KR101279819B1 - 방사-편향 연마 패드 - Google Patents

방사-편향 연마 패드 Download PDF

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Publication number
KR101279819B1
KR101279819B1 KR1020060025061A KR20060025061A KR101279819B1 KR 101279819 B1 KR101279819 B1 KR 101279819B1 KR 1020060025061 A KR1020060025061 A KR 1020060025061A KR 20060025061 A KR20060025061 A KR 20060025061A KR 101279819 B1 KR101279819 B1 KR 101279819B1
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KR
South Korea
Prior art keywords
polishing
radial
micro
grooves
polishing pad
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KR1020060025061A
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English (en)
Korean (ko)
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KR20060108211A (ko
Inventor
그레고리 피 멀도우니
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
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Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Publication of KR20060108211A publication Critical patent/KR20060108211A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/18—Paper- or board-based structures for surface covering
    • D21H27/20—Flexible structures being applied by the user, e.g. wallpaper
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/001—Release paper
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/30—Multi-ply
    • D21H27/32—Multi-ply with materials applied between the sheets
    • D21H27/34—Continuous materials, e.g. filaments, sheets, nets
    • D21H27/36—Films made from synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020060025061A 2005-04-12 2006-03-17 방사-편향 연마 패드 Active KR101279819B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67046605P 2005-04-12 2005-04-12
US60/670,466 2005-04-12

Publications (2)

Publication Number Publication Date
KR20060108211A KR20060108211A (ko) 2006-10-17
KR101279819B1 true KR101279819B1 (ko) 2013-06-28

Family

ID=37054983

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060025061A Active KR101279819B1 (ko) 2005-04-12 2006-03-17 방사-편향 연마 패드

Country Status (7)

Country Link
US (1) US7255633B2 (enExample)
JP (1) JP5089073B2 (enExample)
KR (1) KR101279819B1 (enExample)
CN (1) CN100515685C (enExample)
DE (1) DE102006016312B4 (enExample)
FR (1) FR2884164B1 (enExample)
TW (1) TWI372093B (enExample)

Cited By (1)

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WO2024092170A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Control of carrier head sweep and platen shape

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JP2008062367A (ja) * 2006-09-11 2008-03-21 Nec Electronics Corp 研磨装置、研磨パッド、研磨方法
TWI455795B (zh) * 2007-10-18 2014-10-11 Iv Technologies Co Ltd 研磨墊及研磨方法
US7927092B2 (en) * 2007-12-31 2011-04-19 Corning Incorporated Apparatus for forming a slurry polishing pad
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
WO2009139401A1 (ja) * 2008-05-16 2009-11-19 東レ株式会社 研磨パッド
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
JP5544124B2 (ja) * 2009-08-18 2014-07-09 富士紡ホールディングス株式会社 研磨パッド
US8562272B2 (en) 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
JP5839163B2 (ja) * 2010-07-12 2016-01-06 Jsr株式会社 化学機械研磨パッドおよび化学機械研磨方法
US20140054266A1 (en) * 2012-08-24 2014-02-27 Wiechang Jin Compositions and methods for selective polishing of platinum and ruthenium materials
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
WO2016106020A1 (en) * 2014-12-22 2016-06-30 3M Innovative Properties Company Abrasive articles with removable abrasive member and methods of separating and replacing thereof
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
WO2017165216A1 (en) * 2016-03-24 2017-09-28 Applied Materials, Inc. Textured small pad for chemical mechanical polishing
US10625393B2 (en) 2017-06-08 2020-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10777418B2 (en) * 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10654146B2 (en) 2018-01-23 2020-05-19 Seagate Technology Llc One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
CN110039380B (zh) * 2019-04-11 2020-12-01 上海理工大学 一种用于周期性微沟槽结构抛光的磁性复合流体抛光装置
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
EP4382250A4 (en) * 2021-08-04 2025-06-11 Kuraray Co., Ltd. POLISHING CUSHION
CN114770371B (zh) * 2022-03-10 2023-08-25 宁波赢伟泰科新材料有限公司 一种高抛光液使用效率的抛光垫
CN114918824B (zh) * 2022-06-29 2024-08-20 万华化学集团电子材料有限公司 一种具有径向微沟槽的抛光垫
WO2024257742A1 (ja) * 2023-06-12 2024-12-19 株式会社クラレ 研磨パッド、研磨方法及び半導体の製造方法
CN117325088A (zh) * 2023-09-20 2024-01-02 咸宁南玻光电玻璃有限公司 抛光海绵、抛光设备及玻璃抛光方法

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JPH09117855A (ja) * 1995-10-25 1997-05-06 Nec Corp 研磨パッド
JP2003303793A (ja) * 2002-04-12 2003-10-24 Hitachi Ltd 研磨装置および半導体装置の製造方法

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US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
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US5785585A (en) * 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US5611943A (en) * 1995-09-29 1997-03-18 Intel Corporation Method and apparatus for conditioning of chemical-mechanical polishing pads
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US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
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US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
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JPH09117855A (ja) * 1995-10-25 1997-05-06 Nec Corp 研磨パッド
JP2003303793A (ja) * 2002-04-12 2003-10-24 Hitachi Ltd 研磨装置および半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024092170A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Control of carrier head sweep and platen shape

Also Published As

Publication number Publication date
US7255633B2 (en) 2007-08-14
JP2006289605A (ja) 2006-10-26
KR20060108211A (ko) 2006-10-17
CN1846940A (zh) 2006-10-18
TW200642797A (en) 2006-12-16
CN100515685C (zh) 2009-07-22
US20060229002A1 (en) 2006-10-12
DE102006016312A1 (de) 2006-10-19
FR2884164B1 (fr) 2014-04-11
TWI372093B (en) 2012-09-11
DE102006016312B4 (de) 2018-10-31
JP5089073B2 (ja) 2012-12-05
FR2884164A1 (fr) 2006-10-13

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