JP2006514144A - 導電性接着性組成物 - Google Patents

導電性接着性組成物 Download PDF

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Publication number
JP2006514144A
JP2006514144A JP2004569678A JP2004569678A JP2006514144A JP 2006514144 A JP2006514144 A JP 2006514144A JP 2004569678 A JP2004569678 A JP 2004569678A JP 2004569678 A JP2004569678 A JP 2004569678A JP 2006514144 A JP2006514144 A JP 2006514144A
Authority
JP
Japan
Prior art keywords
adhesive composition
conductive adhesive
composition according
conductive
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004569678A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006514144A5 (enExample
Inventor
ヒュー ピー クレイグ
デリル エル スティール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Silicones Corp
Original Assignee
Dow Corning Corp
Dow Silicones Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corp, Dow Silicones Corp filed Critical Dow Corning Corp
Publication of JP2006514144A publication Critical patent/JP2006514144A/ja
Publication of JP2006514144A5 publication Critical patent/JP2006514144A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3209—Epoxy compounds containing three or more epoxy groups obtained by polymerisation of unsaturated mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
JP2004569678A 2003-03-18 2003-09-18 導電性接着性組成物 Pending JP2006514144A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39242703A 2003-03-18 2003-03-18
PCT/US2003/029681 WO2004083332A1 (en) 2003-03-18 2003-09-18 A conductive adhesive composition

Publications (2)

Publication Number Publication Date
JP2006514144A true JP2006514144A (ja) 2006-04-27
JP2006514144A5 JP2006514144A5 (enExample) 2006-09-07

Family

ID=33029691

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004569678A Pending JP2006514144A (ja) 2003-03-18 2003-09-18 導電性接着性組成物

Country Status (7)

Country Link
US (1) US20070018315A1 (enExample)
EP (1) EP1603985A1 (enExample)
JP (1) JP2006514144A (enExample)
KR (1) KR20050109977A (enExample)
CN (1) CN1759155A (enExample)
AU (1) AU2003270820A1 (enExample)
WO (1) WO2004083332A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013076045A (ja) * 2011-09-13 2013-04-25 Tamura Seisakusho Co Ltd 接着剤組成物およびそれを用いた太陽電池セルと配線基板との接続方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101658328B1 (ko) * 2007-12-18 2016-09-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전도성 접착제 전구체, 그 사용 방법, 및 용품
DE102008034953A1 (de) * 2008-07-26 2010-01-28 Semikron Elektronik Gmbh & Co. Kg Edelmetallverbindungsmittel und Verwendungsverfahren hierzu
DE102008034946B4 (de) * 2008-07-26 2016-05-19 Semikron Elektronik Gmbh & Co. Kg Herstellungsverfahren eines Edelmetallverbindungsmittels
DE102008034952B4 (de) * 2008-07-26 2016-05-19 Semikron Elektronik Gmbh & Co. Kg Edelmetallverbindungsmittel und Verwendungsverfahren hierzu
EP2396375B1 (en) 2009-02-16 2017-05-17 Cytec Technology Corp. Conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials
BR112012000203B1 (pt) * 2009-06-12 2020-01-28 Lord Corp método para proteção de um substrato contra relâmpagos
KR101251121B1 (ko) * 2009-09-16 2013-04-04 주식회사 엘지화학 유기 발광 표시 장치 봉지용 조성물, 접착 필름, 그 제조 방법 및 유기 발광 표시 장치
US9480133B2 (en) * 2010-01-04 2016-10-25 Cooledge Lighting Inc. Light-emitting element repair in array-based lighting devices
JP5742346B2 (ja) * 2010-03-25 2015-07-01 ヤマハ株式会社 エポキシ樹脂系接着剤用硬化剤組成物および多孔質体用接着剤
CN102876270B (zh) * 2012-09-20 2013-09-25 吴江市天源塑胶有限公司 一种高粘接强度的环氧树脂导电胶
CN102898960A (zh) * 2012-09-25 2013-01-30 苏州汾湖电梯有限公司 导电型胶黏剂
CN103184023B (zh) * 2013-03-01 2015-05-06 广东丹邦科技有限公司 一种微孔填充用导电银胶及其制备方法
WO2017035694A1 (en) 2015-08-28 2017-03-09 E.I. Du Pont De Nemours And Company Electrically conductive adhesives
WO2017035709A1 (en) 2015-08-28 2017-03-09 E.I. Du Pont De Nemours And Company Coated copper particles and use thereof
US10629323B2 (en) * 2015-08-28 2020-04-21 Dupont Electronics, Inc. Electrically conductive adhesives
JP7267500B2 (ja) * 2020-11-20 2023-05-01 信越化学工業株式会社 導電性ペースト組成物、導電性ペースト組成物の製造方法、導電配線及びその製造方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6315807A (ja) * 1986-07-04 1988-01-22 Sannopuko Kk 放射線交叉結合可能な組成物
JPH0542388A (ja) * 1991-08-14 1993-02-23 Nippon Genma:Kk フラツクス組成物
JPH07502369A (ja) * 1991-10-01 1995-03-09 トラナガ・テクノロジーズ・インコーポレーテッド 導電性組成物、その製造方法及び使用方法
JPH07238268A (ja) * 1994-02-28 1995-09-12 Hitachi Chem Co Ltd 接着剤及び半導体装置
JPH0959586A (ja) * 1995-08-21 1997-03-04 Toray Ind Inc 導電性接着剤組成物
JPH108006A (ja) * 1996-06-26 1998-01-13 Three Bond Co Ltd 導電性接着剤組成物及び当該組成物で接続した電子部品
JPH10120983A (ja) * 1996-10-21 1998-05-12 Hitachi Chem Co Ltd 接着剤組成物
JP2000080341A (ja) * 1998-06-22 2000-03-21 Toshiba Chem Corp 異方性導電接着剤および基板搭載デバイス
JP2002158447A (ja) * 2000-09-08 2002-05-31 Sumitomo Bakelite Co Ltd 多層配線板の製造方法および多層配線板
JP2002201448A (ja) * 2000-12-27 2002-07-19 Ricoh Co Ltd 導電性接着剤
JP2002265920A (ja) * 2001-03-13 2002-09-18 Namics Corp 導電性接着剤およびそれを用いた回路

