JP2007027765A - 側面放出型二重レンズ構造ledパッケージ - Google Patents
側面放出型二重レンズ構造ledパッケージ Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0071—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source adapted to illuminate a complete hemisphere or a plane extending 360 degrees around the source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
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- Led Device Packages (AREA)
Abstract
【解決手段】前記LEDパッケージは、LEDチップと、前記LEDチップに電源を供給する一対の電気連結部と、前記電気連結部を固定または保持して前記LEDチップから発した光を上部に案内するよう凹部が形成されたパッケージ本体及び前記LEDチップを密封するよう前記パッケージ本体の凹部に満たされた上面が平坦な透明密封体を含む下部構造と、前記透明密封体の上面に付着されるよう前記下部構造の上部に固定された上部半球形の下部レンズと、前記下部レンズの上端に固定された漏斗形態の部材として、前記LEDチップから前記下部レンズを通して届いた光を側傍に反射する軸対称形の反射面と前記反射面から反射した光を側傍外側に放出する放出面を有する上部レンズとを含む。
【選択図】図6
Description
112 熱伝達部
130 パッケージ本体
140、142 透明密封体
150、170 接着層
160 下部レンズ
180 上部レンズ
Claims (12)
- LEDチップと、
前記LEDチップに電源を供給する一対の電気連結部と、前記電気連結部を固定または保持し、前記LEDチップから発した光を上部に案内するよう凹部が形成されたパッケージ本体と、前記LEDチップを密封するよう前記パッケージ本体の凹部に満たされた上面が平坦な透明密封体を含む下部構造と、
前記透明密封体の上面に付着されるよう前記下部構造の上部に固定された上部半球形の下部レンズと、
前記下部レンズの上端に固定された漏斗形の部材として、前記LEDチップから前記下部レンズを通して届いた光を側傍に反射する軸対称形の反射面と前記反射面から反射した光を側傍外側に放出する放出面を有する上部レンズと、
を含むことを特徴とする二重レンズ構造LEDパッケージ。 - 前記下部レンズは、前記下部構造の上面と面接触するよう底面が平坦であることを特徴とする請求項1に記載の二重レンズ構造LEDパッケージ。
- 前記下部構造と前記下部レンズの間に位置した透明な接着層をさらに含むことを特徴とする請求項1に記載の二重レンズ構造LEDパッケージ。
- 前記下部レンズは上端に軸周りに溝が形成され、前記上部レンズは下端に形成された突起が前記下部レンズの溝に挿入されて前記下部レンズに結合されることを特徴とする請求項1に記載の二重レンズ構造LEDパッケージ。
- 前記下部レンズの溝と前記上部レンズの突起の間に位置した接着層をさらに含むことを特徴とする請求項4に記載の二重レンズ構造LEDパッケージ。
- 前記上部レンズは前記突起周りに形成された複数の第2突起をさらに含み、前記下部レンズは前記第2突起を収容するよう前記溝周りに形成された複数の第2溝をさらに含むことを特徴とする請求項4に記載の二重レンズ構造LEDパッケージ。
- 前記下部レンズは、底面周縁に複数の突起が形成され、前記下部構造は前記突起を収容するよう前記凹部の周りに複数の溝が形成されたことを特徴とする請求項1に記載の二重レンズ構造LEDパッケージ。
- 前記下部及び上部レンズは、それぞれEMC、シリコン及びエポキシ樹脂の少なくとも一つから成ることを特徴とする請求項1に記載の二重レンズ構造LEDパッケージ。
- 前記パッケージ本体の内部で前記LEDチップを保持しながら前記LEDチップから発した光を上方へ反射するよう前記パッケージ本体の凹部の下に凹部が形成された熱伝逹部をさらに含むことを特徴とする請求項1に記載の二重レンズ構造LEDパッケージ。
- 前記熱伝逹部は、前記電気連結部の一つと一体であることを特徴とする請求項9に記載の二重レンズ構造LEDパッケージ。
- 前記熱伝逹部は複数の金属板より成り、前記凹部は前記金属板の上の金属板に形成された穴であることを特徴とする請求項9に記載の二重レンズ構造LEDパッケージ。
- 前記LEDチップ周りの前記熱伝逹部及びパッケージ本体の一部は、前記電気連結部側に切開されて通路を形成し、前記LEDチップは前記通路を介してワイヤで前記電気連結部と連結されることを特徴とする請求項9に記載の二重レンズ構造LEDパッケージ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2005-0065505 | 2005-07-19 | ||
KR1020050065505A KR100631992B1 (ko) | 2005-07-19 | 2005-07-19 | 측면 방출형 이중 렌즈 구조 led 패키지 |
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Publication Number | Publication Date |
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JP2007027765A true JP2007027765A (ja) | 2007-02-01 |
JP4921876B2 JP4921876B2 (ja) | 2012-04-25 |
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JP2006197321A Active JP4921876B2 (ja) | 2005-07-19 | 2006-07-19 | 側面放出型二重レンズ構造ledパッケージ及び側面放出型二重レンズの製造方法 |
Country Status (3)
Country | Link |
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US (1) | US7458703B2 (ja) |
JP (1) | JP4921876B2 (ja) |
KR (1) | KR100631992B1 (ja) |
Cited By (9)
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JP2008227485A (ja) * | 2007-03-14 | 2008-09-25 | Samsung Electro-Mechanics Co Ltd | Ledパッケージ |
JP2009290180A (ja) * | 2008-05-29 | 2009-12-10 | Samsung Electro Mech Co Ltd | Ledパッケージ及びその製造方法 |
JP2011254080A (ja) * | 2010-06-01 | 2011-12-15 | Lg Innotek Co Ltd | 発光素子パッケージ |
JP2012054561A (ja) * | 2010-09-02 | 2012-03-15 | Samsung Led Co Ltd | 発光素子パッケージおよびその製造方法 |
JP2012510153A (ja) * | 2008-11-25 | 2012-04-26 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
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KR100631992B1 (ko) | 2006-10-09 |
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JP4921876B2 (ja) | 2012-04-25 |
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