AU2003286477A1 - Method and apparatus for grounding a magnetic recording head - Google Patents

Method and apparatus for grounding a magnetic recording head

Info

Publication number
AU2003286477A1
AU2003286477A1 AU2003286477A AU2003286477A AU2003286477A1 AU 2003286477 A1 AU2003286477 A1 AU 2003286477A1 AU 2003286477 A AU2003286477 A AU 2003286477A AU 2003286477 A AU2003286477 A AU 2003286477A AU 2003286477 A1 AU2003286477 A1 AU 2003286477A1
Authority
AU
Australia
Prior art keywords
grounding
recording head
magnetic recording
magnetic
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003286477A
Other languages
English (en)
Other versions
AU2003286477A8 (en
Inventor
Ellis Cha
Yen Fu
Manuel Hernandez
Ben Hu
Yaw-Shing Tang
Hong Tian
Po-Kang Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAE Magnetics HK Ltd
Original Assignee
SAE Magnetics HK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SAE Magnetics HK Ltd filed Critical SAE Magnetics HK Ltd
Publication of AU2003286477A1 publication Critical patent/AU2003286477A1/en
Publication of AU2003286477A8 publication Critical patent/AU2003286477A8/xx
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
AU2003286477A 2002-10-11 2003-10-14 Method and apparatus for grounding a magnetic recording head Abandoned AU2003286477A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US41766502P 2002-10-11 2002-10-11
US60/417,665 2002-10-11
US10/414,233 2003-04-16
US10/414,233 US7064928B2 (en) 2002-10-11 2003-04-16 Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head
PCT/US2003/033074 WO2004038698A2 (en) 2002-10-11 2003-10-14 Method and apparatus for grounding a magnetic recording head

Publications (2)

Publication Number Publication Date
AU2003286477A1 true AU2003286477A1 (en) 2004-05-13
AU2003286477A8 AU2003286477A8 (en) 2004-05-13

Family

ID=32073331

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003286477A Abandoned AU2003286477A1 (en) 2002-10-11 2003-10-14 Method and apparatus for grounding a magnetic recording head

Country Status (4)

