JP2007103605A - 多層配線基板及びその製造方法 - Google Patents
多層配線基板及びその製造方法 Download PDFInfo
- Publication number
- JP2007103605A JP2007103605A JP2005290357A JP2005290357A JP2007103605A JP 2007103605 A JP2007103605 A JP 2007103605A JP 2005290357 A JP2005290357 A JP 2005290357A JP 2005290357 A JP2005290357 A JP 2005290357A JP 2007103605 A JP2007103605 A JP 2007103605A
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- Prior art keywords
- wiring board
- multilayer wiring
- carbon fiber
- fiber group
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Images
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/60—Nonwoven fabric [i.e., nonwoven strand or fiber material]
- Y10T442/697—Containing at least two chemically different strand or fiber materials
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
【解決手段】ピッチ系のカーボンファイバーシート1を、50層積層した積層体を形成する。また、ピッチ系のカーボンファイバーシート2を、2層積層した積層体を2組作製する。このとき、カーボンファイバーシート2の熱膨張率をカーボンファイバーシート1のそれよりも高くする。次に、カーボンファイバーシート1の積層体を2組のカーボンファイバーシート2の積層体で挟み込む。次いで、カーボンファイバーシート1及び2の積層体に、エポキシ系樹脂組成物を含浸し、この樹脂を固化させる。この結果、カーボンファイバーシート1及び2並びにエポキシ系樹脂組成物からなる樹脂材3を含むプリプレグ4が形成される。その後、プリプレグ4に配線9等を形成し、多層配線基板を完成させる。
【選択図】図1H
Description
基材と、
前記基材上に形成された複数の配線層と、
を有し、
前記基材は、
第1の繊維群と、
前記第1の繊維群よりも前記配線層側に配置され、前記第1の繊維群よりも熱膨張係数が高い第2の繊維群と、
を有することを特徴とする多層配線基板。
前記配線層は、前記基材の両側に配置されており、
前記第2の繊維群は、前記第1の繊維群の両側に配置されていることを特徴とする付記1に記載の多層配線基板。
前記基材は、前記第1及び第2の繊維群に含浸された樹脂材を有することを特徴とする付記1又は2に記載の多層配線基板。
前記第2の繊維群を構成する繊維の熱膨張率は、前記第1の繊維群を構成する繊維の熱膨張率よりも高いことを特徴とする付記1乃至3のいずれか1項に記載の多層配線基板。
前記第2の繊維群の単位体積当たりの繊維密度は、前記第1の繊維群の繊維密度よりも低いことを特徴とする付記1乃至4のいずれか1項に記載の多層配線基板。
前記第1及び第2の繊維群は、炭素繊維群又はガラス繊維群であることを特徴とする付記1乃至5のいずれか1項に記載の多層配線基板。
前記第2の繊維群のカーボン純度は、前記第1の繊維群のカーボン純度よりも低いことを特徴とする付記6に記載の多層配線基板。
前記第1及び第2の繊維群は、ピッチ系炭素繊維、PAN系炭素繊維、短繊維系炭素繊維及び不織布系繊維からなる群から選択された1種から構成されていることを特徴とする付記6又は7に記載の多層配線基板。
前記配線層は、絶縁層内に埋め込まれており、前記絶縁層の熱膨張率は、前記基材と接する部分において最も低くなっていることを特徴とする付記1乃至8のいずれか1項に記載の多層配線基板。
第1の繊維群と、前記第1の繊維群よりも熱膨張係数が高い第2の繊維群と、を重ね合わせて基材を形成する工程と、
前記基材の前記第2の繊維群上に複数の配線層を形成する工程と、
を有することを特徴とする多層配線基板の製造方法。
前記基材を形成する工程において、前記第2の繊維群を前記第1の繊維群の両側に配置し、
前記複数の配線層を前記基材の両側に形成することを特徴とする付記10に記載の多層配線基板の製造方法。
前記基材を形成する工程は、前記第1及び第2の繊維群に樹脂材を含浸する工程を有することを特徴とする付記10又は11に記載の多層配線基板の製造方法。
前記第2の繊維群として、それを構成する繊維の熱膨張率が前記第1の繊維群を構成する繊維の熱膨張率よりも高いものを用いることを特徴とする付記10乃至12のいずれか1項に記載の多層配線基板の製造方法。
前記第2の繊維群として、その単位体積当たりの繊維密度が前記第1の繊維群の繊維密度よりも低いものを用いることを特徴とする付記10乃至13のいずれか1項に記載の多層配線基板の製造方法。
前記第1及び第2の繊維群として、炭素繊維群又はガラス繊維群を用いることを特徴とする付記10乃至14のいずれか1項に記載の多層配線基板の製造方法。
前記第2の繊維群として、そのカーボン純度が前記第1の繊維群のカーボン純度よりも低いものを用いることを特徴とする付記15に記載の多層配線基板の製造方法。
前記第1及び第2の繊維群として、ピッチ系炭素繊維、PAN系炭素繊維、短繊維系炭素繊維及び不織布系繊維からなる群から選択された1種から構成された炭素繊維群を用いることを特徴とする付記15又は16に記載の多層配線基板の製造方法。
前記配線層を形成する工程は、前記複数の配線層の間に絶縁層を形成する工程を有し、前記絶縁層の熱膨張率を、前記基材と接する部分において最も低くすることを特徴とする付記10乃至17のいずれか1項に記載の多層配線基板の製造方法。
3:樹脂材
4:プリプレグ
5、7、11:孔
6、10:絶縁樹脂シート
8:シード層
9:配線
Claims (10)
- 基材と、
前記基材上に形成された複数の配線層と、
を有し、
前記基材は、
第1の繊維群と、
前記第1の繊維群よりも前記配線層側に配置され、前記第1の繊維群よりも熱膨張係数が高い第2の繊維群と、
を有することを特徴とする多層配線基板。 - 前記配線層は、前記基材の両側に配置されており、
前記第2の繊維群は、前記第1の繊維群の両側に配置されていることを特徴とする請求項1に記載の多層配線基板。 - 前記基材は、前記第1及び第2の繊維群に含浸された樹脂材を有することを特徴とする請求項1又は2に記載の多層配線基板。
- 前記第1及び第2の繊維群は、ピッチ系炭素繊維、PAN系炭素繊維、短繊維系炭素繊維及び不織布系繊維からなる群から選択された1種から構成されていることを特徴とする請求項1乃至3のいずれか1項に記載の多層配線基板。
- 前記配線層は、絶縁層内に埋め込まれており、
前記絶縁層の熱膨張率は、前記基材と接する部分において最も低くなっていることを特徴とする請求項1乃至4のいずれか1項に記載の多層配線基板。 - 第1の繊維群と、前記第1の繊維群よりも熱膨張係数が高い第2の繊維群と、を重ね合わせて基材を形成する工程と、
前記基材の前記第2の繊維群上に複数の配線層を形成する工程と、
を有することを特徴とする多層配線基板の製造方法。 - 前記基材を形成する工程において、前記第2の繊維群を前記第1の繊維群の両側に配置し、
前記複数の配線層を前記基材の両側に形成することを特徴とする請求項6に記載の多層配線基板の製造方法。 - 前記基材を形成する工程は、前記第1及び第2の繊維群に樹脂材を含浸する工程を有することを特徴とする請求項6又は7に記載の多層配線基板の製造方法。
- 前記第1及び第2の繊維群として、ピッチ系炭素繊維、PAN系炭素繊維、短繊維系炭素繊維及び不織布系繊維からなる群から選択された1種から構成された炭素繊維群を用いることを特徴とする請求項6乃至8のいずれか1項に記載の多層配線基板の製造方法。
- 前記配線層を形成する工程は、前記複数の配線層の間に絶縁層を形成する工程を有し、
前記絶縁層の熱膨張率を、前記基材と接する部分において最も低くすることを特徴とする請求項6乃至9のいずれか1項に記載の多層配線基板の製造方法。
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JP2009088173A (ja) * | 2007-09-28 | 2009-04-23 | Fujitsu Ltd | 配線基板 |
JP2009094415A (ja) * | 2007-10-12 | 2009-04-30 | Fujitsu Ltd | 配線基板およびその製造方法 |
JP2011009651A (ja) * | 2009-06-29 | 2011-01-13 | Fujitsu Ltd | 樹脂表面の加工方法及び複合部材、筐体、及び電子機器の製造方法 |
US8186053B2 (en) | 2008-11-14 | 2012-05-29 | Fujitsu Limited | Circuit board and method of manufacturing the same |
US10542625B2 (en) | 2018-06-11 | 2020-01-21 | Shinko Electric Industries Co., Ltd. | Wiring substrate |
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WO2010058443A1 (ja) * | 2008-11-20 | 2010-05-27 | 富士通株式会社 | 配線基板及び配線基板の製造方法 |
JP5391981B2 (ja) * | 2009-02-02 | 2014-01-15 | 富士通株式会社 | 回路基板とその製造方法、及び抵抗素子 |
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US20150230342A1 (en) * | 2014-02-07 | 2015-08-13 | Apple Inc. | Novel structure achieving fine through hole pitch for integrated circuit substrates |
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JP4855753B2 (ja) | 2012-01-18 |
US20070077391A1 (en) | 2007-04-05 |
US20100024963A1 (en) | 2010-02-04 |
US8257542B2 (en) | 2012-09-04 |
US7622184B2 (en) | 2009-11-24 |
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