JP2007053157A - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP2007053157A JP2007053157A JP2005235778A JP2005235778A JP2007053157A JP 2007053157 A JP2007053157 A JP 2007053157A JP 2005235778 A JP2005235778 A JP 2005235778A JP 2005235778 A JP2005235778 A JP 2005235778A JP 2007053157 A JP2007053157 A JP 2007053157A
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- power transistor
- semiconductor device
- bonding pad
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- 238000004519 manufacturing process Methods 0.000 title claims description 24
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
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- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
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Abstract
【解決手段】 半導体チップ20には、パワートランジスタが形成されたパワートランジスタ形成領域21、ロジック回路が形成されたロジック回路形成領域22およびアナログ回路が形成されたアナログ回路形成領域23が形成されている。そして、パワートランジスタ形成領域21には、パッド25が形成されており、このパッド25とリード27aとはワイヤ29よりも断面積の大きいクリップ28で接続されている。一方、ボンディングパッド24は、ワイヤ29によって接続されている。
【選択図】 図5
Description
ダメージを防止することができる。このため、パワートランジスタが形成されているパワートランジスタ形成領域の真上にパッド25を形成しても、クリップ28で接続する際、ダメージをパワートランジスタに与えることはない。したがって、パワートランジスタ形成領域にパッド25を配置することができる。このため、パワートランジスタ形成領域の外部にパッド25を配置する場合に比べて、半導体チップ20のサイズを縮小化することができる。このように、本実施の形態によれば、パワートランジスタに接続するパッド25とリード27aとをクリップ28で接続する構成をとることにより、パワートランジスタのオン抵抗を低減することができるだけでなく、同時に半導体チップの縮小化も実現することができる。
2 HDD用モータドライバIC
3 スピンドルモータ
4 Rsns
5 VCM
6 パワートランジスタ
7 パワートランジスタ
8 デジタルPWMシステム
9 シリアルI/O
10 コントロールロジック部
11 リトラクトコントロール部
12 ヘッドスピード検知部
13 衝撃検知部
14 3.3Vシリーズレギュレータ
15 スイッチングレギュレータ
16 負電圧生成レギュレータ
17 パワーモニタ
18 パワーオンリセット部
19 ブースタ
20 半導体チップ
21 パワートランジスタ形成領域
22 ロジック回路形成領域
23 アナログ回路形成領域
24 ボンディングパッド
25 パッド
26 リードフレーム
27a リード
27b リード
28 クリップ
29 ワイヤ
Claims (21)
- (a)半導体チップと、
(b)前記半導体チップに形成された第1領域および第2領域と、
(c)前記第1領域に形成された複数の第1ボンディングパッドと、
(d)前記第2領域に形成された複数の第2ボンディングパッドと、
(e)複数の第1リードおよび複数の第2リードと、
(f)前記第1ボンディングパッドと前記第1リードとを電気接続する第1導電体と、
(g)前記第2ボンディングパッドと前記第2リードとを電気接続する第2導電体とを備え、
前記第1導電体の断面積は、前記第2導電体の断面積よりも大きいことを特徴とする半導体装置。 - 前記第1導電体はクリップであり、前記第2導電体はワイヤであることを特徴とする請求項1記載の半導体装置。
- 前記第1導電体は銅またはアルミニウムから構成され、前記第2導電体は金から構成されていることを特徴とする請求項1記載の半導体装置。
- 前記第1領域には、MISFETが形成されていることを特徴とする請求項1記載の半導体装置。
- 前記第1領域に形成されているMISFETの最小ゲート長は、前記第2領域に形成されているMISFETの最小ゲート長以上であることを特徴とする請求項4記載の半導体装置。
- 前記第1領域には複数の第1配線が形成され、前記第2領域には複数の第2配線が形成されており、
前記第1配線の最小間隔は、前記第2配線の最小間隔以上であることを特徴とする請求項1記載の半導体装置。 - 前記第1領域はパワートランジスタ形成領域であり、前記第2領域は制御用集積回路形成領域であることを特徴とする請求項1記載の半導体装置。
- 前記第1ボンディングパッドの真下にパワートランジスタが形成されていることを特徴とする請求項1記載の半導体装置。
- 前記第1ボンディングパッドの面積は、前記第2ボンディングパッドの面積よりも大きいことを特徴とする請求項1記載の半導体装置。
- 前記第1ボンディングパッドの最小ピッチは、前記第2ボンディングパッドの最小ピッチよりも大きいことを特徴とする請求項1記載の半導体装置。
- (a)半導体チップと、
(b)前記半導体チップに形成されたパワートランジスタ形成領域および制御用集積回路形成領域と、
(c)前記パワートランジスタ形成領域に形成された複数の第1ボンディングパッドと、
(d)前記制御用集積回路形成領域に形成された複数の第2ボンディングパッドと、
(e)複数の第1リードと複数の第2リードと、
(f)前記第1ボンディングパッドと前記第1リードとを電気接続するクリップと、
(g)前記第2ボンディングパッドと前記第2リードとを電気接続するワイヤとを備えることを特徴とする半導体装置。 - 前記クリップの断面積は、前記ワイヤの断面積よりも大きいことを特徴とする請求項11記載の半導体装置。
- 前記第1ボンディングパッドの面積は、前記第2ボンディングパッドの面積よりも大きいことを特徴とする請求項11記載の半導体装置。
- 前記第1ボンディングパッドの真下にパワートランジスタが形成されていることを特徴とする請求項11記載の半導体装置。
- (a)第1領域および第2領域を有する半導体チップを、複数の第1リードおよび複数の第2リードを有するリードフレームに搭載する工程と、
(b)前記第1領域に形成されている第1ボンディングパッド上および前記第1リード上に接続材を形成する工程と、
(c)前記第1ボンディングパッドと前記第1リードとをクリップを用いて電気接続する工程と、
(d)前記半導体チップに熱処理を加える工程と、
(e)前記(d)工程後、前記第2領域に形成されている第2ボンディングパッドと前記第2リードとをワイヤを用いて電気接続する工程とを備えることを特徴とする半導体装置の製造方法。 - 前記クリップの断面積は、前記ワイヤの断面積よりも大きいことを特徴とする請求項15記載の半導体装置の製造方法。
- 前記第1ボンディングパッドの面積は、前記第2ボンディングパッドの面積よりも大きいことを特徴とする請求項15記載の半導体装置の製造方法。
- 前記第1ボンディングパッドの真下にパワートランジスタが形成されていることを特徴とする請求項15記載の半導体装置の製造方法。
- 前記接続材は、半田あるいは樹脂ペーストであることを特徴とする請求項15記載の半導体装置の製造方法。
- 前記第1領域は、パワートランジスタ形成領域であり、前記第2領域は制御用集積回路形成領域であることを特徴とする請求項15記載の半導体装置の製造方法。
- (a)第1領域および第2領域を有する半導体チップを、複数の第1リードおよび複数の第2リードを有するリードフレームに搭載する工程と、
(b)前記第2領域に形成されている第2ボンディングパッドと前記第2リードとをワイヤを用いて電気接続する工程と、
(c)前記(b)工程後、前記第1領域に形成されている第1ボンディングパッド上および前記第1リード上に接続材を形成する工程と、
(d)前記第1ボンディングパッドと前記第1リードとをクリップを用いて電気接続する工程と、
(e)前記半導体チップに熱処理を加える工程とを備えることを特徴とする半導体装置の製造方法。
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JP2005235778A JP4676277B2 (ja) | 2005-08-16 | 2005-08-16 | 半導体装置 |
CNA2006101085017A CN1917198A (zh) | 2005-08-16 | 2006-08-03 | 半导体器件及其制造方法 |
US11/503,153 US7462887B2 (en) | 2005-08-16 | 2006-08-14 | Semiconductor connection component |
US12/267,079 US7968370B2 (en) | 2005-08-16 | 2008-11-07 | Semiconductor connection component |
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JP2008053313A (ja) * | 2006-08-22 | 2008-03-06 | Denso Corp | 半導体集積回路装置 |
JP2014191854A (ja) * | 2013-03-28 | 2014-10-06 | Rohm Co Ltd | モータ駆動装置 |
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US7271469B2 (en) * | 2005-05-31 | 2007-09-18 | Freescale Semiconductor, Inc. | Methods of making integrated circuits |
JP4676277B2 (ja) * | 2005-08-16 | 2011-04-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7808088B2 (en) * | 2006-06-07 | 2010-10-05 | Texas Instruments Incorporated | Semiconductor device with improved high current performance |
US7851908B2 (en) * | 2007-06-27 | 2010-12-14 | Infineon Technologies Ag | Semiconductor device |
US7554133B1 (en) * | 2008-05-13 | 2009-06-30 | Lsi Corporation | Pad current splitting |
KR20150128895A (ko) * | 2013-03-13 | 2015-11-18 | 피에스4 뤽스코 에스.에이.알.엘. | 반도체 장치 |
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JP2000049184A (ja) | 1998-05-27 | 2000-02-18 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP2004153234A (ja) | 2002-09-05 | 2004-05-27 | Toshiba Corp | 半導体装置 |
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