JP2006503402A - 磁気記録ヘッドを接地する方法と装置 - Google Patents

磁気記録ヘッドを接地する方法と装置 Download PDF

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Publication number
JP2006503402A
JP2006503402A JP2005501627A JP2005501627A JP2006503402A JP 2006503402 A JP2006503402 A JP 2006503402A JP 2005501627 A JP2005501627 A JP 2005501627A JP 2005501627 A JP2005501627 A JP 2005501627A JP 2006503402 A JP2006503402 A JP 2006503402A
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JP
Japan
Prior art keywords
slider
suspension
ground
circuit
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005501627A
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English (en)
Japanese (ja)
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JP2006503402A5 (https=
Inventor
チャ，エリス
ワン，ポ−カン
ティアン，ホン
ヘルナンデス，マニュエル
タン，ヤウ−シン
フ，イエン
フ，ベン
Original Assignee
エスエーイー マグネティクス（エイチ．ケー．）リミティド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by エスエーイー マグネティクス（エイチ．ケー．）リミティド filed Critical エスエーイー マグネティクス（エイチ．ケー．）リミティド
Publication of JP2006503402A publication Critical patent/JP2006503402A/ja
Publication of JP2006503402A5 publication Critical patent/JP2006503402A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
JP2005501627A 2002-10-11 2003-10-14 磁気記録ヘッドを接地する方法と装置 Withdrawn JP2006503402A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41766502P 2002-10-11 2002-10-11
US10/414,233 US7064928B2 (en) 2002-10-11 2003-04-16 Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head
PCT/US2003/033074 WO2004038698A2 (en) 2002-10-11 2003-10-14 Method and apparatus for grounding a magnetic recording head

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009167823A Division JP2009238369A (ja) 2002-10-11 2009-07-16 磁気記録ヘッドを接地する方法と装置

Publications (2)

Publication Number Publication Date
JP2006503402A true JP2006503402A (ja) 2006-01-26
JP2006503402A5 JP2006503402A5 (https=) 2008-06-19

Family

ID=32073331

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2005501627A Withdrawn JP2006503402A (ja) 2002-10-11 2003-10-14 磁気記録ヘッドを接地する方法と装置
JP2009167823A Pending JP2009238369A (ja) 2002-10-11 2009-07-16 磁気記録ヘッドを接地する方法と装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2009167823A Pending JP2009238369A (ja) 2002-10-11 2009-07-16 磁気記録ヘッドを接地する方法と装置

Country Status (4)

Country Link
US (3) US7064928B2 (https=)
JP (2) JP2006503402A (https=)
AU (1) AU2003286477A1 (https=)
WO (1) WO2004038698A2 (https=)

