DE602006001415D1 - Poliervorrichtung - Google Patents
PoliervorrichtungInfo
- Publication number
- DE602006001415D1 DE602006001415D1 DE602006001415T DE602006001415T DE602006001415D1 DE 602006001415 D1 DE602006001415 D1 DE 602006001415D1 DE 602006001415 T DE602006001415 T DE 602006001415T DE 602006001415 T DE602006001415 T DE 602006001415T DE 602006001415 D1 DE602006001415 D1 DE 602006001415D1
- Authority
- DE
- Germany
- Prior art keywords
- polisher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005106895A JP4642532B2 (ja) | 2005-04-01 | 2005-04-01 | 研磨装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602006001415D1 true DE602006001415D1 (de) | 2008-07-24 |
Family
ID=36615722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602006001415T Active DE602006001415D1 (de) | 2005-04-01 | 2006-03-30 | Poliervorrichtung |
Country Status (8)
Country | Link |
---|---|
US (1) | US7235001B2 (de) |
EP (1) | EP1707314B1 (de) |
JP (1) | JP4642532B2 (de) |
KR (1) | KR101228178B1 (de) |
CN (1) | CN100591480C (de) |
DE (1) | DE602006001415D1 (de) |
MY (1) | MY144252A (de) |
TW (1) | TWI377113B (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7644922B2 (en) * | 2004-06-14 | 2010-01-12 | Wms Gaming Inc. | Gaming terminal with transformable cabinet |
JP5033354B2 (ja) * | 2006-05-29 | 2012-09-26 | 不二越機械工業株式会社 | ワークセンタリング装置 |
JP2009194134A (ja) * | 2008-02-14 | 2009-08-27 | Ebara Corp | 研磨方法及び研磨装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4944119A (en) * | 1988-06-20 | 1990-07-31 | Westech Systems, Inc. | Apparatus for transporting wafer to and from polishing head |
US5885138A (en) * | 1993-09-21 | 1999-03-23 | Ebara Corporation | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
JP3580936B2 (ja) * | 1996-02-26 | 2004-10-27 | 株式会社荏原製作所 | ポリッシング装置のプッシャー及びポリッシング装置 |
US6312312B1 (en) * | 1997-10-20 | 2001-11-06 | Ebara Corporation | Polishing apparatus |
DE69825143T2 (de) * | 1997-11-21 | 2005-08-11 | Ebara Corp. | Vorrichtung zum polieren |
JPH11347992A (ja) | 1998-06-02 | 1999-12-21 | Komoda Kogyo:Kk | 配管切断システムおよびこのシステムにおいて使用されるコンピュータ読み取り可能な記録媒体 |
JP3675237B2 (ja) * | 1999-07-09 | 2005-07-27 | 株式会社東京精密 | 平面加工装置 |
US6358126B1 (en) * | 2000-05-23 | 2002-03-19 | Ebara Corporation | Polishing apparatus |
US6609950B2 (en) * | 2000-07-05 | 2003-08-26 | Ebara Corporation | Method for polishing a substrate |
JP2002184732A (ja) * | 2000-12-12 | 2002-06-28 | Ebara Corp | 受け渡し装置 |
JP3920720B2 (ja) * | 2002-03-29 | 2007-05-30 | 株式会社荏原製作所 | 基板受渡し方法、基板受渡し機構及び基板研磨装置 |
KR100472959B1 (ko) * | 2002-07-16 | 2005-03-10 | 삼성전자주식회사 | 언로딩구조가 개선된 반도체 웨이퍼의 표면평탄화설비 |
US7101253B2 (en) * | 2002-08-27 | 2006-09-05 | Applied Materials Inc. | Load cup for chemical mechanical polishing |
-
2005
- 2005-04-01 JP JP2005106895A patent/JP4642532B2/ja active Active
-
2006
- 2006-03-28 TW TW095110700A patent/TWI377113B/zh active
- 2006-03-29 KR KR1020060028228A patent/KR101228178B1/ko active IP Right Grant
- 2006-03-30 US US11/392,697 patent/US7235001B2/en active Active
- 2006-03-30 MY MYPI20061432A patent/MY144252A/en unknown
- 2006-03-30 EP EP06251753A patent/EP1707314B1/de active Active
- 2006-03-30 DE DE602006001415T patent/DE602006001415D1/de active Active
- 2006-04-03 CN CN200610074767A patent/CN100591480C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TWI377113B (en) | 2012-11-21 |
KR20060105511A (ko) | 2006-10-11 |
CN100591480C (zh) | 2010-02-24 |
JP2006281400A (ja) | 2006-10-19 |
KR101228178B1 (ko) | 2013-01-30 |
JP4642532B2 (ja) | 2011-03-02 |
EP1707314A1 (de) | 2006-10-04 |
US20060223421A1 (en) | 2006-10-05 |
TW200635705A (en) | 2006-10-16 |
EP1707314B1 (de) | 2008-06-11 |
US7235001B2 (en) | 2007-06-26 |
CN1840290A (zh) | 2006-10-04 |
MY144252A (en) | 2011-08-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |