JP2008507148A5 - - Google Patents
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- Publication number
- JP2008507148A5 JP2008507148A5 JP2007522519A JP2007522519A JP2008507148A5 JP 2008507148 A5 JP2008507148 A5 JP 2008507148A5 JP 2007522519 A JP2007522519 A JP 2007522519A JP 2007522519 A JP2007522519 A JP 2007522519A JP 2008507148 A5 JP2008507148 A5 JP 2008507148A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- grooves
- groove
- different
- rotation axis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims 10
- 230000007704 transition Effects 0.000 claims 8
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/894,915 US6958002B1 (en) | 2004-07-19 | 2004-07-19 | Polishing pad with flow modifying groove network |
| PCT/US2005/023433 WO2006019541A1 (en) | 2004-07-19 | 2005-06-30 | Polishing pad with flow modifying groove network |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008507148A JP2008507148A (ja) | 2008-03-06 |
| JP2008507148A5 true JP2008507148A5 (enExample) | 2008-07-24 |
Family
ID=34993068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007522519A Pending JP2008507148A (ja) | 2004-07-19 | 2005-06-30 | 流れ変更性溝ネットワークを有する研磨パッド |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6958002B1 (enExample) |
| JP (1) | JP2008507148A (enExample) |
| CN (1) | CN100528487C (enExample) |
| TW (1) | TW200609079A (enExample) |
| WO (1) | WO2006019541A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7270595B2 (en) * | 2004-05-27 | 2007-09-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with oscillating path groove network |
| US7131895B2 (en) * | 2005-01-13 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having a radially alternating groove segment configuration |
| US7182677B2 (en) * | 2005-01-14 | 2007-02-27 | Applied Materials, Inc. | Chemical mechanical polishing pad for controlling polishing slurry distribution |
| US7137872B1 (en) * | 2005-09-30 | 2006-11-21 | Tcg International Inc. | Scratch removal device and method |
| JP4712539B2 (ja) * | 2005-11-24 | 2011-06-29 | ニッタ・ハース株式会社 | 研磨パッド |
| US7520798B2 (en) * | 2007-01-31 | 2009-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with grooves to reduce slurry consumption |
| US20080305719A1 (en) * | 2007-06-05 | 2008-12-11 | Tcg International, Inc., | Scratch removal device and method |
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| JP5635194B2 (ja) | 2010-09-15 | 2014-12-03 | エルジー・ケム・リミテッド | Ｃｍｐ用研磨パッド |
| EP2659951A4 (en) * | 2010-12-27 | 2017-04-26 | Asahi Kasei Chemicals Corporation | Adsorption/separation membrane module, method for producing adsorption/separation membrane module, and partition member |
| TWI492818B (zh) * | 2011-07-12 | 2015-07-21 | Iv Technologies Co Ltd | 研磨墊、研磨方法以及研磨系統 |
| TWI599447B (zh) | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊 |
| TWI597125B (zh) | 2014-09-25 | 2017-09-01 | 三芳化學工業股份有限公司 | 拋光墊及其製造方法 |
| CN109922923B (zh) * | 2016-11-08 | 2020-10-23 | Abb瑞士股份有限公司 | 抛光工件的方法以及使用该方法的系统 |
| WO2021090122A1 (en) * | 2019-11-04 | 2021-05-14 | 3M Innovative Properties Company | Polishing article, polishing system and method of polishing |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0811051A (ja) | 1994-06-28 | 1996-01-16 | Sony Corp | 研磨布 |
| US5690540A (en) * | 1996-02-23 | 1997-11-25 | Micron Technology, Inc. | Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers |
| US5645469A (en) | 1996-09-06 | 1997-07-08 | Advanced Micro Devices, Inc. | Polishing pad with radially extending tapered channels |
| JP3149807B2 (ja) * | 1997-01-08 | 2001-03-26 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
| US6273806B1 (en) | 1997-05-15 | 2001-08-14 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
| US5921855A (en) | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
| US6254456B1 (en) * | 1997-09-26 | 2001-07-03 | Lsi Logic Corporation | Modifying contact areas of a polishing pad to promote uniform removal rates |
| US6093651A (en) | 1997-12-23 | 2000-07-25 | Intel Corporation | Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
| US5990012A (en) * | 1998-01-27 | 1999-11-23 | Micron Technology, Inc. | Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads |
| KR20000025003A (ko) * | 1998-10-07 | 2000-05-06 | 윤종용 | 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드 |
| GB2345255B (en) | 1998-12-29 | 2000-12-27 | United Microelectronics Corp | Chemical-Mechanical Polishing Pad |
| US20020068516A1 (en) * | 1999-12-13 | 2002-06-06 | Applied Materials, Inc | Apparatus and method for controlled delivery of slurry to a region of a polishing device |
| US6241596B1 (en) * | 2000-01-14 | 2001-06-05 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing using a patterned pad |
| US6838149B2 (en) * | 2001-12-13 | 2005-01-04 | 3M Innovative Properties Company | Abrasive article for the deposition and polishing of a conductive material |
| JP2003209077A (ja) * | 2002-01-15 | 2003-07-25 | Mitsubishi Electric Corp | Ｃｍｐ装置及び半導体装置 |
| US7125318B2 (en) * | 2003-11-13 | 2006-10-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a groove arrangement for reducing slurry consumption |
| US7018274B2 (en) * | 2003-11-13 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Polishing pad having slurry utilization enhancing grooves |
| US6843709B1 (en) * | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for reducing slurry reflux |
| US6843711B1 (en) * | 2003-12-11 | 2005-01-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Chemical mechanical polishing pad having a process-dependent groove configuration |
| JP4563025B2 (ja) * | 2003-12-19 | 2010-10-13 | 東洋ゴム工業株式会社 | Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法 |
| US6955587B2 (en) * | 2004-01-30 | 2005-10-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc | Grooved polishing pad and method |
-
2004
- 2004-07-19 US US10/894,915 patent/US6958002B1/en not_active Expired - Lifetime
-
2005
- 2005-06-07 US US11/146,664 patent/US7156721B2/en not_active Expired - Lifetime
- 2005-06-30 JP JP2007522519A patent/JP2008507148A/ja active Pending
- 2005-06-30 WO PCT/US2005/023433 patent/WO2006019541A1/en not_active Ceased
- 2005-06-30 CN CNB2005800237463A patent/CN100528487C/zh not_active Expired - Fee Related
- 2005-07-15 TW TW094124027A patent/TW200609079A/zh unknown