JP2006289605A5 - - Google Patents

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Publication number
JP2006289605A5
JP2006289605A5 JP2006109276A JP2006109276A JP2006289605A5 JP 2006289605 A5 JP2006289605 A5 JP 2006289605A5 JP 2006109276 A JP2006109276 A JP 2006109276A JP 2006109276 A JP2006109276 A JP 2006109276A JP 2006289605 A5 JP2006289605 A5 JP 2006289605A5
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JP
Japan
Prior art keywords
polishing
radial
sectional area
average cross
annular
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Application number
JP2006109276A
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English (en)
Japanese (ja)
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JP5089073B2 (ja
JP2006289605A (ja
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Publication of JP2006289605A publication Critical patent/JP2006289605A/ja
Publication of JP2006289605A5 publication Critical patent/JP2006289605A5/ja
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Publication of JP5089073B2 publication Critical patent/JP5089073B2/ja
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JP2006109276A 2005-04-12 2006-04-12 半径方向の偏った研磨パッド Active JP5089073B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67046605P 2005-04-12 2005-04-12
US60/670,466 2005-04-12

Publications (3)

Publication Number Publication Date
JP2006289605A JP2006289605A (ja) 2006-10-26
JP2006289605A5 true JP2006289605A5 (enExample) 2009-05-07
JP5089073B2 JP5089073B2 (ja) 2012-12-05

Family

ID=37054983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006109276A Active JP5089073B2 (ja) 2005-04-12 2006-04-12 半径方向の偏った研磨パッド

Country Status (7)

Country Link
US (1) US7255633B2 (enExample)
JP (1) JP5089073B2 (enExample)
KR (1) KR101279819B1 (enExample)
CN (1) CN100515685C (enExample)
DE (1) DE102006016312B4 (enExample)
FR (1) FR2884164B1 (enExample)
TW (1) TWI372093B (enExample)

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JP2008062367A (ja) * 2006-09-11 2008-03-21 Nec Electronics Corp 研磨装置、研磨パッド、研磨方法
TWI455795B (zh) * 2007-10-18 2014-10-11 Iv Technologies Co Ltd 研磨墊及研磨方法
US7927092B2 (en) 2007-12-31 2011-04-19 Corning Incorporated Apparatus for forming a slurry polishing pad
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
WO2009139401A1 (ja) * 2008-05-16 2009-11-19 東レ株式会社 研磨パッド
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
JP5544124B2 (ja) * 2009-08-18 2014-07-09 富士紡ホールディングス株式会社 研磨パッド
US8562272B2 (en) 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
JP5839163B2 (ja) * 2010-07-12 2016-01-06 Jsr株式会社 化学機械研磨パッドおよび化学機械研磨方法
US20140054266A1 (en) * 2012-08-24 2014-02-27 Wiechang Jin Compositions and methods for selective polishing of platinum and ruthenium materials
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
SG11201704838TA (en) * 2014-12-22 2017-07-28 3M Innovative Properties Co Abrasive articles with removable abrasive member and methods of separating and replacing thereof
KR102535628B1 (ko) * 2016-03-24 2023-05-30 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
US10625393B2 (en) 2017-06-08 2020-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10654146B2 (en) 2018-01-23 2020-05-19 Seagate Technology Llc One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
CN110039380B (zh) * 2019-04-11 2020-12-01 上海理工大学 一种用于周期性微沟槽结构抛光的磁性复合流体抛光装置
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
CN117794687A (zh) * 2021-08-04 2024-03-29 株式会社可乐丽 抛光垫
CN114770371B (zh) * 2022-03-10 2023-08-25 宁波赢伟泰科新材料有限公司 一种高抛光液使用效率的抛光垫
CN114918824B (zh) * 2022-06-29 2024-08-20 万华化学集团电子材料有限公司 一种具有径向微沟槽的抛光垫
US20240139906A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Control of carrier head sweep and platen shape
WO2024257742A1 (ja) * 2023-06-12 2024-12-19 株式会社クラレ 研磨パッド、研磨方法及び半導体の製造方法
CN117325088A (zh) * 2023-09-20 2024-01-02 咸宁南玻光电玻璃有限公司 抛光海绵、抛光设备及玻璃抛光方法

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US5645469A (en) 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
US5885147A (en) 1997-05-12 1999-03-23 Integrated Process Equipment Corp. Apparatus for conditioning polishing pads
US5916010A (en) 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
US6027659A (en) 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
JP2001001253A (ja) * 1999-06-21 2001-01-09 Toray Ind Inc 研磨布
US6306008B1 (en) 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
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US6976907B2 (en) 2003-01-10 2005-12-20 Intel Corporation Polishing pad conditioning
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US6843711B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration

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