DE602005004220D1 - Polierkissen - Google Patents

Polierkissen

Info

Publication number
DE602005004220D1
DE602005004220D1 DE602005004220T DE602005004220T DE602005004220D1 DE 602005004220 D1 DE602005004220 D1 DE 602005004220D1 DE 602005004220 T DE602005004220 T DE 602005004220T DE 602005004220 T DE602005004220 T DE 602005004220T DE 602005004220 D1 DE602005004220 D1 DE 602005004220D1
Authority
DE
Germany
Prior art keywords
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005004220T
Other languages
English (en)
Other versions
DE602005004220T2 (de
Inventor
Fujio Sakurai
Tomoo Koumura
Yoshinori Igarashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of DE602005004220D1 publication Critical patent/DE602005004220D1/de
Application granted granted Critical
Publication of DE602005004220T2 publication Critical patent/DE602005004220T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/001—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as supporting member
    • B24D3/002—Flexible supporting members, e.g. paper, woven, plastic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)
DE602005004220T 2004-10-14 2005-10-11 Polierkissen Active DE602005004220T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004299522A JP4475404B2 (ja) 2004-10-14 2004-10-14 研磨パッド
JP2004299522 2004-10-14

Publications (2)

Publication Number Publication Date
DE602005004220D1 true DE602005004220D1 (de) 2008-02-21
DE602005004220T2 DE602005004220T2 (de) 2009-01-08

Family

ID=35453408

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005004220T Active DE602005004220T2 (de) 2004-10-14 2005-10-11 Polierkissen

Country Status (7)

Country Link
US (1) US7217179B2 (de)
EP (1) EP1647359B1 (de)
JP (1) JP4475404B2 (de)
KR (1) KR101189349B1 (de)
CN (1) CN1760240B (de)
DE (1) DE602005004220T2 (de)
TW (1) TWI379853B (de)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
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TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
WO2007034980A1 (ja) * 2005-09-22 2007-03-29 Kuraray Co., Ltd. 高分子材料、それから得られる発泡体及びこれらを用いた研磨パッド
US20070161720A1 (en) * 2005-11-30 2007-07-12 Applied Materials, Inc. Polishing Pad with Surface Roughness
JP4926548B2 (ja) * 2006-06-09 2012-05-09 株式会社クラレ 偏光フィルムの製造法
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
CN101681825B (zh) * 2007-03-20 2011-11-09 可乐丽股份有限公司 金属膜抛光用垫和使用该金属膜抛光用垫的金属膜的抛光方法
JP5879018B2 (ja) 2007-05-10 2016-03-08 日立マクセル株式会社 電気化学素子およびその製造方法
JP5072442B2 (ja) * 2007-06-07 2012-11-14 富士紡ホールディングス株式会社 研磨パッドの製造方法および研磨パッド
CN100506487C (zh) * 2007-06-29 2009-07-01 南京航空航天大学 具有自修正功能的固结磨料研磨抛光垫及制备方法
US20090062414A1 (en) * 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
TWI455795B (zh) * 2007-10-18 2014-10-11 Iv Technologies Co Ltd 研磨墊及研磨方法
CN101422882B (zh) * 2007-10-31 2015-05-20 智胜科技股份有限公司 研磨垫及研磨方法
US8052507B2 (en) * 2007-11-20 2011-11-08 Praxair Technology, Inc. Damping polyurethane CMP pads with microfillers
JP5347524B2 (ja) * 2008-01-24 2013-11-20 Ｊｓｒ株式会社 化学機械研磨パッドの研磨層形成用組成物、化学機械研磨パッドおよび化学機械研磨方法
JP5549111B2 (ja) * 2008-05-22 2014-07-16 Ｊｓｒ株式会社 化学機械研磨パッドの研磨層形成用組成物、化学機械研磨パッドおよび化学機械研磨方法
US20100035529A1 (en) * 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
IL196146A (en) 2008-12-23 2014-01-30 Elta Systems Ltd Signal transmission system and method back to the source of transmission
JP5393434B2 (ja) * 2008-12-26 2014-01-22 東洋ゴム工業株式会社 研磨パッド及びその製造方法
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
WO2010138724A1 (en) 2009-05-27 2010-12-02 Rogers Corporation Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer
KR101750775B1 (ko) 2009-06-29 2017-06-26 디아이씨 가부시끼가이샤 연마 패드용 2액형 우레탄 수지 조성물, 폴리우레탄 연마 패드, 및 폴리우레탄 연마 패드의 제조 방법
US8697239B2 (en) * 2009-07-24 2014-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-functional polishing pad
EP2517828A1 (de) * 2009-12-22 2012-10-31 JSR Corporation Kissen für chemisch-mechanisches polieren und chemisch-mechanisches polierverfahren damit
CN101892014A (zh) * 2010-08-24 2010-11-24 青岛沙木国际贸易有限公司 一种用于喷砂处理的弹性磨料
KR101491530B1 (ko) 2010-10-26 2015-02-09 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
WO2012056512A1 (ja) 2010-10-26 2012-05-03 東洋ゴム工業株式会社 研磨パッド及びその製造方法
TWI568541B (zh) * 2010-12-22 2017-02-01 Jsr Corp Chemical mechanical grinding method
JP5404673B2 (ja) * 2011-02-25 2014-02-05 株式会社東芝 Ｃｍｐ装置、研磨パッド及びｃｍｐ方法
JP5875300B2 (ja) * 2011-09-06 2016-03-02 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP5797981B2 (ja) * 2011-09-06 2015-10-21 東洋ゴム工業株式会社 研磨パッド
US8512427B2 (en) * 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
WO2014038704A1 (ja) * 2012-09-10 2014-03-13 住友精化株式会社 研磨助剤、及び該研磨助剤を含む研磨剤組成物
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
JP5661130B2 (ja) * 2013-01-31 2015-01-28 東洋ゴム工業株式会社 研磨パッド
US20140256231A1 (en) * 2013-03-07 2014-09-11 Dow Global Technologies Llc Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window
US9446497B2 (en) * 2013-03-07 2016-09-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
CN103878707B (zh) * 2014-03-31 2016-04-13 湖北鼎龙化学股份有限公司 化学机械抛光的抛光垫及其制备方法
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9586304B2 (en) * 2014-12-19 2017-03-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-expansion CMP PAD casting method
WO2017053685A1 (en) * 2015-09-25 2017-03-30 Cabot Microelectronics Corporation Polyurethane cmp pads having a high modulus ratio
JP6691658B2 (ja) * 2015-10-02 2020-05-13 富士紡ホールディングス株式会社 研磨パッド
JP6761566B2 (ja) * 2015-10-02 2020-09-30 富士紡ホールディングス株式会社 研磨パッド
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
CN106041719B (zh) * 2016-06-03 2018-10-23 湖北鼎龙控股股份有限公司 一种抛光层及其制备方法以及化学机械抛光垫
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
JP6732382B2 (ja) * 2016-10-12 2020-07-29 株式会社ディスコ 加工装置及び被加工物の加工方法
KR101949905B1 (ko) 2017-08-23 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
US10464187B2 (en) * 2017-12-01 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
CN109824854B (zh) * 2018-12-27 2021-09-28 湖北鼎汇微电子材料有限公司 一种抛光垫
JP7331453B2 (ja) * 2019-05-17 2023-08-23 Dic株式会社 多孔体の製造方法
US20210122007A1 (en) * 2019-10-23 2021-04-29 Skc Co., Ltd. Composition for polishing pad and polishing pad
KR102287235B1 (ko) * 2019-10-30 2021-08-06 에스케이씨솔믹스 주식회사 가교도가 조절된 연마패드 및 이의 제조방법
CN110877287A (zh) * 2019-12-10 2020-03-13 上海华力微电子有限公司 研磨系统
CN117024701B (zh) * 2023-08-14 2024-04-09 旭川化学（苏州）有限公司 一种聚氨酯发泡抛光材料及其制备方法和应用

