TW200609079A - Polishing pad with flow modifying groove network - Google Patents

Polishing pad with flow modifying groove network

Info

Publication number
TW200609079A
TW200609079A TW094124027A TW94124027A TW200609079A TW 200609079 A TW200609079 A TW 200609079A TW 094124027 A TW094124027 A TW 094124027A TW 94124027 A TW94124027 A TW 94124027A TW 200609079 A TW200609079 A TW 200609079A
Authority
TW
Taiwan
Prior art keywords
groove network
polishing pad
flow modifying
polishing
wafer
Prior art date
Application number
TW094124027A
Other languages
English (en)
Chinese (zh)
Inventor
Ravichandra V Palaparthi
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200609079A publication Critical patent/TW200609079A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW094124027A 2004-07-19 2005-07-15 Polishing pad with flow modifying groove network TW200609079A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/894,915 US6958002B1 (en) 2004-07-19 2004-07-19 Polishing pad with flow modifying groove network

Publications (1)

Publication Number Publication Date
TW200609079A true TW200609079A (en) 2006-03-16

Family

ID=34993068

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124027A TW200609079A (en) 2004-07-19 2005-07-15 Polishing pad with flow modifying groove network

Country Status (5)

Country Link
US (2) US6958002B1 (enExample)
JP (1) JP2008507148A (enExample)
CN (1) CN100528487C (enExample)
TW (1) TW200609079A (enExample)
WO (1) WO2006019541A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7270595B2 (en) * 2004-05-27 2007-09-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with oscillating path groove network
US7131895B2 (en) * 2005-01-13 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a radially alternating groove segment configuration
US7182677B2 (en) * 2005-01-14 2007-02-27 Applied Materials, Inc. Chemical mechanical polishing pad for controlling polishing slurry distribution
US7137872B1 (en) * 2005-09-30 2006-11-21 Tcg International Inc. Scratch removal device and method
JP4712539B2 (ja) * 2005-11-24 2011-06-29 ニッタ・ハース株式会社 研磨パッド
US7520798B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US20080305719A1 (en) * 2007-06-05 2008-12-11 Tcg International, Inc., Scratch removal device and method
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
JP5635194B2 (ja) 2010-09-15 2014-12-03 エルジー・ケム・リミテッド Ｃｍｐ用研磨パッド
EP2659951A4 (en) * 2010-12-27 2017-04-26 Asahi Kasei Chemicals Corporation Adsorption/separation membrane module, method for producing adsorption/separation membrane module, and partition member
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
TWI597125B (zh) 2014-09-25 2017-09-01 三芳化學工業股份有限公司 拋光墊及其製造方法
CN109922923B (zh) * 2016-11-08 2020-10-23 Abb瑞士股份有限公司 抛光工件的方法以及使用该方法的系统
WO2021090122A1 (en) * 2019-11-04 2021-05-14 3M Innovative Properties Company Polishing article, polishing system and method of polishing

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0811051A (ja) 1994-06-28 1996-01-16 Sony Corp 研磨布
US5690540A (en) * 1996-02-23 1997-11-25 Micron Technology, Inc. Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers
US5645469A (en) 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
JP3149807B2 (ja) * 1997-01-08 2001-03-26 三菱マテリアル株式会社 ウェーハ研磨装置
US6273806B1 (en) 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US5921855A (en) 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6254456B1 (en) * 1997-09-26 2001-07-03 Lsi Logic Corporation Modifying contact areas of a polishing pad to promote uniform removal rates
US6093651A (en) 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
US5990012A (en) * 1998-01-27 1999-11-23 Micron Technology, Inc. Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads
KR20000025003A (ko) * 1998-10-07 2000-05-06 윤종용 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드
GB2345255B (en) 1998-12-29 2000-12-27 United Microelectronics Corp Chemical-Mechanical Polishing Pad
US20020068516A1 (en) * 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6241596B1 (en) * 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
JP2003209077A (ja) * 2002-01-15 2003-07-25 Mitsubishi Electric Corp Ｃｍｐ装置及び半導体装置
US7125318B2 (en) * 2003-11-13 2006-10-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a groove arrangement for reducing slurry consumption
US7018274B2 (en) * 2003-11-13 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad having slurry utilization enhancing grooves
US6843709B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for reducing slurry reflux
US6843711B1 (en) * 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration
JP4563025B2 (ja) * 2003-12-19 2010-10-13 東洋ゴム工業株式会社 Ｃｍｐ用研磨パッド、及びそれを用いた研磨方法
US6955587B2 (en) * 2004-01-30 2005-10-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Grooved polishing pad and method

Also Published As

Publication number Publication date
JP2008507148A (ja) 2008-03-06
CN100528487C (zh) 2009-08-19
CN1984750A (zh) 2007-06-20
US20060014477A1 (en) 2006-01-19
US7156721B2 (en) 2007-01-02
WO2006019541A1 (en) 2006-02-23
US6958002B1 (en) 2005-10-25

Similar Documents

Publication Publication Date Title
TW200609079A (en) Polishing pad with flow modifying groove network
ATE496106T1 (de) Silikon druckempfinfliche klebestoffe, gegenstände und verfahren
ATE311958T1 (de) Artikel mit flixiertem schleifmittel zum verändern einer halbleiterscheibe
TW200602157A (en) Polishing pad having grooves configured to promote mixing wakes during polishing
BR0115273A (pt) Métodos para preparar uma pluralidade de grãos abrasivos aglomerados, e um artigo abrasivo
DE60127179D1 (de) Schleifartikel zur modifizierung einer halbleiterscheibe
TW200642797A (en) Radial-biased polishing pad
ATE314371T1 (de) Spiro-indole als y5-rezeptor antagonisten
TW200711099A (en) Module with radiation-emitting semiconductor-bodies
MY110871A (en) Novel sulfonylamino pyrimidines
BR0014365A (pt) Grão abrasivo sinterizado com base em alfa-alumina, artigo abrasivo, processos para produzi-los, e, processo para abrasão de uma superfìcie
WO2003101888A3 (en) Fluorochemical treatment for silicon articles
ATE338044T1 (de) Herstellung von 1h-imidazoc4,5-c)chinolin-4- aminen ber 1h-imidazoc4,5-c)chinolin-4- phthalimidzwischenprodukte
WO2006007107A3 (en) Abrasive article
DE59410075D1 (de) Sonnennachführung
AU2003209260A1 (en) Coated abrasive article comprising an aromatic polyepoxide
MXPA04006636A (es) Compuestos de geranilo.
ATE426112T1 (de) Zahnradbefestigung
EP0915142A3 (en) Adhesive silicone compositions
CA116166S (en) Snack piece
CA104209S (en) Snack piece
WO2003076411A1 (en) Process for producing optically active sulfoxide derivative
TW200730596A (en) Composition for polishing semiconductor layers
TW200632067A (en) Pressure-sensitive adhesive product and substrate for pressure-sensitive adhesive product
NO20082852L (no) Faramsoytisk blanding samt bruk av alfa-hydroksy karbonylforbindelser som reduksjonsmidler