JP2006525677A - シリコン・ベースの光デバイスの電子デバイスとのcmos互換集積化 - Google Patents
シリコン・ベースの光デバイスの電子デバイスとのcmos互換集積化 Download PDFInfo
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- 239000001257 hydrogen Substances 0.000 claims description 3
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- YXTPWUNVHCYOSP-UHFFFAOYSA-N bis($l^{2}-silanylidene)molybdenum Chemical compound [Si]=[Mo]=[Si] YXTPWUNVHCYOSP-UHFFFAOYSA-N 0.000 claims description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 claims description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 2
- 229910021344 molybdenum silicide Inorganic materials 0.000 claims description 2
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- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 claims description 2
- 230000001902 propagating effect Effects 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910021341 titanium silicide Inorganic materials 0.000 claims description 2
- WQJQOUPTWCFRMM-UHFFFAOYSA-N tungsten disilicide Chemical compound [Si]#[W]#[Si] WQJQOUPTWCFRMM-UHFFFAOYSA-N 0.000 claims description 2
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Abstract
Description
この出願は、2003年4月21日に出願された仮出願第60/464,491号の恩恵を請求する。
PMOSトランジスタ12ためのn型ボディ領域24およびpチャネル領域26、およびNMOSトランジスタ14のためのp型ボディ領域28およびnチャネル領域30として示される各デバイスのボディ領域およびチャネル領域を形成するために、適切なドーピングの型および分布でSOI層20の能動領域にドーピングすること。
Claims (46)
- SOIベースの電気光配列であって、
シリコン基板と、
埋込み誘電体層と、
前記埋込み誘電体層の上に配置された単結晶シリコン(SOI)層と、
前記SOI層の一部の上に配置された薄い誘電体層、および前記SOI層と部分的に重なるように前記薄い誘電体層の上に配置されたシリコン層を含む少なくとも1つの光部品域と、
前記SOI層の別個の部分の上に配置された薄い誘電体層、および前記薄い誘電体層の上に配置された高濃度ドーピング・ゲート金属様シリコン層を含む少なくとも1つの電気部品域と、を備え、1つまたは複数の光デバイスが前記光部品域の各々に形成され、かつ1つまたは複数の電気デバイスが前記電気部品域の各々に形成されており、さらに、
1つまたは複数の金属化層を含む共通電気相互接続配列を備えるSOIベースの電気光配列。 - 前記埋込み誘電体層が、二酸化ケイ素を備える、請求項1に記載のSOIベースの配列。
- 前記二酸化ケイ素層の厚さが、0.4μmよりも大きい、請求項2に記載のSOIベースの配列。
- 前記単結晶シリコン層の厚さが、1ミクロンよりも小さい、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層が、1ミクロンよりも小さな厚さを有する、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層が、前記少なくとも1つの電気部品域の前記高濃度ドーピング・ゲート金属様シリコン層の厚さに実質的に等しい厚さを有する、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層が、前記少なくとも1つの電気部品域の前記高濃度ドーピング・ゲート金属様シリコン層の厚さよりも小さな厚さを有する、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層が、前記少なくとも1つの電気部品域の前記高濃度ドーピング・ゲート金属様シリコン層の厚さよりも大きな厚さを有する、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層の厚さが、キャリア変調領域と実質的に重なるように光学モード最大強度を閉じ込めるように選ばれる、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記薄い誘電体層が、1000Åよりも小さな厚さを有する、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記薄い誘電体層が、二酸化ケイ素、窒化ケイ素、酸窒化ケイ素、酸化ビスマスおよび酸化ハフニウムから成るグループから選ばれる、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記薄い誘電体層が、前記少なくとも1つの電気部品域の前記薄い誘電体層の厚さに実質的に等しい厚さを有する、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記薄い誘電体層が、前記少なくとも1つの電気部品域の前記薄い誘電体層の厚さよりも小さな厚さを有する、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記薄い誘電体層が、前記少なくとも1つの電気部品域の前記薄い誘電体層の厚さよりも大きな厚さを有する、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層が、単結晶シリコン、実質的な単結晶シリコン、歪みシリコン、非晶質シリコン、およびポリシリコンから成るグループから選ばれる、請求項1に記載のSOIベースの配列。
- 前記ポリシリコンが、結晶粒径拡大ポリシリコン、結晶粒整列ポリシリコン、結晶粒界不動態化ポリシリコンから成るグループから選ばれる、請求項15に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層が、単層構造を備える、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層が、多層構造を備える、請求項1に記載のSOIベースの配列。
- 前記多層構造が、1より多いシリコンの形態を備える、請求項18に記載のSOIベースの配列。
- 前記多層構造の各層が、シリコンの同じ形態を備える、請求項18に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層の少なくとも1つの角が、光信号損失を減少させるように丸くされている、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層の少なくとも一部が、能動「半導体様」光デバイス領域を形成するようにドーピングされている、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの能動光デバイス領域の中の前記SOI層の部分が、前記シリコン層の伝導型と反対の伝導型を示すようにドーピングされている、請求項22に記載のSOIベースの配列。
- 各ドーピングされた部分が、光信号を変調するための低ドーパント濃度の別個の領域と、電気動作信号を加えるための高ドーパント濃度の別個の領域とを含む、請求項22に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記シリコン層の少なくとも一部が、受動光デバイス領域を形成するようにドーピングされていない、請求項1に記載のSOIベースの配列。
- 前記共通電気相互接続配列が、前記光部品域および前記電気部品域の両方の選ばれた1つに配置されたシリサイド・コンタクト域を備え、前記シリサイド・コンタクト域が同じ材料を含み、かつ基本的に等しい厚さを示すように同時に形成される、請求項1に記載のSOIベースの配列。
- 前記コンタクト・シリサイドが、タンタル・シリサイド、チタン・シリサイド、タングステン・シリサイド、コバルト・シリサイド、ニッケル・シリサイド、およびモリブデン・シリサイドから成るグループから選ばれる、請求項26に記載のSOIベースの配列。
- 前記共通電気相互接続配列が、前記能動光部品域と前記電気部品域の両方に配置された第1の金属層にシリサイドを接続するコンタクト域を備え、前記コンタクト域が同じ材料を含みかつ同時に形成される、請求項1に記載のSOIベースの配列。
- 前記共通電気相互接続配列が、少なくとも1つの光デバイスと少なくとも1つの電気デバイスの間の電気接続を行うように同じ材料を含みかつ同時に形成された、前記能動光部品域と前記電気部品域の両方に配置された少なくとも1つの金属層を備える、請求項1に記載のSOIベースの配列。
- 前記共通電気相互接続配列が、金属層間接続ビアを使用して相互接続され同じ材料を含みかつ同時に形成された、前記光部品域と前記電気部品域の両方に配置された少なくとも2つの金属層を備える、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの金属層の任意の金属層と前記光域の前記能動光デバイスの光閉込め領域との間の最小距離が、1ミクロンよりも大きい、請求項1に記載のSOIベースの配列。
- 任意のシリサイド層と前記光域の前記光デバイスの光閉込め領域との間の最小距離が、0.2ミクロンよりも大きい、請求項1に記載のSOIベースの配列。
- 前記単結晶シリコン層が、予め決められた欠陥数/cm2よりも少ない光学的欠陥の数を有し、欠陥が、前記SOI層を伝播する光の実効波長λ実効の予め決められた何分の1かよりも大きな寸法を示す要素として定義される、請求項1に記載のSOIベースの配列。
- 前記予め決められた欠陥数が、1個の欠陥/cm2、10個の欠陥/cm2、および100個の欠陥/cm2から成るグループから選ばれる、請求項33に記載のSOIベースの配列。
- λ実効の前記予め決められた何分の1かが、1/5、1/10、1/15、および1/20から成るグループから選ばれる、請求項33に記載のSOIベースの配列。
- 前記単結晶シリコン層が、予め決められた欠陥数/cm2より少ない光学的欠陥の数を有し、欠陥が、前記SOI層の厚さの予め決められた何分の1かよりも大きな寸法を示す要素として定義される、請求項1に記載のSOIベースの配列。
- 前記予め決められた欠陥数が、1個の欠陥/cm2、10個の欠陥/cm2、および100個の欠陥/cm2から成るグループから選ばれる、請求項36に記載のSOIベースの配列。
- 前記SOI層の厚さの前記予め決められた何分の1かが、1/2、1/3、1/4、1/5および1/10から成るグループから選ばれる、請求項36に記載のSOIベースの配列。
- 前記光学的欠陥の数が、前記比較的薄い誘電体層を前記SOI層の上に堆積する前に、水素アニール工程を行うことによって減少する、請求項1に記載のSOIベースの配列。
- 前記少なくとも1つの光部品域の前記SOI層、前記誘電体層、および前記シリコン層の組み合わされた厚さが、単一光学モードの垂直方向の伝播を支援するように選ばれる、請求項1に記載のSOIベースの配列。
- 前記SOI層が、光学的欠陥の密度を減少させるためにエピタキシャル成長プロセスを使用して形成される、請求項1に記載のSOIベースの配列。
- 光結合域を形成するように使用される前記SOI層の一部を露出させるために、前記配列の上面から窓が開けられる、請求項1に記載のSOIベースの配列。
- 前記SOI層の前記露出部分の最終表面が、原子的に平滑である、請求項42に記載のSOIベースの配列。
- 前記光結合域が、前記SOI層に入れるようにまたは前記SOI層から出すように光信号のエバネセント結合を行う、請求項42に記載のSOIベースの配列。
- 前記窓が、単一のフォトリソグラフィ/エッチング・ステップを使用して形成される、請求項42に記載のSOIベースの配列。
- 前記窓が、複数のフォトリソグラフィ/エッチング・ステップを使用して形成される、請求項42に記載のSOIベースの配列。
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Also Published As
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EP1625615A2 (en) | 2006-02-15 |
KR20060003046A (ko) | 2006-01-09 |
EP1625615B1 (en) | 2017-07-26 |
EP1625615A4 (en) | 2007-05-16 |
KR100745275B1 (ko) | 2007-08-01 |
WO2004095112A3 (en) | 2005-03-31 |
US6968110B2 (en) | 2005-11-22 |
US20040207016A1 (en) | 2004-10-21 |
CA2520972A1 (en) | 2004-11-04 |
CA2520972C (en) | 2010-01-26 |
WO2004095112A2 (en) | 2004-11-04 |
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