DE602004022237D1 - Chemisch-mechanische Polierscheibe - Google Patents

Chemisch-mechanische Polierscheibe

Info

Publication number
DE602004022237D1
DE602004022237D1 DE602004022237T DE602004022237T DE602004022237D1 DE 602004022237 D1 DE602004022237 D1 DE 602004022237D1 DE 602004022237 T DE602004022237 T DE 602004022237T DE 602004022237 T DE602004022237 T DE 602004022237T DE 602004022237 D1 DE602004022237 D1 DE 602004022237D1
Authority
DE
Germany
Prior art keywords
chemical
polishing pad
mechanical polishing
mechanical
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004022237T
Other languages
English (en)
Inventor
Hiroyuki Miyauchi
Hiroshi Shiho
Nobuo Kawahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of DE602004022237D1 publication Critical patent/DE602004022237D1/de
Anticipated expiration legal-status Critical
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S451/00—Abrading
    • Y10S451/921—Pad for lens shaping tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
DE602004022237T 2003-11-04 2004-11-03 Chemisch-mechanische Polierscheibe Active DE602004022237D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003374855 2003-11-04

Publications (1)

Publication Number Publication Date
DE602004022237D1 true DE602004022237D1 (de) 2009-09-10

Family

ID=34431266

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004022237T Active DE602004022237D1 (de) 2003-11-04 2004-11-03 Chemisch-mechanische Polierscheibe

Country Status (6)

Country Link
US (1) US7442116B2 (de)
EP (1) EP1529598B1 (de)
KR (1) KR101314013B1 (de)
CN (1) CN100437924C (de)
DE (1) DE602004022237D1 (de)
TW (1) TWI337110B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3872081B2 (ja) * 2004-12-29 2007-01-24 東邦エンジニアリング株式会社 研磨用パッド
US20070149094A1 (en) * 2005-12-28 2007-06-28 Choi Jae Y Monitoring Device of Chemical Mechanical Polishing Apparatus
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
WO2012082388A2 (en) * 2010-12-16 2012-06-21 3M Innovative Properties Company Composite blocks with void spaces
US9211628B2 (en) * 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
CN102284916A (zh) * 2011-07-04 2011-12-21 南京航空航天大学 具有复合排屑结构的研磨抛光垫
CN102744676A (zh) * 2012-07-26 2012-10-24 上海宏力半导体制造有限公司 用于化学机械研磨的研磨垫以及化学机械研磨设备
US9259818B2 (en) 2012-11-06 2016-02-16 Sinmat, Inc. Smooth diamond surfaces and CMP method for forming
DE102015106441B4 (de) * 2015-04-27 2022-01-27 Infineon Technologies Ag Verfahren zum Planarisieren eines Halbleiterwafers
JP7113626B2 (ja) * 2018-01-12 2022-08-05 ニッタ・デュポン株式会社 研磨パッド
USD982256S1 (en) * 2021-01-20 2023-03-28 The Vetreska Pet Lifestyle Company Cat tree
USD982257S1 (en) * 2021-01-20 2023-03-28 The Vetreska Pet Lifestyle Company Cat tree

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5650039A (en) 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
JPH08216029A (ja) 1995-02-07 1996-08-27 Daiki:Kk 精密研磨シート
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JP3668046B2 (ja) 1998-05-11 2005-07-06 株式会社東芝 研磨布及びこの研磨布を用いた半導体装置の製造方法
JP3918359B2 (ja) 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
US6221298B1 (en) * 1998-11-17 2001-04-24 International Specialty Products, Llc Method and apparatus for manufacturing molded products
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US6699104B1 (en) * 1999-09-15 2004-03-02 Rodel Holdings, Inc. Elimination of trapped air under polishing pads
KR100336764B1 (ko) * 1999-10-20 2002-05-16 박종섭 화학 기계적 연마용 패드의 구조
JP3925041B2 (ja) 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
JP4686010B2 (ja) 2000-07-18 2011-05-18 ニッタ・ハース株式会社 研磨パッド
KR100641086B1 (ko) * 2001-02-08 2006-11-06 주식회사 하이닉스반도체 반도체소자의 화학기계적연마에 의한 스크래치 방지방법
EP1252973B1 (de) * 2001-04-25 2008-09-10 JSR Corporation Lichtduchlässiges Polierkissen für eine Halbleiterschleife
US20040259479A1 (en) * 2003-06-23 2004-12-23 Cabot Microelectronics Corporation Polishing pad for electrochemical-mechanical polishing
US6942549B2 (en) * 2003-10-29 2005-09-13 International Business Machines Corporation Two-sided chemical mechanical polishing pad for semiconductor processing
KR20080087012A (ko) * 2006-01-25 2008-09-29 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 그의 제조 방법

Also Published As

Publication number Publication date
US7442116B2 (en) 2008-10-28
US20050113011A1 (en) 2005-05-26
CN1614749A (zh) 2005-05-11
EP1529598B1 (de) 2009-07-29
KR20050042738A (ko) 2005-05-10
EP1529598A1 (de) 2005-05-11
TW200531784A (en) 2005-10-01
CN100437924C (zh) 2008-11-26
TWI337110B (en) 2011-02-11
KR101314013B1 (ko) 2013-10-01

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