JP2006520089A5 - - Google Patents
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- Publication number
- JP2006520089A5 JP2006520089A5 JP2005500831A JP2005500831A JP2006520089A5 JP 2006520089 A5 JP2006520089 A5 JP 2006520089A5 JP 2005500831 A JP2005500831 A JP 2005500831A JP 2005500831 A JP2005500831 A JP 2005500831A JP 2006520089 A5 JP2006520089 A5 JP 2006520089A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor layer
- layer
- bonded
- substrate
- selectively
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010410 layer Substances 0.000 claims 119
- 239000004065 semiconductor Substances 0.000 claims 86
- 239000000758 substrate Substances 0.000 claims 38
- 238000000034 method Methods 0.000 claims 27
- 230000008878 coupling Effects 0.000 claims 21
- 238000010168 coupling process Methods 0.000 claims 21
- 238000005859 coupling reaction Methods 0.000 claims 21
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000002346 layers by function Substances 0.000 claims 5
- 238000003745 diagnosis Methods 0.000 claims 3
- 238000005468 ion implantation Methods 0.000 claims 1
- 238000005304 joining Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42812502P | 2002-11-20 | 2002-11-20 | |
| PCT/US2003/037304 WO2004112089A2 (en) | 2002-11-20 | 2003-11-20 | Method and system for fabricating multi layer devices on a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006520089A JP2006520089A (ja) | 2006-08-31 |
| JP2006520089A5 true JP2006520089A5 (https=) | 2007-01-11 |
Family
ID=33551213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005500831A Withdrawn JP2006520089A (ja) | 2002-11-20 | 2003-11-20 | 基板上に多層素子を製造する方法およびシステム |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7056751B2 (https=) |
| EP (1) | EP1573788A3 (https=) |
| JP (1) | JP2006520089A (https=) |
| KR (1) | KR20050083935A (https=) |
| CN (1) | CN1742358A (https=) |
| AU (1) | AU2003304218A1 (https=) |
| TW (3) | TW200423261A (https=) |
| WO (1) | WO2004112089A2 (https=) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2839505B1 (fr) * | 2002-05-07 | 2005-07-15 | Univ Claude Bernard Lyon | Procede pour modifier les proprietes d'une couche mince et substrat faisant application du procede |
| US7659631B2 (en) * | 2006-10-12 | 2010-02-09 | Hewlett-Packard Development Company, L.P. | Interconnection between different circuit types |
| US20090026524A1 (en) * | 2007-07-27 | 2009-01-29 | Franz Kreupl | Stacked Circuits |
| CN102844176A (zh) * | 2009-09-30 | 2012-12-26 | 微型实验室诊断股份有限公司 | 微流体装置中选择性的粘结性降低 |
| KR101348655B1 (ko) * | 2010-03-24 | 2014-01-08 | 한국전자통신연구원 | 미세유체 제어 장치 및 그 제조 방법 |
| US8829329B2 (en) * | 2010-08-18 | 2014-09-09 | International Business Machines Corporation | Solar cell and battery 3D integration |
| DE102010041763A1 (de) | 2010-09-30 | 2012-04-05 | Siemens Aktiengesellschaft | Mikromechanisches Substrat |
| US10543662B2 (en) | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
| US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
| TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
| US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
| US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
| US10510576B2 (en) | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
| US10046542B2 (en) | 2014-01-27 | 2018-08-14 | Corning Incorporated | Articles and methods for controlled bonding of thin sheets with carriers |
| CN106457758B (zh) | 2014-04-09 | 2018-11-16 | 康宁股份有限公司 | 装置改性的基材制品及其制备方法 |