Country Link
US (3) US7064928B2 (https=)
JP (2) JP2006503402A (https=)
AU (1) AU2003286477A1 (https=)
WO (1) WO2004038698A2 (https=)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1145933C (zh) * 1998-11-13 2004-04-14 Tdk株式会社 写/读头支撑机构以及写/读系统
US7064928B2 (en) * 2002-10-11 2006-06-20 Sae Magnetics (H.K.) Ltd. Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head
JP3940688B2 (ja) * 2003-03-20 2007-07-04 Ｔｄｋ株式会社 ヘッドスライダ、ヘッドジンバルアセンブリ及びハードディスク装置
US7099117B1 (en) 2003-09-30 2006-08-29 Western Digital Technologies, Inc. Head stack assembly including a trace suspension assembly backing layer and a ground trace for grounding a slider
US7384531B1 (en) 2004-02-19 2008-06-10 Hutchinson Technology Incorporated Plated ground features for integrated lead suspensions
US7446977B2 (en) * 2005-01-26 2008-11-04 Hitachi Global Storage Technologies Netherlands B.V. Recording heads having electrical pads on multiple surfaces
JP2006331485A (ja) * 2005-05-24 2006-12-07 Hitachi Global Storage Technologies Netherlands Bv 磁気ヘッドスライダ及び磁気ヘッドアセンブリ
US7595963B1 (en) 2006-06-07 2009-09-29 Western Digital Technologies, Inc. Head gimbal assembly including a flexure with a first conductive trace disposed between a slider and a dielectric layer
WO2007148728A1 (ja) * 2006-06-22 2007-12-27 Dai Nippon Printing Co., Ltd. サスペンション用基板およびその製造方法
US7875804B1 (en) 2006-09-27 2011-01-25 Hutchinson Technology Incorporated Plated ground features for integrated lead suspensions
US7729089B1 (en) 2006-10-13 2010-06-01 Western Digital Technologies, Inc. Head-gimbal assembly including a flexure tongue with stand-offs arranged to facilitate lateral light entry
US7995310B1 (en) 2006-11-09 2011-08-09 Western Digital Technologies, Inc. Head-gimbal assembly including a flexure tongue with adhesive receptacles disposed adjacent to stand-offs
JP2008172012A (ja) * 2007-01-11 2008-07-24 Nitto Denko Corp 回路付サスペンション基板
US7710688B1 (en) 2007-02-06 2010-05-04 Hutchinson Technology Incorporated Split embedded signal transmission planes in integrated lead disk drive suspensions
US7924531B2 (en) * 2007-04-30 2011-04-12 Sae Magnetics (H. K) Ltd. Suspension and fabricating method thereof, head gimbal assembly and disk drive device
US8134807B2 (en) * 2007-06-01 2012-03-13 Texas Instruments Incorporated Thermally enhanced disk drive
US8213121B2 (en) * 2007-10-09 2012-07-03 Hitachi Global Storage Technologies, Netherlands B.V. HGA suspension pad barrier for elimination of solder bridging defect
US20090168247A1 (en) * 2007-12-28 2009-07-02 Christian Rene Bonhote Magnetic head with embedded solder connection and method for manufacture thereof
US8054584B2 (en) * 2008-11-26 2011-11-08 Seagate Technology Llc Top bond pad bias and variation control
US8120877B2 (en) * 2008-12-03 2012-02-21 Eun Kyu Jang Apparatus minimizing impedance in flex-to-printed circuit board connection through the disk base of a hard disk drive
US8542465B2 (en) 2010-03-17 2013-09-24 Western Digital Technologies, Inc. Suspension assembly having a microactuator electrically connected to a gold coating on a stainless steel surface
US8885299B1 (en) 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
US8339748B2 (en) 2010-06-29 2012-12-25 Western Digital Technologies, Inc. Suspension assembly having a microactuator bonded to a flexure
US8665567B2 (en) 2010-06-30 2014-03-04 Western Digital Technologies, Inc. Suspension assembly having a microactuator grounded to a flexure
US9165580B2 (en) 2013-12-10 2015-10-20 Western Digital Technologies, Inc. Disk drive head suspension tail with stiffened edge alignment features
US9324344B1 (en) 2013-12-10 2016-04-26 Western Digital Technologies, Inc. Disk drive head suspension tail with ground pad outside of bonding region
US8564909B1 (en) 2011-10-24 2013-10-22 Magnecomp Corporation Multilayer bond pads for hard disk drive suspensions
US9001469B2 (en) 2012-03-16 2015-04-07 Hutchinson Technology Incorporated Mid-loadbeam dual stage actuated (DSA) disk drive head suspension
JP2015518229A (ja) 2012-03-22 2015-06-25 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ ディスクドライブのヘッドサスペンションのフレクシャ用接地形体
JP2013206476A (ja) * 2012-03-27 2013-10-07 Tdk Corp 磁気ヘッドおよび磁気記録再生装置
JP6251745B2 (ja) 2012-09-14 2017-12-20 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ ２段始動構造部を有するジンバル形撓み部材及びサスペンション
JP6356682B2 (ja) 2012-10-10 2018-07-11 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 二段作動構造を有するサスペンション
US8941951B2 (en) 2012-11-28 2015-01-27 Hutchinson Technology Incorporated Head suspension flexure with integrated strain sensor and sputtered traces
US8891206B2 (en) 2012-12-17 2014-11-18 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener
US8896969B1 (en) 2013-05-23 2014-11-25 Hutchinson Technology Incorporated Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners
US8717712B1 (en) 2013-07-15 2014-05-06 Hutchinson Technology Incorporated Disk drive suspension assembly having a partially flangeless load point dimple
US9330695B1 (en) 2013-12-10 2016-05-03 Western Digital Technologies, Inc. Disk drive head suspension tail with a noble metal layer disposed on a plurality of structural backing islands
US8896970B1 (en) 2013-12-31 2014-11-25 Hutchinson Technology Incorporated Balanced co-located gimbal-based dual stage actuation disk drive suspensions
US8867173B1 (en) 2014-01-03 2014-10-21 Hutchinson Technology Incorporated Balanced multi-trace transmission in a hard disk drive flexure
US8934199B1 (en) 2014-03-31 2015-01-13 Western Digital Technologies, Inc. Disk drive head suspension tail with bond pad edge alignment features
US9171561B1 (en) 2014-05-14 2015-10-27 Seagate Technology Llc Assemblies and methods for slider electrical connection containing through circuit electrical connections
US9202479B1 (en) 2014-12-04 2015-12-01 Seagate Technology Llc Heat assisted magnetic recording head with write coil heatsink
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
US9318136B1 (en) 2014-12-22 2016-04-19 Hutchinson Technology Incorporated Multilayer disk drive motors having out-of-plane bending
US9296188B1 (en) 2015-02-17 2016-03-29 Hutchinson Technology Incorporated Partial curing of a microactuator mounting adhesive in a disk drive suspension
US10074386B1 (en) 2015-05-19 2018-09-11 Seagate Technology Llc Magnetic writer coil incorporating integral cooling fins
JP6689294B2 (ja) 2015-06-30 2020-04-28 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造
US10032468B1 (en) 2015-11-06 2018-07-24 Seagate Technology Llc Heat-assisted magnetic recording head configured to conduct heat away from slider components to a substrate
US9646638B1 (en) 2016-05-12 2017-05-09 Hutchinson Technology Incorporated Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad
US10049693B2 (en) 2016-08-03 2018-08-14 Seagate Technology Llc Substrate heat channels for heat assisted magnetic recording for reader over writer transducer application
US10643645B2 (en) * 2018-09-24 2020-05-05 Seagate Technology Llc Slider with bondable surface opposite suspension trace
WO2022217549A1 (en) * 2021-04-15 2022-10-20 Aes Global Holdings Pte Ltd. Printed circuit board grounding

