JP2006514144A5 - - Google Patents
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- Publication number
- JP2006514144A5 JP2006514144A5 JP2004569678A JP2004569678A JP2006514144A5 JP 2006514144 A5 JP2006514144 A5 JP 2006514144A5 JP 2004569678 A JP2004569678 A JP 2004569678A JP 2004569678 A JP2004569678 A JP 2004569678A JP 2006514144 A5 JP2006514144 A5 JP 2006514144A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- conductive adhesive
- composition according
- parts
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 43
- 230000001070 adhesive effect Effects 0.000 claims 43
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 8
- 239000003822 epoxy resin Substances 0.000 claims 8
- 229920000647 polyepoxide Polymers 0.000 claims 8
- 229910052751 metal Inorganic materials 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 7
- 239000000178 monomer Substances 0.000 claims 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 6
- 229910044991 metal oxide Inorganic materials 0.000 claims 6
- 150000004706 metal oxides Chemical class 0.000 claims 6
- 230000004907 flux Effects 0.000 claims 5
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 claims 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 4
- 239000004593 Epoxy Substances 0.000 claims 4
- 239000003054 catalyst Substances 0.000 claims 4
- 239000003085 diluting agent Substances 0.000 claims 4
- 239000002904 solvent Substances 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- 230000001588 bifunctional effect Effects 0.000 claims 2
- 229910000510 noble metal Inorganic materials 0.000 claims 2
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims 2
- 229920003986 novolac Polymers 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims 1
- 229930185605 Bisphenol Natural products 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052790 beryllium Inorganic materials 0.000 claims 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000004615 ingredient Substances 0.000 claims 1
- 229910052741 iridium Inorganic materials 0.000 claims 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims 1
- 229910052753 mercury Inorganic materials 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052762 osmium Inorganic materials 0.000 claims 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052702 rhenium Inorganic materials 0.000 claims 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- 239000010948 rhodium Substances 0.000 claims 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims 1
- 229910052707 ruthenium Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US39242703A | 2003-03-18 | 2003-03-18 | |
| PCT/US2003/029681 WO2004083332A1 (en) | 2003-03-18 | 2003-09-18 | A conductive adhesive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006514144A JP2006514144A (ja) | 2006-04-27 |
| JP2006514144A5 true JP2006514144A5 (enExample) | 2006-09-07 |
Family
ID=33029691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004569678A Pending JP2006514144A (ja) | 2003-03-18 | 2003-09-18 | 導電性接着性組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20070018315A1 (enExample) |
| EP (1) | EP1603985A1 (enExample) |
| JP (1) | JP2006514144A (enExample) |
| KR (1) | KR20050109977A (enExample) |
| CN (1) | CN1759155A (enExample) |
| AU (1) | AU2003270820A1 (enExample) |
| WO (1) | WO2004083332A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011506751A (ja) * | 2007-12-18 | 2011-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | 導電性接着剤前駆体、その使用方法、及び物品 |
| DE102008034952B4 (de) * | 2008-07-26 | 2016-05-19 | Semikron Elektronik Gmbh & Co. Kg | Edelmetallverbindungsmittel und Verwendungsverfahren hierzu |
| DE102008034946B4 (de) * | 2008-07-26 | 2016-05-19 | Semikron Elektronik Gmbh & Co. Kg | Herstellungsverfahren eines Edelmetallverbindungsmittels |
| DE102008034953A1 (de) * | 2008-07-26 | 2010-01-28 | Semikron Elektronik Gmbh & Co. Kg | Edelmetallverbindungsmittel und Verwendungsverfahren hierzu |
