JP5432604B2 - 積層チップパッケージの製造方法 - Google Patents
積層チップパッケージの製造方法 Download PDFInfo
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Description
積層チップパッケージの複数の階層部分にそれぞれ対応する複数の基礎構造物であって、各々が対応する階層部分を複数含み、後にそれら対応する階層部分のうちの隣接するもの同士の境界位置で切断される複数の基礎構造物を作製する工程と、
複数の基礎構造物を用いて本体を作製すると共に、本体に対して配線を形成して、積層チップパッケージを完成させる工程とを備えている。
互いに反対側を向いた第1および第2の面を有する1つの半導体ウェハにおける第1の面に処理を施すことによって、それぞれデバイスを含む複数の半導体チップ予定部が配列され、且つ半導体ウェハの第1および第2の面に対応する第1および第2の面を有する基礎構造物前ウェハを作製する工程と、
基礎構造物前ウェハに対して、少なくとも1つの半導体チップ予定部に隣接するように延び、且つ基礎構造物前ウェハの第1の面において開口する1以上の溝を形成する工程と、
1以上の溝を埋めるように、後に絶縁部の一部となる絶縁層を形成する工程と、
一部が絶縁層の上に配置されるように、複数の電極を形成する工程とを含んでいる。
以下、本発明の実施の形態について図面を参照して詳細に説明する。始めに、図1を参照して、本発明の第1の実施の形態に係る積層チップパッケージの構成について説明する。図1は、本実施の形態に係る積層チップパッケージの斜視図である。図1に示したように、本実施の形態に係る積層チップパッケージ1は、直方体形状の本体2を備えている。本体2は、上面2a、下面2b、互いに反対側を向いた第1の側面2cおよび第2の側面2d、ならびに互いに反対側を向いた第3の側面2eおよび第4の側面2fを有している。
次に、本発明の第2の実施の形態について説明する。本実施の形態に係る積層チップパッケージ1の外観は、第1の実施の形態と同様に、図1に示したようになる。
次に、本発明の第3の実施の形態について説明する。図35は、本実施の形態に係る積層チップパッケージ1の斜視図である。図35に示したように、本実施の形態に係る積層チップパッケージ1は、本体2の少なくとも1つの側面に配置された配線3として、本体2の第1の側面2cに配置された配線3Aのみを備え、第1および第2の実施の形態では本体2の第2の側面2dに配置されていた配線3B(図1参照)は備えていない。また、本実施の形態では、端子層20に含まれる複数のパッド状端子22は、全て、本体2の側面2cに配置された端面を有するものになっている。複数のパッド状端子22の端面には、配線3Aが接続されている。
Claims (14)
- 上面、下面および4つの側面を有する本体と、
前記本体の少なくとも1つの側面に配置された配線とを備え、
前記本体は、積層された複数の階層部分を含み、
前記複数の階層部分の各々は、上面、下面および4つの側面を有する半導体チップと、前記半導体チップの4つの側面のうちの少なくとも1つの側面を覆う絶縁部と、前記半導体チップに接続された複数の電極とを含み、
前記絶縁部は、前記配線が配置された前記本体の前記少なくとも1つの側面に配置された少なくとも1つの端面を有し、
前記複数の電極の各々は、前記配線が配置された前記本体の前記少なくとも1つの側面に配置され且つ前記絶縁部によって囲まれた端面を有し、
前記配線は、前記複数の階層部分における複数の電極の端面に接続されている積層チップパッケージを製造する方法であって、
前記積層チップパッケージの複数の階層部分にそれぞれ対応する複数の基礎構造物であって、各々が対応する階層部分を複数含み、後にそれら対応する階層部分のうちの隣接するもの同士の境界位置で切断される複数の基礎構造物を作製する工程と、
前記複数の基礎構造物を用いて前記本体を作製すると共に、前記本体に対して前記配線を形成して、積層チップパッケージを完成させる工程とを備え、
前記複数の基礎構造物を作製する工程は、各基礎構造物を作製するための一連の工程として、
互いに反対側を向いた第1および第2の面を有する1つの半導体ウェハにおける前記第1の面に処理を施すことによって、それぞれデバイスを含む複数の半導体チップ予定部が配列され、且つ前記半導体ウェハの第1および第2の面に対応する第1および第2の面を有する基礎構造物前ウェハを作製する工程と、
前記基礎構造物前ウェハに対して、少なくとも1つの半導体チップ予定部に隣接するように延び、且つ前記基礎構造物前ウェハの第1の面において開口する1以上の溝を形成する工程と、
前記1以上の溝を埋めるように、後に前記絶縁部の一部となる絶縁層を形成する工程と、
一部が前記絶縁層の上に配置されるように、前記複数の電極を形成する工程とを含み、
前記積層チップパッケージを完成させる工程は、