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03238616A (ja) 1990-02-16 1991-10-24 Mitsubishi Electric Corp 磁気ヘッド支持機構
US5055969A (en) * 1990-09-28 1991-10-08 Seagate Technology, Inc. Servo/data actuator arm flexible circuit
JPH08111015A (ja) * 1994-09-01 1996-04-30 Tdk Corp 磁気ヘッドスライダの支持装置及び磁気ヘッド装置
JPH08339644A (ja) * 1995-06-06 1996-12-24 Hewlett Packard Co <Hp> 剛性アクチュエータアーム構造を有するディスク装置
JP3238616B2 (ja) 1995-09-29 2001-12-17 松下電器産業株式会社 半導体スイッチ回路
JPH10149520A (ja) * 1996-11-15 1998-06-02 Sony Corp 導電体の形成方法及び磁気ヘッドの製造方法
JPH1116125A (ja) 1997-06-26 1999-01-22 Matsushita Electric Ind Co Ltd 磁気ヘッドユニットとその製造法並びに磁気記録再生装置
US5896248A (en) * 1997-09-05 1999-04-20 Read-Rite Corporation Bond pads for metal welding of flexure to air bearing slider and grounding configuration thereof
CN1145933C (zh) * 1998-11-13 2004-04-14 Tdk株式会社 写/读头支撑机构以及写/读系统
US6249404B1 (en) * 1999-02-04 2001-06-19 Read-Rite Corporation Head gimbal assembly with a flexible printed circuit having a serpentine substrate
JP2000306225A (ja) 1999-04-20 2000-11-02 Alps Electric Co Ltd 磁気ヘッド及び磁気ヘッドの製造方法
JP3756729B2 (ja) * 1999-07-16 2006-03-15 Ｔｄｋ株式会社 薄膜磁気ヘッドおよびその製造方法
US6671128B2 (en) * 2001-03-29 2003-12-30 Seagate Technology Llc Recording head with oppositely directed microstrip waveguide conductors to induce a magnetic write field for longitudinal or perpendicular magnetic recording
US20030128474A1 (en) * 2001-11-09 2003-07-10 Schulz Kevin J. Low electrical impedance slider grounding
US7064928B2 (en) * 2002-10-11 2006-06-20 Sae Magnetics (H.K.) Ltd. Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head

Also Published As

Publication number Publication date
JP2009238369A (ja) 2009-10-15
JP2006503402A (ja) 2006-01-26
AU2003286477A8 (en) 2004-05-13
US20040070880A1 (en) 2004-04-15
US8045295B2 (en) 2011-10-25
US7064928B2 (en) 2006-06-20
WO2004038698A2 (en) 2004-05-06
WO2004038698A3 (en) 2004-12-23
US20080253025A1 (en) 2008-10-16
US7391594B2 (en) 2008-06-24
US20060227461A1 (en) 2006-10-12
HK1087831A1 (zh) 2006-10-20

Similar Documents

Publication Publication Date Title
AU2003286477A1 (en) Method and apparatus for grounding a magnetic recording head
AU2002329215A1 (en) Methods and apparatus for advanced recording options on a personal versatile recorder
AU2002225402A1 (en) Information recording apparatus and method
AU2003295475A1 (en) A method and apparatus for information surveying
AU2003201508A1 (en) Method and apparatus for controlling a media player based on a non-user event
AU2003242927A1 (en) A method and apparatus for measuring the quality of video data
AU2003267242A1 (en) Method and apparatus for encoding data
AU2003258281A1 (en) Method and apparatus for receiving a removable media member
AU2003280862A1 (en) Recording/reproduction method and recording/reproduction device
AU2003274764A1 (en) Recording method and recording apparatus
EP1486966B8 (en) Data recording / reproducing apparatus and method using needle-shaped member
AU2003248753A1 (en) Method and apparatus for reference data scrubbing
EP1327982A2 (en) Data playback apparatus and method
AU2003220450A1 (en) A method and apparatus for precise signal interpolation
AU2003219449A1 (en) Device and method for recording information
AU7545300A (en) Apparatus and method for recording and reproducing data
AU2003277629A1 (en) Recording/reproduction device and method
SG103906A1 (en) Method and apparatus for head positioning control in a disk drive
AU2003273878A1 (en) Method and apparatus for recording a data stream on a storage medium
AU6215200A (en) Method and apparatus for testing magnetic head elements
AU2003205248A1 (en) Method and apparatus for a nack-protocol
SG110032A1 (en) Reproducing method, reproducing apparatus, recording method, and recording apparatus
AU2003224964A1 (en) Method and interface for controlling a digital recording apparatus
SG96695A1 (en) Assembly method and assembly apparatus for disk recording apparatus
AU2002236170A1 (en) Method and apparatus for replaying a recording medium

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase