CN1742358A - 在基板上制造多层器件的方法和系统 - Google Patents

在基板上制造多层器件的方法和系统 Download PDF

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Publication number
CN1742358A
CN1742358A CNA2003801090448A CN200380109044A CN1742358A CN 1742358 A CN1742358 A CN 1742358A CN A2003801090448 A CNA2003801090448 A CN A2003801090448A CN 200380109044 A CN200380109044 A CN 200380109044A CN 1742358 A CN1742358 A CN 1742358A
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CN
China
Prior art keywords
layer
semiconductor layer
bonding
substrate
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2003801090448A
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English (en)
Chinese (zh)
Inventor
萨迪克·M·法里斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Reveo Inc
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Reveo Inc
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Filing date
Publication date
Application filed by Reveo Inc filed Critical Reveo Inc
Publication of CN1742358A publication Critical patent/CN1742358A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/0045—End test of the packaged device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/207—Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
CNA2003801090448A 2002-11-20 2003-11-20 在基板上制造多层器件的方法和系统 Pending CN1742358A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42812502P 2002-11-20 2002-11-20
US60/428,125 2002-11-20

Publications (1)

Publication Number Publication Date
CN1742358A true CN1742358A (zh) 2006-03-01

Family

ID=33551213

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2003801090448A Pending CN1742358A (zh) 2002-11-20 2003-11-20 在基板上制造多层器件的方法和系统

Country Status (8)

Country Link
US (1) US7056751B2 (https=)
EP (1) EP1573788A3 (https=)
JP (1) JP2006520089A (https=)
KR (1) KR20050083935A (https=)
CN (1) CN1742358A (https=)
AU (1) AU2003304218A1 (https=)
TW (3) TW200423261A (https=)
WO (1) WO2004112089A2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102247786A (zh) * 2010-03-24 2011-11-23 韩国电子通信研究院 微流体控制器件及其制造方法
CN102844176A (zh) * 2009-09-30 2012-12-26 微型实验室诊断股份有限公司 微流体装置中选择性的粘结性降低
CN108475646A (zh) * 2015-12-26 2018-08-31 英帆萨斯公司 提供具有已知良好晶粒的三维晶圆组件的系统和方法
CN114035030A (zh) * 2021-11-05 2022-02-11 爱迪特（秦皇岛）科技股份有限公司 一种测试组件
TWI844783B (zh) * 2016-06-01 2024-06-11 美商寬騰矽公司 用於偵測及分析分子之光子結構及積體裝置

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2839505B1 (fr) * 2002-05-07 2005-07-15 Univ Claude Bernard Lyon Procede pour modifier les proprietes d'une couche mince et substrat faisant application du procede
US7659631B2 (en) * 2006-10-12 2010-02-09 Hewlett-Packard Development Company, L.P. Interconnection between different circuit types
US20090026524A1 (en) * 2007-07-27 2009-01-29 Franz Kreupl Stacked Circuits
US8829329B2 (en) * 2010-08-18 2014-09-09 International Business Machines Corporation Solar cell and battery 3D integration
DE102010041763A1 (de) 2010-09-30 2012-04-05 Siemens Aktiengesellschaft Mikromechanisches Substrat
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US10510576B2 (en) 2013-10-14 2019-12-17 Corning Incorporated Carrier-bonding methods and articles for semiconductor and interposer processing
US10046542B2 (en) 2014-01-27 2018-08-14 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
CN106457758B (zh) 2014-04-09 2018-11-16 康宁股份有限公司 装置改性的基材制品及其制备方法
JP2018524201A (ja) 2015-05-19 2018-08-30 コーニング インコーポレイテッド シートをキャリアと結合するための物品および方法
US11905201B2 (en) 2015-06-26 2024-02-20 Corning Incorporated Methods and articles including a sheet and a carrier
TW202216444A (zh) 2016-08-30 2022-05-01 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
CN111372772A (zh) 2017-08-18 2020-07-03 康宁股份有限公司 使用聚阳离子聚合物的临时结合
US11331692B2 (en) 2017-12-15 2022-05-17 Corning Incorporated Methods for treating a substrate and method for making articles comprising bonded sheets
US11315789B2 (en) * 2019-04-24 2022-04-26 Tokyo Electron Limited Method and structure for low density silicon oxide for fusion bonding and debonding
WO2021163944A1 (en) * 2020-02-20 2021-08-26 Yangtze Memory Technologies Co., Ltd. Dram memory device with xtacking architecture
US11829077B2 (en) * 2020-12-11 2023-11-28 Kla Corporation System and method for determining post bonding overlay
JP7097480B1 (ja) 2021-06-24 2022-07-07 浜松ホトニクス株式会社 Ｘ線管、ｘ線発生装置、及び窓部材の製造方法
US11782411B2 (en) 2021-07-28 2023-10-10 Kla Corporation System and method for mitigating overlay distortion patterns caused by a wafer bonding tool
CN116387256A (zh) * 2023-04-26 2023-07-04 上海易卜半导体有限公司 芯片堆栈及制备方法
CN119275214B (zh) * 2024-12-10 2025-02-25 电子科技大学 一种用于腐蚀工艺监控的表征器件

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155731A (ja) * 1986-12-19 1988-06-28 Agency Of Ind Science & Technol 半導体装置
US5094697A (en) * 1989-06-16 1992-03-10 Canon Kabushiki Kaisha Photovoltaic device and method for producing the same
JP3214631B2 (ja) * 1992-01-31 2001-10-02 キヤノン株式会社 半導体基体及びその作製方法
JP4126747B2 (ja) * 1998-02-27 2008-07-30 セイコーエプソン株式会社 ３次元デバイスの製造方法
US6133582A (en) * 1998-05-14 2000-10-17 Lightspeed Semiconductor Corporation Methods and apparatuses for binning partially completed integrated circuits based upon test results
JP5121103B2 (ja) * 2000-09-14 2013-01-16 株式会社半導体エネルギー研究所 半導体装置、半導体装置の作製方法及び電気器具
US6965895B2 (en) * 2001-07-16 2005-11-15 Applied Materials, Inc. Method and apparatus for analyzing manufacturing data

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102844176A (zh) * 2009-09-30 2012-12-26 微型实验室诊断股份有限公司 微流体装置中选择性的粘结性降低
CN102247786A (zh) * 2010-03-24 2011-11-23 韩国电子通信研究院 微流体控制器件及其制造方法
CN108475646A (zh) * 2015-12-26 2018-08-31 英帆萨斯公司 提供具有已知良好晶粒的三维晶圆组件的系统和方法
US11114408B2 (en) 2015-12-26 2021-09-07 Invensas Corporation System and method for providing 3D wafer assembly with known-good-dies
TWI844783B (zh) * 2016-06-01 2024-06-11 美商寬騰矽公司 用於偵測及分析分子之光子結構及積體裝置
US12259324B2 (en) 2016-06-01 2025-03-25 Quantum-Si Incorporated Photonic structures and integrated device for detecting and analyzing molecules
US12259323B2 (en) 2016-06-01 2025-03-25 Quantum-Si Incorporated Photonic structures and integrated device for detecting and analyzing molecules
CN114035030A (zh) * 2021-11-05 2022-02-11 爱迪特（秦皇岛）科技股份有限公司 一种测试组件
CN114035030B (zh) * 2021-11-05 2023-10-24 爱迪特（秦皇岛）科技股份有限公司 一种测试组件

Also Published As

Publication number Publication date
AU2003304218A8 (en) 2005-01-04
US7056751B2 (en) 2006-06-06
KR20050083935A (ko) 2005-08-26
TW200428538A (en) 2004-12-16
JP2006520089A (ja) 2006-08-31
US20040241888A1 (en) 2004-12-02
EP1573788A3 (en) 2005-11-02
TW200421497A (en) 2004-10-16
WO2004112089A2 (en) 2004-12-23
WO2004112089A3 (en) 2005-09-15
TW200423261A (en) 2004-11-01
EP1573788A2 (en) 2005-09-14
AU2003304218A1 (en) 2005-01-04

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