TWI372093B - Radial-biased polishing pad - Google Patents

Radial-biased polishing pad

Info

Publication number
TWI372093B
TWI372093B TW095112634A TW95112634A TWI372093B TW I372093 B TWI372093 B TW I372093B TW 095112634 A TW095112634 A TW 095112634A TW 95112634 A TW95112634 A TW 95112634A TW I372093 B TWI372093 B TW I372093B
Authority
TW
Taiwan
Prior art keywords
radial
polishing pad
biased polishing
biased
pad
Prior art date
Application number
TW095112634A
Other languages
English (en)
Other versions
TW200642797A (en
Inventor
Gregory P Muldowney
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200642797A publication Critical patent/TW200642797A/zh
Application granted granted Critical
Publication of TWI372093B publication Critical patent/TWI372093B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/18—Paper- or board-based structures for surface covering
    • D21H27/20—Flexible structures being applied by the user, e.g. wallpaper
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/001—Release paper
    • D—TEXTILES; PAPER
    • D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
    • D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
    • D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
    • D21H27/30—Multi-ply
    • D21H27/32—Multi-ply with materials applied between the sheets
    • D21H27/34—Continuous materials, e.g. filaments, sheets, nets
    • D21H27/36—Films made from synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW095112634A 2005-04-12 2006-04-10 Radial-biased polishing pad TWI372093B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US67046605P 2005-04-12 2005-04-12

Publications (2)

Publication Number Publication Date
TW200642797A TW200642797A (en) 2006-12-16
TWI372093B true TWI372093B (en) 2012-09-11

Family

ID=37054983

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112634A TWI372093B (en) 2005-04-12 2006-04-10 Radial-biased polishing pad

Country Status (7)

Country Link
US (1) US7255633B2 (zh)
JP (1) JP5089073B2 (zh)
KR (1) KR101279819B1 (zh)
CN (1) CN100515685C (zh)
DE (1) DE102006016312B4 (zh)
FR (1) FR2884164B1 (zh)
TW (1) TWI372093B (zh)

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JP2008062367A (ja) * 2006-09-11 2008-03-21 Nec Electronics Corp 研磨装置、研磨パッド、研磨方法
TWI455795B (zh) * 2007-10-18 2014-10-11 Iv Technologies Co Ltd 研磨墊及研磨方法
US7927092B2 (en) 2007-12-31 2011-04-19 Corning Incorporated Apparatus for forming a slurry polishing pad
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
US20110045753A1 (en) * 2008-05-16 2011-02-24 Toray Industries, Inc. Polishing pad
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
JP5544124B2 (ja) * 2009-08-18 2014-07-09 富士紡ホールディングス株式会社 研磨パッド
US8562272B2 (en) * 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8282698B2 (en) * 2010-03-24 2012-10-09 Lam Research Corporation Reduction of particle contamination produced by moving mechanisms in a process tool
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
JP5839163B2 (ja) * 2010-07-12 2016-01-06 Jsr株式会社 化学機械研磨パッドおよび化学機械研磨方法
US20140054266A1 (en) * 2012-08-24 2014-02-27 Wiechang Jin Compositions and methods for selective polishing of platinum and ruthenium materials
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
JP2018501119A (ja) * 2014-12-22 2018-01-18 スリーエム イノベイティブ プロパティズ カンパニー 取り外し可能な研磨部材を有する研磨物品並びに取り外し可能な研磨部材を分離する方法及び交換する方法
US10589399B2 (en) * 2016-03-24 2020-03-17 Applied Materials, Inc. Textured small pad for chemical mechanical polishing
US10875146B2 (en) * 2016-03-24 2020-12-29 Rohm And Haas Electronic Materials Cmp Holdings Debris-removal groove for CMP polishing pad
US10625393B2 (en) 2017-06-08 2020-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US10857648B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Trapezoidal CMP groove pattern
US10857647B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings High-rate CMP polishing method
US10586708B2 (en) 2017-06-14 2020-03-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Uniform CMP polishing method
US10777418B2 (en) 2017-06-14 2020-09-15 Rohm And Haas Electronic Materials Cmp Holdings, I Biased pulse CMP groove pattern
US10861702B2 (en) 2017-06-14 2020-12-08 Rohm And Haas Electronic Materials Cmp Holdings Controlled residence CMP polishing method
US10654146B2 (en) 2018-01-23 2020-05-19 Seagate Technology Llc One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making
CN110039380B (zh) * 2019-04-11 2020-12-01 上海理工大学 一种用于周期性微沟槽结构抛光的磁性复合流体抛光装置
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
EP4382250A1 (en) * 2021-08-04 2024-06-12 Kuraray Co., Ltd. Polishing pad
CN114770371B (zh) * 2022-03-10 2023-08-25 宁波赢伟泰科新材料有限公司 一种高抛光液使用效率的抛光垫
CN114918824B (zh) * 2022-06-29 2024-08-20 万华化学集团电子材料有限公司 一种具有径向微沟槽的抛光垫
US20240139906A1 (en) * 2022-10-27 2024-05-02 Applied Materials, Inc. Control of carrier head sweep and platen shape

