JP5089073B2 - 半径方向の偏った研磨パッド - Google Patents

半径方向の偏った研磨パッド Download PDF

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Publication number
JP5089073B2
JP5089073B2 JP2006109276A JP2006109276A JP5089073B2 JP 5089073 B2 JP5089073 B2 JP 5089073B2 JP 2006109276 A JP2006109276 A JP 2006109276A JP 2006109276 A JP2006109276 A JP 2006109276A JP 5089073 B2 JP5089073 B2 JP 5089073B2
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Japan
Prior art keywords
polishing
radial
groove
polishing pad
microchannels
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JP2006109276A
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English (en)
Japanese (ja)
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JP2006289605A (ja
JP2006289605A5 (enExample
Inventor
グレゴリー・ピー・ムルダウニー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
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DuPont Electronic Materials Holding Inc
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Publication date
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Publication of JP2006289605A publication Critical patent/JP2006289605A/ja
Publication of JP2006289605A5 publication Critical patent/JP2006289605A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/18—Paper- or board-based structures for surface covering
    • D21H27/20—Flexible structures being applied by the user, e.g. wallpaper
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/001—Release paper
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/30—Multi-ply
    • D21H27/32—Multi-ply with materials applied between the sheets
    • D21H27/34—Continuous materials, e.g. filaments, sheets, nets
    • D21H27/36—Films made from synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2006109276A 2005-04-12 2006-04-12 半径方向の偏った研磨パッド Active JP5089073B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67046605P 2005-04-12 2005-04-12
US60/670,466 2005-04-12

Publications (3)

Publication Number Publication Date
JP2006289605A JP2006289605A (ja) 2006-10-26
JP2006289605A5 JP2006289605A5 (enExample) 2009-05-07
JP5089073B2 true JP5089073B2 (ja) 2012-12-05

Family

ID=37054983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006109276A Active JP5089073B2 (ja) 2005-04-12 2006-04-12 半径方向の偏った研磨パッド

Country Status (7)

Country Link
US (1) US7255633B2 (enExample)
JP (1) JP5089073B2 (enExample)
KR (1) KR101279819B1 (enExample)
CN (1) CN100515685C (enExample)
DE (1) DE102006016312B4 (enExample)
FR (1) FR2884164B1 (enExample)
TW (1) TWI372093B (enExample)

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USD559066S1 (en) * 2004-10-26 2008-01-08 Jsr Corporation Polishing pad
JP2008062367A (ja) * 2006-09-11 2008-03-21 Nec Electronics Corp 研磨装置、研磨パッド、研磨方法
TWI455795B (zh) * 2007-10-18 2014-10-11 Iv Technologies Co Ltd 研磨墊及研磨方法
US7927092B2 (en) * 2007-12-31 2011-04-19 Corning Incorporated Apparatus for forming a slurry polishing pad
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
WO2009139401A1 (ja) * 2008-05-16 2009-11-19 東レ株式会社 研磨パッド
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
JP5544124B2 (ja) * 2009-08-18 2014-07-09 富士紡ホールディングス株式会社 研磨パッド
US8562272B2 (en) 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
JP5839163B2 (ja) * 2010-07-12 2016-01-06 Jsr株式会社 化学機械研磨パッドおよび化学機械研磨方法
US20140054266A1 (en) * 2012-08-24 2014-02-27 Wiechang Jin Compositions and methods for selective polishing of platinum and ruthenium materials
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
WO2016106020A1 (en) * 2014-12-22 2016-06-30 3M Innovative Properties Company Abrasive articles with removable abrasive member and methods of separating and replacing thereof
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
WO2017165216A1 (en) * 2016-03-24 2017-09-28 Applied Materials, Inc. Textured small pad for chemical mechanical polishing
US10625393B2 (en) 2017-06-08 2020-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10654146B2 (en) 2018-01-23 2020-05-19 Seagate Technology Llc One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
CN110039380B (zh) * 2019-04-11 2020-12-01 上海理工大学 一种用于周期性微沟槽结构抛光的磁性复合流体抛光装置
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
EP4382250A4 (en) * 2021-08-04 2025-06-11 Kuraray Co., Ltd. POLISHING CUSHION
CN114770371B (zh) * 2022-03-10 2023-08-25 宁波赢伟泰科新材料有限公司 一种高抛光液使用效率的抛光垫
CN114918824B (zh) * 2022-06-29 2024-08-20 万华化学集团电子材料有限公司 一种具有径向微沟槽的抛光垫
US20240139906A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Control of carrier head sweep and platen shape
WO2024257742A1 (ja) * 2023-06-12 2024-12-19 株式会社クラレ 研磨パッド、研磨方法及び半導体の製造方法
CN117325088A (zh) * 2023-09-20 2024-01-02 咸宁南玻光电玻璃有限公司 抛光海绵、抛光设备及玻璃抛光方法

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US5081051A (en) * 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5456627A (en) 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5785585A (en) * 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US5611943A (en) * 1995-09-29 1997-03-18 Intel Corporation Method and apparatus for conditioning of chemical-mechanical polishing pads
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US5938507A (en) 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
US5645469A (en) * 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
US5885147A (en) * 1997-05-12 1999-03-23 Integrated Process Equipment Corp. Apparatus for conditioning polishing pads
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
JP2001001253A (ja) * 1999-06-21 2001-01-09 Toray Ind Inc 研磨布
US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6626743B1 (en) * 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
WO2001091969A2 (en) 2000-05-31 2001-12-06 Philips Semiconductors, Inc. Polishing methods and apparatus for semiconductor and integrated circuit manufacture
JP2002100592A (ja) * 2000-09-20 2002-04-05 Rodel Nitta Co 研磨パッド
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
JP2003145413A (ja) * 2001-10-31 2003-05-20 Applied Materials Inc 研磨パッド
JP2003303793A (ja) * 2002-04-12 2003-10-24 Hitachi Ltd 研磨装置および半導体装置の製造方法
JP2004167605A (ja) * 2002-11-15 2004-06-17 Rodel Nitta Co 研磨パッドおよび研磨装置
US6976907B2 (en) * 2003-01-10 2005-12-20 Intel Corporation Polishing pad conditioning
JPWO2005023487A1 (ja) * 2003-08-29 2007-10-04 東邦エンジニアリング株式会社 研磨パッドおよびその製造方法と製造装置
US7591713B2 (en) * 2003-09-26 2009-09-22 Shin-Etsu Handotai Co., Ltd. Polishing pad, method for processing polishing pad, and method for producing substrate using it
US6843711B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration

Also Published As

Publication number Publication date
US7255633B2 (en) 2007-08-14
JP2006289605A (ja) 2006-10-26
KR20060108211A (ko) 2006-10-17
CN1846940A (zh) 2006-10-18
TW200642797A (en) 2006-12-16
KR101279819B1 (ko) 2013-06-28
CN100515685C (zh) 2009-07-22
US20060229002A1 (en) 2006-10-12
DE102006016312A1 (de) 2006-10-19
FR2884164B1 (fr) 2014-04-11
TWI372093B (en) 2012-09-11
DE102006016312B4 (de) 2018-10-31
FR2884164A1 (fr) 2006-10-13

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