| JP5770106B2 (ja) * | 2009-02-16 | 2015-08-26 | サイテク・テクノロジー・コーポレーシヨン | 熱硬化性複合材料の落雷および電磁妨害遮蔽用共硬化性導電性表面フィルム |
| US20110014356A1 (en) * | 2009-06-12 | 2011-01-20 | Lord Corporation | Method for protecting a substrate from lightning strikes |
| KR101251121B1 (ko) * | 2009-09-16 | 2013-04-04 | 주식회사 엘지화학 | 유기 발광 표시 장치 봉지용 조성물, 접착 필름, 그 제조 방법 및 유기 발광 표시 장치 |
| US9480133B2 (en) * | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
| JP5742346B2 (ja) * | 2010-03-25 | 2015-07-01 | ヤマハ株式会社 | エポキシ樹脂系接着剤用硬化剤組成物および多孔質体用接着剤 |
| JP5916376B2 (ja) * | 2011-09-13 | 2016-05-11 | 株式会社タムラ製作所 | 接着剤組成物およびそれを用いた太陽電池セルと配線基板との接続方法 |
| CN102876270B (zh) * | 2012-09-20 | 2013-09-25 | 吴江市天源塑胶有限公司 | 一种高粘接强度的环氧树脂导电胶 |
| CN102898960A (zh) * | 2012-09-25 | 2013-01-30 | 苏州汾湖电梯有限公司 | 导电型胶黏剂 |
| CN103184023B (zh) * | 2013-03-01 | 2015-05-06 | 广东丹邦科技有限公司 | 一种微孔填充用导电银胶及其制备方法 |
| CN107922801B (zh) * | 2015-08-28 | 2020-06-19 | 杜邦公司 | 导电粘合剂 |
| US10611931B2 (en) | 2015-08-28 | 2020-04-07 | Dupont Electronics, Inc. | Electrically conductive adhesives |
| WO2017035709A1 (en) | 2015-08-28 | 2017-03-09 | E.I. Du Pont De Nemours And Company | Coated copper particles and use thereof |
| EP4249461A4 (en) * | 2020-11-20 | 2024-11-20 | Shin-Etsu Chemical Co., Ltd. | Phenol compound, electroconductive paste composition, method for producing electroconductive paste composition, and electroconductive wiring line and production method therefor |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3359145A (en) * | 1964-12-28 | 1967-12-19 | Monsanto Res Corp | Electrically conducting adhesive |
| US3371008A (en) * | 1965-12-17 | 1968-02-27 | Eugene F. Lopez | Metal adhesives containing epoxy resin, polyamide resin and phenolic flux |
| JPS6315807A (ja) * | 1986-07-04 | 1988-01-22 | Sannopuko Kk | 放射線交叉結合可能な組成物 |
| US5049313A (en) * | 1989-09-05 | 1991-09-17 | Advanced Products Inc. | Thermoset polymer thick film compositions and their use as electrical circuitry |
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5136365A (en) * | 1990-09-27 | 1992-08-04 | Motorola, Inc. | Anisotropic conductive adhesive and encapsulant material |
| JPH0542388A (ja) * | 1991-08-14 | 1993-02-23 | Nippon Genma:Kk | フラツクス組成物 |
| JP3506185B2 (ja) * | 1994-02-28 | 2004-03-15 | 日立化成工業株式会社 | 接着剤及び半導体装置 |
| JP3214685B2 (ja) * | 1994-12-22 | 2001-10-02 | 住友ベークライト株式会社 | 導電性樹脂ペースト |
| JPH0959586A (ja) * | 1995-08-21 | 1997-03-04 | Toray Ind Inc | 導電性接着剤組成物 |
| JP3689159B2 (ja) * | 1995-12-01 | 2005-08-31 | ナミックス株式会社 | 導電性接着剤およびそれを用いた回路 |
| JPH108006A (ja) * | 1996-06-26 | 1998-01-13 | Three Bond Co Ltd | 導電性接着剤組成物及び当該組成物で接続した電子部品 |
| JP4055215B2 (ja) * | 1996-10-21 | 2008-03-05 | 日立化成工業株式会社 | 接着剤組成物 |
| TW459032B (en) * | 1998-03-18 | 2001-10-11 | Sumitomo Bakelite Co | An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive |
| JP2000080341A (ja) * | 1998-06-22 | 2000-03-21 | Toshiba Chem Corp | 異方性導電接着剤および基板搭載デバイス |
| JP4239451B2 (ja) * | 2000-09-08 | 2009-03-18 | 住友ベークライト株式会社 | 多層配線板の製造方法および多層配線板 |
| JP2002201448A (ja) * | 2000-12-27 | 2002-07-19 | Ricoh Co Ltd | 導電性接着剤 |
| JP4928021B2 (ja) * | 2001-03-13 | 2012-05-09 | ナミックス株式会社 | 導電性接着剤およびそれを用いた回路 |
| US7108806B2 (en) * | 2003-02-28 | 2006-09-19 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability and good impact resistance for use in electronics devices |
-
2003
- 2003-09-18 JP JP2004569678A patent/JP2006514144A/ja active Pending
- 2003-09-18 AU AU2003270820A patent/AU2003270820A1/en not_active Abandoned
- 2003-09-18 WO PCT/US2003/029681 patent/WO2004083332A1/en not_active Ceased
- 2003-09-18 EP EP03752533A patent/EP1603985A1/en not_active Withdrawn
- 2003-09-18 KR KR1020057016742A patent/KR20050109977A/ko not_active Ceased
- 2003-09-18 US US10/546,057 patent/US20070018315A1/en not_active Abandoned
- 2003-09-18 CN CNA038261650A patent/CN1759155A/zh active Pending
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