JP6728260B2 - 積層型超音波トランスデューサ及び超音波検査装置 - Google Patents
積層型超音波トランスデューサ及び超音波検査装置 Download PDFInfo
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- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/26—Arrangements for orientation or scanning by relative movement of the head and the sensor
- G01N29/262—Arrangements for orientation or scanning by relative movement of the head and the sensor by electronic orientation or focusing, e.g. with phased arrays
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- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0207—Driving circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
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- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0611—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements in a pile
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/221—Arrangements for directing or focusing the acoustical waves
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
- G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
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- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
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- Ceramic Engineering (AREA)
- Acoustics & Sound (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
図1は第1の実施形態の積層型超音波トランスデューサを示す斜視図である。図1に示す積層型超音波トランスデューサ1は、積層された複数の振動子2を有する積層振動子3を備えている。図1に示す積層振動子3は、順に積層された9層の振動子2A、2B…2Iを有している。積層振動子3の最外層に配置された2つの振動子2A、2Iの外側露出面には、外部電極4が設けられている。すなわち、振動子2Aの下面には第1の外部電極4Aが設けられ、振動子2Iの上面には第2の外部電極4Bが設けられている。
次に、第2の実施形態の積層型超音波トランスデューサ30について、図6ないし図9を参照して説明する。ここで、第1の実施形態に示したように、積層型超音波トランスデューサの振動子の層数は、奇数にすることが一般的である。振動子の層数を偶数にするためには、内部電極の取り出しに工夫が必要である。図6に示す第2の実施形態の積層型超音波トランスデューサ30Aにおいて、積層振動子3は順に積層された4層の振動子2A、2B、2C、2Dを有している。積層振動子3の最上層、すなわち振動子2Dの上面には、共通電極となる第2の外部電極4Bが設けられている。
次に、第3の実施形態の積層型超音波トランスデューサ40について、図10及び図11を参照して説明する。ここで、第1及び第2の実施形態では、矩形状の積層振動子3の対向する2つの外形辺を含む外周領域A3のそれぞれから内側領域(中心領域)A1に向けて超音波を収束させるための構成を示したが、超音波の収束方向はこれに限られるものではない。図10に示す第3の実施形態の積層型超音波トランスデューサ40は、矩形状の積層振動子3の対向する2つの外形辺のうち、1つの外形辺を含む第1の外周領域A31から他方の外形辺を含む第2の外周領域A32に向けて超音波を収束させる、すなわち斜角収束させるための構成を示している。なお、図10に示す構造も、内部電極の積層数が内側領域から外周領域に向けて傾斜して増加する領域を一部に有している。
Claims (5)
- 積層された複数の振動子と、
前記複数の振動子のうち最外層に配置された2つの振動子の外側露出面に配置された外部電極と、
前記複数の振動子間に配置された複数の内部電極とを具備し、
前記複数の内部電極は、前記複数の振動子の内側領域から外周領域に向けて、前記複数の振動子の積層方向に対する前記内部電極の積層数が傾斜して増加するように配置された領域を有し、前記複数の振動子から出射される超音波は、少なくとも前記内側領域に向けて収束される、積層型超音波トランスデューサ。 - 前記複数の振動子は、四角形の外形形状を有し、
前記複数の内部電極は、前記四角形の外形形状の中心領域から前記四角形の外形形状の少なくとも対向する2つの外形辺を含む外周領域に向けて、前記内部電極の積層数が傾斜して増加するように配置されている、請求項1に記載の積層型超音波トランスデューサ。 - 複数の振動子は、四角形の外形形状を有し、
前記複数の内部電極は、前記四角形の外形形状の少なくとも対向する2つの外形辺のうち、1つの外形辺から他方の外形辺に向けて、前記内部電極の積層数が傾斜して増加するように配置されている、請求項1に記載の積層型超音波トランスデューサ。 - 前記内部電極の積層数が異なる複数の領域は、異なる電界で駆動される、請求項1ないし請求項3のいずれか1項に記載の積層型超音波トランスデューサ。
- 検査対象部に超音波を送受信する超音波トランスデューサであって、請求項1ないし請求項4のいずれか1項に記載の積層型超音波トランスデューサと、
前記積層型超音波トランスデューサから前記検査対象部に超音波を発信させると共に、前記検査対象部からの反射波に基づいて前記検査対象部の状態を検査する制御ユニットと
を具備する超音波検査装置。
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US16/131,588 US11322676B2 (en) | 2018-03-22 | 2018-09-14 | Multilayer ultrasonic transducer and ultrasonic inspection device |
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JPH07108037B2 (ja) * | 1984-09-12 | 1995-11-15 | 日本電気株式会社 | 超音波探触子 |
JPH0538335A (ja) | 1991-08-05 | 1993-02-19 | Fujitsu Ltd | 超音波探触子およびその製造方法 |
AU688334B2 (en) | 1993-09-07 | 1998-03-12 | Siemens Medical Solutions Usa, Inc. | Broadband phased array transducer design with frequency controlled two dimension capability and methods for manufacture thereof |
JP3775041B2 (ja) | 1998-03-17 | 2006-05-17 | ソニー株式会社 | 光ディスク記録再生装置 |
JP3436486B2 (ja) * | 1998-05-01 | 2003-08-11 | アロカ株式会社 | 超音波振動子及びその製造方法 |
JP3880218B2 (ja) * | 1998-09-11 | 2007-02-14 | 株式会社日立メディコ | 超音波探触子 |
JP2003009288A (ja) | 2001-06-11 | 2003-01-10 | Ge Medical Systems Global Technology Co Llc | 圧電装置、超音波プローブおよび超音波撮像装置 |
JP2004056352A (ja) * | 2002-07-18 | 2004-02-19 | Toshiba Corp | 超音波トランスデューサ |
JP2006093449A (ja) * | 2004-09-24 | 2006-04-06 | Fuji Photo Film Co Ltd | 積層構造体及び積層構造体アレイ、並びに、それらの製造方法 |
EP1944814B1 (en) * | 2005-09-16 | 2011-11-09 | Delphi Technologies Holding S.à.r.l. | Piezoelectric Actuator |
JP2007149995A (ja) * | 2005-11-28 | 2007-06-14 | Fujifilm Corp | 積層型圧電素子及びその製造方法 |
JP2008066972A (ja) | 2006-09-06 | 2008-03-21 | Toshiba Corp | 超音波プローブ及び超音波診断装置 |
JP4390018B2 (ja) * | 2007-02-07 | 2009-12-24 | 株式会社村田製作所 | 圧電磁器および圧電素子 |
JP2009194226A (ja) * | 2008-02-15 | 2009-08-27 | Tachyonish Holdings Co Ltd | 積層型圧電素子及びその製造方法 |
WO2011114808A1 (ja) * | 2010-03-16 | 2011-09-22 | 株式会社村田製作所 | 積層セラミック電子部品 |
KR20130104338A (ko) * | 2012-03-13 | 2013-09-25 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 제조방법 |
JP6108934B2 (ja) * | 2012-04-24 | 2017-04-05 | キヤノン株式会社 | 圧電セラミックス、圧電素子、超音波モータおよび塵埃除去装置 |
JP2016047175A (ja) * | 2014-08-28 | 2016-04-07 | プレキシオン株式会社 | 光音響画像化装置 |
JP2017163330A (ja) * | 2016-03-09 | 2017-09-14 | セイコーエプソン株式会社 | 超音波デバイス、超音波モジュール、及び超音波測定装置 |
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