JP2006346856A - 二次研磨媒体容積制御溝を有するケミカルメカニカル研磨パッド - Google Patents

二次研磨媒体容積制御溝を有するケミカルメカニカル研磨パッド Download PDF

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Publication number
JP2006346856A
JP2006346856A JP2006166826A JP2006166826A JP2006346856A JP 2006346856 A JP2006346856 A JP 2006346856A JP 2006166826 A JP2006166826 A JP 2006166826A JP 2006166826 A JP2006166826 A JP 2006166826A JP 2006346856 A JP2006346856 A JP 2006346856A
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JP
Japan
Prior art keywords
polishing
grooves
pad
groove
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006166826A
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English (en)
Japanese (ja)
Other versions
JP2006346856A5 (enExample
Inventor
Jeffrey J Hendron
ジェフリー・ジェイ・ヘンドロン
Gregory P Muldowney
グレゴリー・ピー・ムルダウニー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2006346856A publication Critical patent/JP2006346856A/ja
Publication of JP2006346856A5 publication Critical patent/JP2006346856A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2006166826A 2005-06-16 2006-06-16 二次研磨媒体容積制御溝を有するケミカルメカニカル研磨パッド Pending JP2006346856A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69132105P 2005-06-16 2005-06-16

Publications (2)

Publication Number Publication Date
JP2006346856A true JP2006346856A (ja) 2006-12-28
JP2006346856A5 JP2006346856A5 (enExample) 2009-07-09

Family

ID=37643214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006166826A Pending JP2006346856A (ja) 2005-06-16 2006-06-16 二次研磨媒体容積制御溝を有するケミカルメカニカル研磨パッド

Country Status (2)

Country Link
US (1) US7807252B2 (enExample)
JP (1) JP2006346856A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010274338A (ja) * 2009-05-26 2010-12-09 Kuraray Co Ltd 研磨装置及び研磨パッドの固定方法
JP2014124718A (ja) * 2012-12-26 2014-07-07 Toyo Tire & Rubber Co Ltd 積層研磨パッドの製造方法

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9308620B2 (en) * 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
US10189143B2 (en) * 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
CN114126803B (zh) 2019-05-07 2024-07-16 Cmc材料有限责任公司 具有固定沟槽体积的化学机械平坦化垫
CN110253423A (zh) * 2019-07-11 2019-09-20 德淮半导体有限公司 一种研磨垫
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
TWI812936B (zh) * 2021-04-01 2023-08-21 智勝科技股份有限公司 研磨墊及研磨方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1010062A (ja) * 1996-03-15 1998-01-16 Dylog It Spa ガラス容器及び／又は缶のための非破壊ｘ線検査装置
JP2002192455A (ja) * 2000-12-25 2002-07-10 Toyobo Co Ltd 研磨パッド
JP2004074314A (ja) * 2002-08-12 2004-03-11 Nikon Corp 研磨体、この研磨体を備えた研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの半導体デバイス製造方法により製造された半導体デバイス
JP2004202666A (ja) * 2002-12-26 2004-07-22 Sony Corp 研磨装置、研磨部材、および研磨方法
JP2004345048A (ja) * 2003-05-23 2004-12-09 Jsr Corp 研磨パッド
JP2005294410A (ja) * 2004-03-31 2005-10-20 Toyo Tire & Rubber Co Ltd 研磨パッド

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3042593B2 (ja) 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US6093651A (en) * 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
US6331137B1 (en) * 1998-08-28 2001-12-18 Advanced Micro Devices, Inc Polishing pad having open area which varies with distance from initial pad surface
US6626740B2 (en) * 1999-12-23 2003-09-30 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
US20040259479A1 (en) 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1010062A (ja) * 1996-03-15 1998-01-16 Dylog It Spa ガラス容器及び／又は缶のための非破壊ｘ線検査装置
JP2002192455A (ja) * 2000-12-25 2002-07-10 Toyobo Co Ltd 研磨パッド
JP2004074314A (ja) * 2002-08-12 2004-03-11 Nikon Corp 研磨体、この研磨体を備えた研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの半導体デバイス製造方法により製造された半導体デバイス
JP2004202666A (ja) * 2002-12-26 2004-07-22 Sony Corp 研磨装置、研磨部材、および研磨方法
JP2004345048A (ja) * 2003-05-23 2004-12-09 Jsr Corp 研磨パッド
JP2005294410A (ja) * 2004-03-31 2005-10-20 Toyo Tire & Rubber Co Ltd 研磨パッド

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010274338A (ja) * 2009-05-26 2010-12-09 Kuraray Co Ltd 研磨装置及び研磨パッドの固定方法
JP2014124718A (ja) * 2012-12-26 2014-07-07 Toyo Tire & Rubber Co Ltd 積層研磨パッドの製造方法

Also Published As

Publication number Publication date
US20060286350A1 (en) 2006-12-21
US7807252B2 (en) 2010-10-05

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