|
US7672558B2
(en)
|
2004-01-12 |
2010-03-02 |
Honeywell International, Inc. |
Silicon optical device
|
|
US7013067B2
(en)
*
|
2004-02-11 |
2006-03-14 |
Sioptical, Inc. |
Silicon nanotaper couplers and mode-matching devices
|
|
CA2557509C
(en)
*
|
2004-02-26 |
2014-09-30 |
Sioptical, Inc. |
Active manipulation of light in a silicon-on-insulator (soi) structure
|
|
WO2005086786A2
(en)
*
|
2004-03-08 |
2005-09-22 |
Sioptical, Inc. |
Wafer-level opto-electronic testing apparatus and method
|
|
US7217584B2
(en)
|
2004-03-18 |
2007-05-15 |
Honeywell International Inc. |
Bonded thin-film structures for optical modulators and methods of manufacture
|
|
US7149388B2
(en)
*
|
2004-03-18 |
2006-12-12 |
Honeywell International, Inc. |
Low loss contact structures for silicon based optical modulators and methods of manufacture
|
|
US7177489B2
(en)
*
|
2004-03-18 |
2007-02-13 |
Honeywell International, Inc. |
Silicon-insulator-silicon thin-film structures for optical modulators and methods of manufacture
|
|
US20050214989A1
(en)
*
|
2004-03-29 |
2005-09-29 |
Honeywell International Inc. |
Silicon optoelectronic device
|
|
US20060063679A1
(en)
*
|
2004-09-17 |
2006-03-23 |
Honeywell International Inc. |
Semiconductor-insulator-semiconductor structure for high speed applications
|
|
US7109051B2
(en)
*
|
2004-11-15 |
2006-09-19 |
Freescale Semiconductor, Inc. |
Method of integrating optical devices and electronic devices on an integrated circuit
|
|
US20060177173A1
(en)
*
|
2005-02-04 |
2006-08-10 |
Sioptical, Inc. |
Vertical stacking of multiple integrated circuits including SOI-based optical components
|
|
US7538032B2
(en)
*
|
2005-06-23 |
2009-05-26 |
Teledyne Scientific & Imaging, Llc |
Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said method
|
|
US7362443B2
(en)
*
|
2005-11-17 |
2008-04-22 |
Honeywell International Inc. |
Optical gyro with free space resonator and method for sensing inertial rotation rate
|
|
US7514285B2
(en)
*
|
2006-01-17 |
2009-04-07 |
Honeywell International Inc. |
Isolation scheme for reducing film stress in a MEMS device
|
|
US7442589B2
(en)
|
2006-01-17 |
2008-10-28 |
Honeywell International Inc. |
System and method for uniform multi-plane silicon oxide layer formation for optical applications
|
|
US7463360B2
(en)
|
2006-04-18 |
2008-12-09 |
Honeywell International Inc. |
Optical resonator gyro with integrated external cavity beam generator
|
|
US7454102B2
(en)
*
|
2006-04-26 |
2008-11-18 |
Honeywell International Inc. |
Optical coupling structure
|
|
US7535576B2
(en)
|
2006-05-15 |
2009-05-19 |
Honeywell International, Inc. |
Integrated optical rotation sensor and method for sensing rotation rate
|
|
US7628932B2
(en)
|
2006-06-02 |
2009-12-08 |
Micron Technology, Inc. |
Wet etch suitable for creating square cuts in si
|
|
US7709341B2
(en)
*
|
2006-06-02 |
2010-05-04 |
Micron Technology, Inc. |
Methods of shaping vertical single crystal silicon walls and resulting structures
|
|
US7625776B2
(en)
*
|
2006-06-02 |
2009-12-01 |
Micron Technology, Inc. |
Methods of fabricating intermediate semiconductor structures by selectively etching pockets of implanted silicon
|
|
US7989915B2
(en)
*
|
2006-07-11 |
2011-08-02 |
Teledyne Licensing, Llc |
Vertical electrical device
|
|
US7719073B2
(en)
*
|
2007-01-11 |
2010-05-18 |
Hewlett-Packard Development Company, L.P. |
Capacitively coupling layers of a multilayer device
|
|
WO2008090475A2
(en)
*
|
2007-01-26 |
2008-07-31 |
Innovative Silicon S.A. |
Floating-body dram transistor comprising source/drain regions separated from the gated body region
|
|
US7829462B2
(en)
*
|
2007-05-03 |
2010-11-09 |
Teledyne Licensing, Llc |
Through-wafer vias
|
|
WO2009051902A1
(en)
|
2007-10-17 |
2009-04-23 |
Bae Systems Information And Electronic Systems Integration Inc. |
Method for fabricating selectively coupled optical waveguides on a substrate
|
|
WO2009051903A1
(en)
|
2007-10-18 |
2009-04-23 |
Bae Systems Information And Electronic Systems Integration Inc. |
Method for manufacturing multiple layers of waveguides
|
|
US7736934B2
(en)
|
2007-10-19 |
2010-06-15 |
Bae Systems Information And Electronic Systems Integration Inc. |
Method for manufacturing vertical germanium detectors
|
|
WO2009055145A1
(en)
*
|
2007-10-24 |
2009-04-30 |
Bae Systems Information And Electronic Systems Integration Inc. |
Method for fabricating a heater capable of adjusting refractive index of an optical waveguide
|
|
US8343792B2
(en)
|
2007-10-25 |
2013-01-01 |
Bae Systems Information And Electronic Systems Integration Inc. |
Method for manufacturing lateral germanium detectors
|
|
US7811844B2