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MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
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JP3668046B2 (ja) 1998-05-11 2005-07-06 株式会社東芝 研磨布及びこの研磨布を用いた半導体装置の製造方法
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JP3918359B2 (ja) 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
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JP3925041B2 (ja) 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
JP2002137160A (ja) 2000-08-24 2002-05-14 Toray Ind Inc 研磨用パッドおよび研磨装置ならびに研磨方法
US6706383B1 (en) * 2001-11-27 2004-03-16 Psiloquest, Inc. Polishing pad support that improves polishing performance and longevity
CN100496896C (zh) * 2000-12-01 2009-06-10 东洋橡膠工业株式会社 研磨垫
EP1354913B1 (de) * 2000-12-08 2016-10-26 Kuraray Co., Ltd. Thermoplastischer polyurethanschaumstoff, verfahren zu seiner herstellung und aus dem schaum hergestellte polierpads
JP2003064143A (ja) 2001-08-23 2003-03-05 Showa Denko Kk 研磨パッド用ウレタン成形物および研磨用パッド
KR100877383B1 (ko) * 2001-11-13 2009-01-07 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법

Also Published As

Publication number Publication date
EP1647359B1 (de) 2008-01-09
TWI379853B (en) 2012-12-21
US20060084365A1 (en) 2006-04-20
US7217179B2 (en) 2007-05-15
KR101189349B1 (ko) 2012-10-09
KR20060053261A (ko) 2006-05-19
CN1760240A (zh) 2006-04-19
JP4475404B2 (ja) 2010-06-09
EP1647359A1 (de) 2006-04-19
JP2006111700A (ja) 2006-04-27
DE602005004220T2 (de) 2009-01-08
CN1760240B (zh) 2010-06-16
TW200631999A (en) 2006-09-16

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Legal Events

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