前記複数の基礎構造物を用いて、前記複数の階層部分の積層方向と直交する一方向に配列され、それぞれ後に前記本体となる複数の本体予定部を含む本体集合体を作製する工程と、
前記本体集合体における各本体予定部に対してそれぞれ前記配線を形成する工程と、
前記配線の形成後、複数の本体予定部が互いに分離されてそれぞれ前記本体となることによって複数の前記積層チップパッケージが形成されるように、前記本体集合体を切断する工程とを含み、
前記本体集合体を作製する工程において、前記溝が延びる方向に沿って切断面が形成されるように前記絶縁層が切断され、これにより、前記絶縁層の前記切断面によって前記絶縁部の前記少なくとも1つの端面の一部が形成され、且つ前記複数の電極の端面が露出し、
前記本体集合体は、上面、下面および4つの側面を有し、
前記本体集合体の1つまたは2つの側面に前記複数の電極の端面が現れ、
前記配線を形成する工程は、前記複数の電極の端面が現れた前記本体集合体の1つまたは2つの側面上に前記配線を形成することを特徴とする積層チップパッケージの製造方法。 - 前記本体集合体を作製する工程は、
前記複数の基礎構造物を、前記積層チップパッケージの複数の階層部分の積層の順序に対応させて積層して、積層基礎構造物を作製する工程と、
前記本体集合体が形成されるように、前記積層基礎構造物を切断する工程とを含み、
前記積層基礎構造物を切断する工程において前記絶縁層が切断されることを特徴とする請求項1記載の積層チップパッケージの製造方法。 - 前記複数の電極を形成する工程では、前記複数の電極の形成と同時に、前記絶縁層の上にアライメントマークを形成し、
前記積層基礎構造物を作製する工程では、前記アライメントマークを利用して、積層する前記複数の基礎構造物の位置合わせを行うことを特徴とする請求項2記載の積層チップパッケージの製造方法。 - 前記絶縁層は透明であることを特徴とする請求項3記載の積層チップパッケージの製造方法。
- 前記基礎構造物前ウェハに対して1以上の溝を形成する工程では、前記1以上の溝の底部が前記基礎構造物前ウェハの第2の面に達しないように前記1以上の溝を形成し、
前記積層基礎構造物を作製する工程は、前記複数の基礎構造物の各々に対して、前記1以上の溝が露出するまで、前記基礎構造物前ウェハの第2の面に対応する面から研磨を行う工程を含むことを特徴とする請求項2記載の積層チップパッケージの製造方法。 - 前記本体集合体を作製する工程は、
前記複数の基礎構造物をそれぞれ切断して、後に積層されることによって前記本体集合体を構成することになる複数の要素を作製する工程と、
前記本体集合体が形成されるように、前記複数の要素を積層する工程とを含み、
前記複数の要素を作製する工程において前記絶縁層が切断されることを特徴とする請求項1記載の積層チップパッケージの製造方法。 - 前記複数の電極を形成する工程では、前記複数の電極の形成と同時に、前記絶縁層の上にアライメントマークを形成し、
前記複数の要素を積層する工程では、前記アライメントマークを利用して、積層する前記複数の要素の位置合わせを行うことを特徴とする請求項6記載の積層チップパッケージの製造方法。 - 前記絶縁層は透明であることを特徴とする請求項7記載の積層チップパッケージの製造方法。
- 前記配線を形成する工程では、前記複数の本体集合体を、前記複数の階層部分の積層方向に並べた後、この複数の本体集合体における各本体予定部に対してそれぞれ前記配線を形成することを特徴とする請求項1記載の積層チップパッケージの製造方法。
- 前記複数の電極を形成する工程では、前記複数の電極の形成と同時に、前記絶縁層の上にアライメントマークを形成し、
前記配線を形成する工程では、前記アライメントマークを利用して、前記複数の階層部分の積層方向に並べる前記複数の本体集合体の位置合わせを行うことを特徴とする請求項9記載の積層チップパッケージの製造方法。 - 前記絶縁層は透明であることを特徴とする請求項10記載の積層チップパッケージの製造方法。
- 前記半導体チップの4つの側面のうちの1つの側面のみが前記絶縁部によって覆われ、他の3つの側面は、それぞれ、前記本体の3つの側面に配置されることを特徴とする請求項1記載の積層チップパッケージの製造方法。
- 前記半導体チップの4つの側面のうちの、互いに反対側を向いた2つの側面のみが前記絶縁部によって覆われ、他の2つの側面は、それぞれ、前記本体の2つの側面に配置されることを特徴とする請求項1記載の積層チップパッケージの製造方法。
- 前記半導体チップの4つの側面が前記絶縁部によって覆われ、
前記基礎構造物前ウェハに対して1以上の溝を形成する工程では、複数の第1の溝と複数の第2の溝とを形成し、前記複数の第1の溝と複数の第2の溝は、互いに直交する方向に延びることを特徴とする請求項1記載の積層チップパッケージの製造方法。
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