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US5081051A (en) 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5216843A (en) 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5456627A (en) 1993-12-20 1995-10-10 Westech Systems, Inc. Conditioner for a polishing pad and method therefor
US5785585A (en) 1995-09-18 1998-07-28 International Business Machines Corporation Polish pad conditioner with radial compensation
US5611943A (en) 1995-09-29 1997-03-18 Intel Corporation Method and apparatus for conditioning of chemical-mechanical polishing pads
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US5938507A (en) 1995-10-27 1999-08-17 Applied Materials, Inc. Linear conditioner apparatus for a chemical mechanical polishing system
US5645469A (en) 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
US5885147A (en) 1997-05-12 1999-03-23 Integrated Process Equipment Corp. Apparatus for conditioning polishing pads
US5916010A (en) 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
US6027659A (en) 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
JP2001001253A (ja) * 1999-06-21 2001-01-09 Toray Ind Inc 研磨布
US6306008B1 (en) 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
JP2003535462A (ja) 2000-05-31 2003-11-25 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 半導体及び集積回路を製造するための研磨方法及び装置
JP2002100592A (ja) * 2000-09-20 2002-04-05 Rodel Nitta Co 研磨パッド
US6767427B2 (en) 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
JP2003145413A (ja) * 2001-10-31 2003-05-20 Applied Materials Inc 研磨パッド
JP2003303793A (ja) * 2002-04-12 2003-10-24 Hitachi Ltd 研磨装置および半導体装置の製造方法
JP2004167605A (ja) * 2002-11-15 2004-06-17 Rodel Nitta Co 研磨パッドおよび研磨装置
US6976907B2 (en) 2003-01-10 2005-12-20 Intel Corporation Polishing pad conditioning
WO2005023487A1 (ja) * 2003-08-29 2005-03-17 Toho Engineering Kabushiki Kaisha 研磨パッドおよびその製造方法と製造装置
KR101128932B1 (ko) * 2003-09-26 2012-03-27 신에쯔 한도타이 가부시키가이샤 연마포와 연마포의 가공방법 및 그것을 이용한 기판의제조방법
US6843711B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration

Also Published As

Publication number Publication date
FR2884164B1 (fr) 2014-04-11
CN1846940A (zh) 2006-10-18
DE102006016312B4 (de) 2018-10-31
CN100515685C (zh) 2009-07-22
US20060229002A1 (en) 2006-10-12
DE102006016312A1 (de) 2006-10-19
KR101279819B1 (ko) 2013-06-28
KR20060108211A (ko) 2006-10-17
FR2884164A1 (fr) 2006-10-13
JP2006289605A (ja) 2006-10-26
TW200642797A (en) 2006-12-16
US7255633B2 (en) 2007-08-14
JP5089073B2 (ja) 2012-12-05

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