(en)
*
|
2007-10-26 |
2010-10-12 |
Bae Systems Information And Electronic Systems Integration Inc. |
Method for fabricating electronic and photonic devices on a semiconductor substrate
|
|
US8031343B2
(en)
*
|
2007-10-29 |
2011-10-04 |
Bae Systems Information And Electronic Systems Integration Inc. |
High-index contrast waveguide optical gyroscope having segmented paths
|
|
US8871554B2
(en)
*
|
2007-10-30 |
2014-10-28 |
Bae Systems Information And Electronic Systems Integration Inc. |
Method for fabricating butt-coupled electro-absorptive modulators
|
|
WO2009058580A1
(en)
*
|
2007-10-31 |
2009-05-07 |
Bae Systems Information And Electronic Systems Integration Inc. |
High-injection heterojunction bipolar transistor
|
|
US8299485B2
(en)
*
|
2008-03-19 |
2012-10-30 |
Soitec |
Substrates for monolithic optical circuits and electronic circuits
|
|
US7791031B2
(en)
*
|
2008-06-09 |
2010-09-07 |
Honeywell International Inc. |
Neutron detection structure
|
|
US20100001378A1
(en)
*
|
2008-07-01 |
2010-01-07 |
Teledyne Scientific & Imaging, Llc |
Through-substrate vias and method of fabricating same
|
|
US8187972B2
(en)
|
2008-07-01 |
2012-05-29 |
Teledyne Scientific & Imaging, Llc |
Through-substrate vias with polymer fill and method of fabricating same
|
|
US7693354B2
(en)
*
|
2008-08-29 |
2010-04-06 |
Bae Systems Information And Electronic Systems Integration Inc. |
Salicide structures for heat-influenced semiconductor applications
|
|
US8148265B2
(en)
*
|
2008-08-29 |
2012-04-03 |
Bae Systems Information And Electronic Systems Integration Inc. |
Two-step hardmask fabrication methodology for silicon waveguides
|
|
US7853101B2
(en)
*
|
2008-08-29 |
2010-12-14 |
Bae Systems Information And Electronic Systems Integration Inc. |
Bi-rate adaptive optical transfer engine
|
|
US7987066B2
(en)
*
|
2008-08-29 |
2011-07-26 |
Bae Systems Information And Electronic Systems Integration Inc. |
Components and configurations for test and valuation of integrated optical busses
|
|
US7715663B2
(en)
*
|
2008-08-29 |
2010-05-11 |
Bae Systems Information And Electronic Systems Integration Inc. |
Integrated optical latch
|
|
US8288290B2
(en)
*
|
2008-08-29 |
2012-10-16 |
Bae Systems Information And Electronic Systems Integration Inc. |
Integration CMOS compatible of micro/nano optical gain materials
|
|
WO2010044746A1
(en)
*
|
2008-10-16 |
2010-04-22 |
Agency For Science, Technology And Research |
An integrated assembly and a method of manufacturing the same
|
|
US8088667B2
(en)
*
|
2008-11-05 |
2012-01-03 |
Teledyne Scientific & Imaging, Llc |
Method of fabricating vertical capacitors in through-substrate vias
|
|
US7847353B2
(en)
*
|
2008-12-05 |
2010-12-07 |
Bae Systems Information And Electronic Systems Integration Inc. |
Multi-thickness semiconductor with fully depleted devices and photonic integration
|
|
US9305779B2
(en)
*
|
2009-08-11 |
2016-04-05 |
Bae Systems Information And Electronic Systems Integration Inc. |
Method for growing germanium epitaxial films
|
|
US8655138B2
(en)
|
2010-05-10 |
2014-02-18 |
Cornell University |
Waveguide structure and related fabrication method
|
|
US8513037B2
(en)
*
|
2010-12-03 |
2013-08-20 |
Bae Systems Information And Electronic Systems Integration Inc. |
Method of integrating slotted waveguide into CMOS process
|
|
EP3182454B1
(en)
|
2011-06-07 |
2019-11-27 |
Tohoku University |
Signal processing method based on a signal output from a photodiode
|
|
US10094988B2
(en)
|
2012-08-31 |
2018-10-09 |
Micron Technology, Inc. |
Method of forming photonics structures
|
|
GB2513531A
(en)
*
|
2012-11-30 |
2014-11-05 |
Ibm |
Semiconductor structure and method for manufacturing a semiconductor structure
|
|
US9989703B2
(en)
*
|
2012-11-30 |
2018-06-05 |
International Business Machines Corporation |
Semiconductor structure and method for manufacturing a semiconductor structure
|
|
KR20140095678A
(ko)
*
|
2013-01-25 |
2014-08-04 |
삼성전자주식회사 |
광소자 및 전자소자를 포함하는 반도체 장치 및 그 제조 방법
|
|
GB2523383B
(en)
*
|
2014-02-24 |
2016-09-14 |
Rockley Photonics Ltd |
Detector remodulator
|
|
US10222677B2
(en)
|
2014-02-24 |
2019-03-05 |
Rockley Photonics Limited |
Optoelectronic device
|
|
US10928659B2
(en)
|
2014-02-24 |
2021-02-23 |
Rockley Photonics Limited |
Optoelectronic device
|
|
US10231038B2
(en)
|
2014-02-24 |
2019-03-12 |
Rockley Photonics Limited |
Detector remodulator and optoelectronic switch
|
|
CA2958754C
(en)
*
|
2014-08-15 |
2021-04-20 |
Aeponyx Inc. |
Methods and systems for microelectromechanical packaging
|
|
EP3035092B1
(en)
*
|
2014-12-16 |
2020-05-20 |
IMEC vzw |
Integrated semiconductor optical coupler.
|
|
WO2016139484A1
(en)
|
2015-03-05 |
2016-09-09 |
Rockley Photonics Limited |
Waveguide modulator structures
|
|
US10678115B2
(en)
|
2015-03-05 |
2020-06-09 |
Rockley Photonics Limited |
Waveguide modulator structures
|
|
US11150494B2
(en)
|
2015-03-05 |
2021-10-19 |
Rockley Photonics Limited |
Waveguide modulator structures
|
|
US10216059B2
(en)
|
2015-03-05 |
2019-02-26 |
Rockley Photonics Limited |
Waveguide modulator structures
|
|
US10025033B2
(en)
|
2016-03-01 |
2018-07-17 |
Advanced Semiconductor Engineering, Inc. |
Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same
|
|
US10241264B2
(en)
|
2016-07-01 |
2019-03-26 |
Advanced Semiconductor Engineering, Inc. |
Semiconductor device packages
|
|
US11101256B2
(en)
|
2016-11-23 |
2021-08-24 |
Rockley Photonics Limited |
Optical modulators
|
|
WO2018096038A1
(en)
*
|
2016-11-23 |
2018-05-31 |
Rockley Photonics Limited |
Electro-optically active device
|
|
GB2559252B
(en)
*
|
2016-12-02 |
2020-06-03 |
Rockley Photonics Ltd |
Waveguide optoelectronic device
|
|
WO2018100172A1
(en)
|
2016-12-02 |
2018-06-07 |
Rockley Photonics Limited |
Waveguide device and method of doping a waveguide device
|
|
GB2576652B
(en)
|
2017-07-05 |
2021-12-22 |
Rockley Photonics Ltd |
Optoelectronic device
|
|
US10197730B1
(en)
|
2017-11-08 |
2019-02-05 |
Globalfoundries Inc. |
Optical through silicon via
|
|
US11126020B2
(en)
*
|
2017-11-23 |
2021-09-21 |
Rockley Photonics Limited |
Electro-optically active device
|
|
WO2019220207A1
(en)
|
2018-05-16 |
2019-11-21 |
Rockley Photonics Limited |
lll-V/SI HYBRID OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURE
|
|
KR102590996B1
(ko)
*
|
2018-10-17 |
2023-10-17 |
삼성전자주식회사 |
반도체 장치
|
|
US10509244B1
(en)
*
|
2018-12-11 |
2019-12-17 |
Globalfoundries Inc. |
Optical switches and routers operated by phase-changing materials controlled by heaters
|
|
US12174424B2
(en)
|
2019-11-15 |
2024-12-24 |
Chamartin Laboratories Llc |
Optoelectronic device and method of manufacture thereof
|
|
DE102020128429B4
(de)
|
2020-03-27 |
2023-12-14 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Package-Vorrichtung mit optischem Pfad und Verfahren zu dessen Herstellung
|
|
US11899242B2
(en)
*
|
2020-03-27 |
2024-02-13 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Method of manufacturing a packaged device with optical pathway
|
|
US11592618B2
(en)
|
2020-06-10 |
2023-02-28 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Photonic semiconductor device and method of manufacture
|
|
US12189181B2
(en)
|
2021-09-22 |
2025-01-07 |
Rockley Photonics Limited |
Optoelectronic device
|
|
CN117199155B
(zh)
*
|
2023-11-06 |
2024-02-13 |
杭州特洛伊光电技术有限公司 |
一种波导型可见光及近红外光探测器结构与制备方法
|