AU2003304218A1 - Method and system for fabricating multi layer devices on a substrate - Google Patents

Method and system for fabricating multi layer devices on a substrate

Info

Publication number
AU2003304218A1
AU2003304218A1 AU2003304218A AU2003304218A AU2003304218A1 AU 2003304218 A1 AU2003304218 A1 AU 2003304218A1 AU 2003304218 A AU2003304218 A AU 2003304218A AU 2003304218 A AU2003304218 A AU 2003304218A AU 2003304218 A1 AU2003304218 A1 AU 2003304218A1
Authority
AU
Australia
Prior art keywords
substrate
multi layer
layer devices
fabricating multi
fabricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003304218A
Other languages
English (en)
Other versions
AU2003304218A8 (en
Inventor
Sadeg M. Faris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Reveo Inc
Original Assignee
Reveo Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reveo Inc filed Critical Reveo Inc
Publication of AU2003304218A8 publication Critical patent/AU2003304218A8/xx
Publication of AU2003304218A1 publication Critical patent/AU2003304218A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/0045—End test of the packaged device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
AU2003304218A 2002-11-20 2003-11-20 Method and system for fabricating multi layer devices on a substrate Abandoned AU2003304218A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US42812502P 2002-11-20 2002-11-20
US60/428,125 2002-11-20
PCT/US2003/037304 WO2004112089A2 (en) 2002-11-20 2003-11-20 Method and system for fabricating multi layer devices on a substrate

Publications (2)

Publication Number Publication Date
AU2003304218A8 AU2003304218A8 (en) 2005-01-04
AU2003304218A1 true AU2003304218A1 (en) 2005-01-04

Family

ID=33551213

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003304218A Abandoned AU2003304218A1 (en) 2002-11-20 2003-11-20 Method and system for fabricating multi layer devices on a substrate

Country Status (8)

Country Link
US (1) US7056751B2 (https=)
EP (1) EP1573788A3 (https=)
JP (1) JP2006520089A (https=)
KR (1) KR20050083935A (https=)
CN (1) CN1742358A (https=)
AU (1) AU2003304218A1 (https=)
TW (3) TW200423261A (https=)
WO (1) WO2004112089A2 (https=)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2839505B1 (fr) * 2002-05-07 2005-07-15 Univ Claude Bernard Lyon Procede pour modifier les proprietes d'une couche mince et substrat faisant application du procede
US7659631B2 (en) * 2006-10-12 2010-02-09 Hewlett-Packard Development Company, L.P. Interconnection between different circuit types
US20090026524A1 (en) * 2007-07-27 2009-01-29 Franz Kreupl Stacked Circuits
CN102844176A (zh) * 2009-09-30 2012-12-26 微型实验室诊断股份有限公司 微流体装置中选择性的粘结性降低
KR101348655B1 (ko) * 2010-03-24 2014-01-08 한국전자통신연구원 미세유체 제어 장치 및 그 제조 방법
US8829329B2 (en) * 2010-08-18 2014-09-09 International Business Machines Corporation Solar cell and battery 3D integration
DE102010041763A1 (de) 2010-09-30 2012-04-05 Siemens Aktiengesellschaft Mikromechanisches Substrat
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
US10046542B2 (en) 2014-01-27 2018-08-14 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
CN106457758B (zh) 2014-04-09 2018-11-16 康宁股份有限公司 装置改性的基材制品及其制备方法
JP2018524201A (ja) 2015-05-19 2018-08-30 コーニング インコーポレイテッド シートをキャリアと結合するための物品および方法
US11905201B2 (en) 2015-06-26 2024-02-20 Corning Incorporated Methods and articles including a sheet and a carrier
US20170186730A1 (en) * 2015-12-26 2017-06-29 Invensas Corporation System and method for providing 3d wafer assembly with known-good-dies
WO2018013243A1 (en) * 2016-06-01 2018-01-18 Quantum-Si Incorporated Integrated device for detecting and analyzing molecules
TW202216444A (zh) 2016-08-30 2022-05-01 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
CN111372772A (zh) 2017-08-18 2020-07-03 康宁股份有限公司 使用聚阳离子聚合物的临时结合
US11331692B2 (en) 2017-12-15 2022-05-17 Corning Incorporated Methods for treating a substrate and method for making articles comprising bonded sheets
US11315789B2 (en) * 2019-04-24 2022-04-26 Tokyo Electron Limited Method and structure for low density silicon oxide for fusion bonding and debonding
WO2021163944A1 (en) * 2020-02-20 2021-08-26 Yangtze Memory Technologies Co., Ltd. Dram memory device with xtacking architecture
US11829077B2 (en) * 2020-12-11 2023-11-28 Kla Corporation System and method for determining post bonding overlay
JP7097480B1 (ja) 2021-06-24 2022-07-07 浜松ホトニクス株式会社 Ｘ線管、ｘ線発生装置、及び窓部材の製造方法
US11782411B2 (en) 2021-07-28 2023-10-10 Kla Corporation System and method for mitigating overlay distortion patterns caused by a wafer bonding tool
CN114035030B (zh) * 2021-11-05 2023-10-24 爱迪特（秦皇岛）科技股份有限公司 一种测试组件
CN116387256A (zh) * 2023-04-26 2023-07-04 上海易卜半导体有限公司 芯片堆栈及制备方法
CN119275214B (zh) * 2024-12-10 2025-02-25 电子科技大学 一种用于腐蚀工艺监控的表征器件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155731A (ja) * 1986-12-19 1988-06-28 Agency Of Ind Science & Technol 半導体装置
US5094697A (en) * 1989-06-16 1992-03-10 Canon Kabushiki Kaisha Photovoltaic device and method for producing the same
JP3214631B2 (ja) * 1992-01-31 2001-10-02 キヤノン株式会社 半導体基体及びその作製方法
JP4126747B2 (ja) * 1998-02-27 2008-07-30 セイコーエプソン株式会社 ３次元デバイスの製造方法
US6133582A (en) * 1998-05-14 2000-10-17 Lightspeed Semiconductor Corporation Methods and apparatuses for binning partially completed integrated circuits based upon test results
JP5121103B2 (ja) * 2000-09-14 2013-01-16 株式会社半導体エネルギー研究所 半導体装置、半導体装置の作製方法及び電気器具
US6965895B2 (en) * 2001-07-16 2005-11-15 Applied Materials, Inc. Method and apparatus for analyzing manufacturing data

Also Published As

Publication number Publication date
AU2003304218A8 (en) 2005-01-04
US7056751B2 (en) 2006-06-06
KR20050083935A (ko) 2005-08-26
CN1742358A (zh) 2006-03-01
TW200428538A (en) 2004-12-16
JP2006520089A (ja) 2006-08-31
US20040241888A1 (en) 2004-12-02
EP1573788A3 (en) 2005-11-02
TW200421497A (en) 2004-10-16
WO2004112089A2 (en) 2004-12-23
WO2004112089A3 (en) 2005-09-15
TW200423261A (en) 2004-11-01
EP1573788A2 (en) 2005-09-14

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase