｔａｌ Ａｕｔｏｍｏｔｉｖｅ ＧｍｂＨ スタックとしての電子的な構成素子を製造する方法

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Publication number Publication date
US20070120448A1 (en) 2007-05-31
US7765660B2 (en) 2010-08-03
US20080222866A1 (en) 2008-09-18

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