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CN1145933C (zh) * 1998-11-13 2004-04-14 Tdk株式会社 写/读头支撑机构以及写/读系统
US7064928B2 (en) * 2002-10-11 2006-06-20 Sae Magnetics (H.K.) Ltd. Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head
JP3940688B2 (ja) * 2003-03-20 2007-07-04 Ｔｄｋ株式会社 ヘッドスライダ、ヘッドジンバルアセンブリ及びハードディスク装置
US7099117B1 (en) 2003-09-30 2006-08-29 Western Digital Technologies, Inc. Head stack assembly including a trace suspension assembly backing layer and a ground trace for grounding a slider
US7384531B1 (en) 2004-02-19 2008-06-10 Hutchinson Technology Incorporated Plated ground features for integrated lead suspensions
US7446977B2 (en) * 2005-01-26 2008-11-04 Hitachi Global Storage Technologies Netherlands B.V. Recording heads having electrical pads on multiple surfaces
JP2006331485A (ja) * 2005-05-24 2006-12-07 Hitachi Global Storage Technologies Netherlands Bv 磁気ヘッドスライダ及び磁気ヘッドアセンブリ
US7595963B1 (en) 2006-06-07 2009-09-29 Western Digital Technologies, Inc. Head gimbal assembly including a flexure with a first conductive trace disposed between a slider and a dielectric layer
WO2007148728A1 (ja) * 2006-06-22 2007-12-27 Dai Nippon Printing Co., Ltd. サスペンション用基板およびその製造方法
US7875804B1 (en) 2006-09-27 2011-01-25 Hutchinson Technology Incorporated Plated ground features for integrated lead suspensions
US7729089B1 (en) 2006-10-13 2010-06-01 Western Digital Technologies, Inc. Head-gimbal assembly including a flexure tongue with stand-offs arranged to facilitate lateral light entry
US7995310B1 (en) 2006-11-09 2011-08-09 Western Digital Technologies, Inc. Head-gimbal assembly including a flexure tongue with adhesive receptacles disposed adjacent to stand-offs
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US7710688B1 (en) 2007-02-06 2010-05-04 Hutchinson Technology Incorporated Split embedded signal transmission planes in integrated lead disk drive suspensions
US7924531B2 (en) * 2007-04-30 2011-04-12 Sae Magnetics (H. K) Ltd. Suspension and fabricating method thereof, head gimbal assembly and disk drive device
US8134807B2 (en) * 2007-06-01 2012-03-13 Texas Instruments Incorporated Thermally enhanced disk drive
US8213121B2 (en) * 2007-10-09 2012-07-03 Hitachi Global Storage Technologies, Netherlands B.V. HGA suspension pad barrier for elimination of solder bridging defect
US20090168247A1 (en) * 2007-12-28 2009-07-02 Christian Rene Bonhote Magnetic head with embedded solder connection and method for manufacture thereof
US8054584B2 (en) * 2008-11-26 2011-11-08 Seagate Technology Llc Top bond pad bias and variation control
US8120877B2 (en) * 2008-12-03 2012-02-21 Eun Kyu Jang Apparatus minimizing impedance in flex-to-printed circuit board connection through the disk base of a hard disk drive
US8542465B2 (en) 2010-03-17 2013-09-24 Western Digital Technologies, Inc. Suspension assembly having a microactuator electrically connected to a gold coating on a stainless steel surface
US8885299B1 (en) 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
US8339748B2 (en) 2010-06-29 2012-12-25 Western Digital Technologies, Inc. Suspension assembly having a microactuator bonded to a flexure
US8665567B2 (en) 2010-06-30 2014-03-04 Western Digital Technologies, Inc. Suspension assembly having a microactuator grounded to a flexure
US9165580B2 (en) 2013-12-10 2015-10-20 Western Digital Technologies, Inc. Disk drive head suspension tail with stiffened edge alignment features
US9324344B1 (en) 2013-12-10 2016-04-26 Western Digital Technologies, Inc. Disk drive head suspension tail with ground pad outside of bonding region
US8564909B1 (en) 2011-10-24 2013-10-22 Magnecomp Corporation Multilayer bond pads for hard disk drive suspensions
US9001469B2 (en) 2012-03-16 2015-04-07 Hutchinson Technology Incorporated Mid-loadbeam dual stage actuated (DSA) disk drive head suspension
JP2015518229A (ja) 2012-03-22 2015-06-25 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ ディスクドライブのヘッドサスペンションのフレクシャ用接地形体
JP2013206476A (ja) * 2012-03-27 2013-10-07 Tdk Corp 磁気ヘッドおよび磁気記録再生装置
JP6251745B2 (ja) 2012-09-14 2017-12-20 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ ２段始動構造部を有するジンバル形撓み部材及びサスペンション
JP6356682B2 (ja) 2012-10-10 2018-07-11 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 二段作動構造を有するサスペンション
US8941951B2 (en) 2012-11-28 2015-01-27 Hutchinson Technology Incorporated Head suspension flexure with integrated strain sensor and sputtered traces
US8891206B2 (en) 2012-12-17 2014-11-18 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener
US8896969B1 (en) 2013-05-23 2014-11-25 Hutchinson Technology Incorporated Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners
US8717712B1 (en) 2013-07-15 2014-05-06 Hutchinson Technology Incorporated Disk drive suspension assembly having a partially flangeless load point dimple
US9330695B1 (en) 2013-12-10 2016-05-03 Western Digital Technologies, Inc. Disk drive head suspension tail with a noble metal layer disposed on a plurality of structural backing islands
US8896970B1 (en) 2013-12-31 2014-11-25 Hutchinson Technology Incorporated Balanced co-located gimbal-based dual stage actuation disk drive suspensions
US8867173B1 (en) 2014-01-03 2014-10-21 Hutchinson Technology Incorporated Balanced multi-trace transmission in a hard disk drive flexure
US8934199B1 (en) 2014-03-31 2015-01-13 Western Digital Technologies, Inc. Disk drive head suspension tail with bond pad edge alignment features
US9171561B1 (en) 2014-05-14 2015-10-27 Seagate Technology Llc Assemblies and methods for slider electrical connection containing through circuit electrical connections
US9202479B1 (en) 2014-12-04 2015-12-01 Seagate Technology Llc Heat assisted magnetic recording head with write coil heatsink
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
US9318136B1 (en) 2014-12-22 2016-04-19 Hutchinson Technology Incorporated Multilayer disk drive motors having out-of-plane bending
US9296188B1 (en) 2015-02-17 2016-03-29 Hutchinson Technology Incorporated Partial curing of a microactuator mounting adhesive in a disk drive suspension
US10074386B1 (en) 2015-05-19 2018-09-11 Seagate Technology Llc Magnetic writer coil incorporating integral cooling fins
JP6689294B2 (ja) 2015-06-30 2020-04-28 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造
US10032468B1 (en) 2015-11-06 2018-07-24 Seagate Technology Llc Heat-assisted magnetic recording head configured to conduct heat away from slider components to a substrate
US9646638B1 (en) 2016-05-12 2017-05-09 Hutchinson Technology Incorporated Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad
US10049693B2 (en) 2016-08-03 2018-08-14 Seagate Technology Llc Substrate heat channels for heat assisted magnetic recording for reader over writer transducer application
US10643645B2 (en) * 2018-09-24 2020-05-05 Seagate Technology Llc Slider with bondable surface opposite suspension trace
WO2022217549A1 (en) * 2021-04-15 2022-10-20 Aes Global Holdings Pte Ltd. Printed circuit board grounding

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Also Published As

Publication number Publication date
JP2009238369A (ja) 2009-10-15
AU2003286477A1 (en) 2004-05-13
AU2003286477A8 (en) 2004-05-13
US20040070880A1 (en) 2004-04-15
US8045295B2 (en) 2011-10-25
US7064928B2 (en) 2006-06-20
WO2004038698A2 (en) 2004-05-06
WO2004038698A3 (en) 2004-12-23
US20080253025A1 (en) 2008-10-16
US7391594B2 (en) 2008-06-24
US20060227461A1 (en) 2006-10-12
HK1087831A1 (zh) 2006-10-20

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