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3359145A (en) * 1964-12-28 1967-12-19 Monsanto Res Corp Electrically conducting adhesive
US3371008A (en) * 1965-12-17 1968-02-27 Eugene F. Lopez Metal adhesives containing epoxy resin, polyamide resin and phenolic flux
US5049313A (en) * 1989-09-05 1991-09-17 Advanced Products Inc. Thermoset polymer thick film compositions and their use as electrical circuitry
US5136365A (en) * 1990-09-27 1992-08-04 Motorola, Inc. Anisotropic conductive adhesive and encapsulant material
JP3214685B2 (ja) * 1994-12-22 2001-10-02 住友ベークライト株式会社 導電性樹脂ペースト
JP3689159B2 (ja) * 1995-12-01 2005-08-31 ナミックス株式会社 導電性接着剤およびそれを用いた回路
TW459032B (en) * 1998-03-18 2001-10-11 Sumitomo Bakelite Co An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive
US7108806B2 (en) * 2003-02-28 2006-09-19 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability and good impact resistance for use in electronics devices

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6315807A (ja) * 1986-07-04 1988-01-22 Sannopuko Kk 放射線交叉結合可能な組成物
JPH0542388A (ja) * 1991-08-14 1993-02-23 Nippon Genma:Kk フラツクス組成物
JPH07502369A (ja) * 1991-10-01 1995-03-09 トラナガ・テクノロジーズ・インコーポレーテッド 導電性組成物、その製造方法及び使用方法
JPH07238268A (ja) * 1994-02-28 1995-09-12 Hitachi Chem Co Ltd 接着剤及び半導体装置
JPH0959586A (ja) * 1995-08-21 1997-03-04 Toray Ind Inc 導電性接着剤組成物
JPH108006A (ja) * 1996-06-26 1998-01-13 Three Bond Co Ltd 導電性接着剤組成物及び当該組成物で接続した電子部品
JPH10120983A (ja) * 1996-10-21 1998-05-12 Hitachi Chem Co Ltd 接着剤組成物
JP2000080341A (ja) * 1998-06-22 2000-03-21 Toshiba Chem Corp 異方性導電接着剤および基板搭載デバイス
JP2002158447A (ja) * 2000-09-08 2002-05-31 Sumitomo Bakelite Co Ltd 多層配線板の製造方法および多層配線板
JP2002201448A (ja) * 2000-12-27 2002-07-19 Ricoh Co Ltd 導電性接着剤
JP2002265920A (ja) * 2001-03-13 2002-09-18 Namics Corp 導電性接着剤およびそれを用いた回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013076045A (ja) * 2011-09-13 2013-04-25 Tamura Seisakusho Co Ltd 接着剤組成物およびそれを用いた太陽電池セルと配線基板との接続方法

Also Published As

Publication number Publication date
CN1759155A (zh) 2006-04-12
US20070018315A1 (en) 2007-01-25
WO2004083332A1 (en) 2004-09-30
AU2003270820A1 (en) 2004-10-11
KR20050109977A (ko) 2005-11-22
EP1603985A1 (en) 2005-12-14

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