| JP2018524201A (ja) | 2015-05-19 | 2018-08-30 | コーニング インコーポレイテッド | シートをキャリアと結合するための物品および方法 |
| US11905201B2 (en) | 2015-06-26 | 2024-02-20 | Corning Incorporated | Methods and articles including a sheet and a carrier |
| US20170186730A1 (en) * | 2015-12-26 | 2017-06-29 | Invensas Corporation | System and method for providing 3d wafer assembly with known-good-dies |
| WO2018013243A1 (en) * | 2016-06-01 | 2018-01-18 | Quantum-Si Incorporated | Integrated device for detecting and analyzing molecules |
| TW202216444A (zh) | 2016-08-30 | 2022-05-01 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
| TWI810161B (zh) | 2016-08-31 | 2023-08-01 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
| CN111372772A (zh) | 2017-08-18 | 2020-07-03 | 康宁股份有限公司 | 使用聚阳离子聚合物的临时结合 |
| US11331692B2 (en) | 2017-12-15 | 2022-05-17 | Corning Incorporated | Methods for treating a substrate and method for making articles comprising bonded sheets |
| US11315789B2 (en) * | 2019-04-24 | 2022-04-26 | Tokyo Electron Limited | Method and structure for low density silicon oxide for fusion bonding and debonding |
| WO2021163944A1 (en) * | 2020-02-20 | 2021-08-26 | Yangtze Memory Technologies Co., Ltd. | Dram memory device with xtacking architecture |
| US11829077B2 (en) * | 2020-12-11 | 2023-11-28 | Kla Corporation | System and method for determining post bonding overlay |
| JP7097480B1 (ja) | 2021-06-24 | 2022-07-07 | 浜松ホトニクス株式会社 | Ｘ線管、ｘ線発生装置、及び窓部材の製造方法 |
| US11782411B2 (en) | 2021-07-28 | 2023-10-10 | Kla Corporation | System and method for mitigating overlay distortion patterns caused by a wafer bonding tool |
| CN114035030B (zh) * | 2021-11-05 | 2023-10-24 | 爱迪特（秦皇岛）科技股份有限公司 | 一种测试组件 |
| CN116387256A (zh) * | 2023-04-26 | 2023-07-04 | 上海易卜半导体有限公司 | 芯片堆栈及制备方法 |
| CN119275214B (zh) * | 2024-12-10 | 2025-02-25 | 电子科技大学 | 一种用于腐蚀工艺监控的表征器件 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63155731A (ja) * | 1986-12-19 | 1988-06-28 | Agency Of Ind Science & Technol | 半導体装置 |
| US5094697A (en) * | 1989-06-16 | 1992-03-10 | Canon Kabushiki Kaisha | Photovoltaic device and method for producing the same |
| JP3214631B2 (ja) * | 1992-01-31 | 2001-10-02 | キヤノン株式会社 | 半導体基体及びその作製方法 |
| JP4126747B2 (ja) * | 1998-02-27 | 2008-07-30 | セイコーエプソン株式会社 | ３次元デバイスの製造方法 |
| US6133582A (en) * | 1998-05-14 | 2000-10-17 | Lightspeed Semiconductor Corporation | Methods and apparatuses for binning partially completed integrated circuits based upon test results |
| JP5121103B2 (ja) * | 2000-09-14 | 2013-01-16 | 株式会社半導体エネルギー研究所 | 半導体装置、半導体装置の作製方法及び電気器具 |
| US6965895B2 (en) * | 2001-07-16 | 2005-11-15 | Applied Materials, Inc. | Method and apparatus for analyzing manufacturing data |
-
2003
- 2003-11-20 KR KR1020057009160A patent/KR20050083935A/ko not_active Withdrawn
- 2003-11-20 TW TW092132599A patent/TW200423261A/zh unknown
- 2003-11-20 US US10/719,666 patent/US7056751B2/en not_active Expired - Fee Related
- 2003-11-20 EP EP03816310A patent/EP1573788A3/en active Pending
- 2003-11-20 CN CNA2003801090448A patent/CN1742358A/zh active Pending
- 2003-11-20 JP JP2005500831A patent/JP2006520089A/ja not_active Withdrawn
- 2003-11-20 TW TW092132597A patent/TW200421497A/zh unknown
- 2003-11-20 AU AU2003304218A patent/AU2003304218A1/en not_active Abandoned
- 2003-11-20 TW TW092132601A patent/TW200428538A/zh unknown
- 2003-11-20 WO PCT/US2003/037304 patent/WO2004112089A2/en not_active Ceased
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