JP2006346856A5 - - Google Patents

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Publication number
JP2006346856A5
JP2006346856A5 JP2006166826A JP2006166826A JP2006346856A5 JP 2006346856 A5 JP2006346856 A5 JP 2006346856A5 JP 2006166826 A JP2006166826 A JP 2006166826A JP 2006166826 A JP2006166826 A JP 2006166826A JP 2006346856 A5 JP2006346856 A5 JP 2006346856A5
Authority
JP
Japan
Prior art keywords
polishing
grooves
primary
groove
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006166826A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006346856A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2006346856A publication Critical patent/JP2006346856A/ja
Publication of JP2006346856A5 publication Critical patent/JP2006346856A5/ja
Pending legal-status Critical Current

Links

JP2006166826A 2005-06-16 2006-06-16 二次研磨媒体容積制御溝を有するケミカルメカニカル研磨パッド Pending JP2006346856A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69132105P 2005-06-16 2005-06-16

Publications (2)

Publication Number Publication Date
JP2006346856A JP2006346856A (ja) 2006-12-28
JP2006346856A5 true JP2006346856A5 (enExample) 2009-07-09

Family

ID=37643214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006166826A Pending JP2006346856A (ja) 2005-06-16 2006-06-16 二次研磨媒体容積制御溝を有するケミカルメカニカル研磨パッド

Country Status (2)

Country Link
US (1) US7807252B2 (enExample)
JP (1) JP2006346856A (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
JP5600400B2 (ja) * 2009-05-26 2014-10-01 株式会社クラレ 研磨装置及び研磨パッドの固定方法
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
JP2014124718A (ja) * 2012-12-26 2014-07-07 Toyo Tire & Rubber Co Ltd 積層研磨パッドの製造方法
US9308620B2 (en) * 2013-09-18 2016-04-12 Texas Instruments Incorporated Permeated grooving in CMP polishing pads
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
US10189143B2 (en) * 2015-11-30 2019-01-29 Taiwan Semiconductor Manufacturing Company Limited Polishing pad, method for manufacturing polishing pad, and polishing method
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
CN114126803B (zh) 2019-05-07 2024-07-16 Cmc材料有限责任公司 具有固定沟槽体积的化学机械平坦化垫
CN110253423A (zh) * 2019-07-11 2019-09-20 德淮半导体有限公司 一种研磨垫
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
TWI812936B (zh) * 2021-04-01 2023-08-21 智勝科技股份有限公司 研磨墊及研磨方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3042593B2 (ja) 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
IT1285008B1 (it) * 1996-03-15 1998-06-03 Dylog Italia S R L Macchina di ispezione non distruttiva a raggi x per l'industria alimentare
US6093651A (en) * 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
US6331137B1 (en) * 1998-08-28 2001-12-18 Advanced Micro Devices, Inc Polishing pad having open area which varies with distance from initial pad surface
US6626740B2 (en) * 1999-12-23 2003-09-30 Rodel Holdings, Inc. Self-leveling pads and methods relating thereto
JP2002192455A (ja) * 2000-12-25 2002-07-10 Toyobo Co Ltd 研磨パッド
JP2004074314A (ja) * 2002-08-12 2004-03-11 Nikon Corp 研磨体、この研磨体を備えた研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの半導体デバイス製造方法により製造された半導体デバイス
JP2004202666A (ja) * 2002-12-26 2004-07-22 Sony Corp 研磨装置、研磨部材、および研磨方法
JP4292025B2 (ja) * 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
US20040259479A1 (en) 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
JP4616571B2 (ja) * 2004-03-31 2011-01-19 東洋ゴム工業株式会社 研磨パッド

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