WO2011008918A3 - Grooved cmp polishing pad - Google Patents
Grooved cmp polishing pad Download PDFInfo
- Publication number
- WO2011008918A3 WO2011008918A3 PCT/US2010/042073 US2010042073W WO2011008918A3 WO 2011008918 A3 WO2011008918 A3 WO 2011008918A3 US 2010042073 W US2010042073 W US 2010042073W WO 2011008918 A3 WO2011008918 A3 WO 2011008918A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- width
- landing
- grooves
- spiral
- defines
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG2012002234A SG177625A1 (en) | 2009-07-16 | 2010-07-15 | Grooved cmp polishing pad |
CN2010800414168A CN102498549A (en) | 2009-07-16 | 2010-07-15 | Grooved cmp polishing pad |
KR1020127003925A KR101478414B1 (en) | 2009-07-16 | 2010-07-15 | Grooved cmp polishing pad |
JP2012520766A JP2012533888A (en) | 2009-07-16 | 2010-07-15 | Grooved CMP polished PAD |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27106809P | 2009-07-16 | 2009-07-16 | |
US61/271,068 | 2009-07-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011008918A2 WO2011008918A2 (en) | 2011-01-20 |
WO2011008918A3 true WO2011008918A3 (en) | 2011-04-28 |
Family
ID=43450188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/042073 WO2011008918A2 (en) | 2009-07-16 | 2010-07-15 | Grooved cmp polishing pad |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110014858A1 (en) |
JP (1) | JP2012533888A (en) |
KR (1) | KR101478414B1 (en) |
CN (1) | CN102498549A (en) |
SG (2) | SG177625A1 (en) |
TW (1) | TWI519384B (en) |
WO (1) | WO2011008918A2 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009018434B4 (en) * | 2009-04-22 | 2023-11-30 | Ev Group Gmbh | Receiving device for holding semiconductor substrates |
DE102011082777A1 (en) * | 2011-09-15 | 2012-02-09 | Siltronic Ag | Method for double-sided polishing of semiconductor wafer e.g. silicon wafer, involves forming channel-shaped recesses in surface of polishing cloth of semiconductor wafer |
JP2014124718A (en) * | 2012-12-26 | 2014-07-07 | Toyo Tire & Rubber Co Ltd | Method of manufacturing laminated abrasive pad |
TWI599447B (en) * | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | Cmp polishing pad having edge exclusion region of offset concentric groove pattern |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
SG10202002601QA (en) | 2014-10-17 | 2020-05-28 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10875146B2 (en) * | 2016-03-24 | 2020-12-29 | Rohm And Haas Electronic Materials Cmp Holdings | Debris-removal groove for CMP polishing pad |
USD816774S1 (en) * | 2016-03-25 | 2018-05-01 | Craig Franklin Edevold | Spiral pattern for cribbage board |
SG11201906131WA (en) * | 2017-01-20 | 2019-08-27 | Applied Materials Inc | A thin plastic polishing article for cmp applications |
USD855110S1 (en) * | 2017-01-31 | 2019-07-30 | Gary Peterson | Game board |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Abrasive delivery polishing pads and manufacturing methods thereof |
WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
CN112720282B (en) * | 2020-12-31 | 2022-04-08 | 湖北鼎汇微电子材料有限公司 | Polishing pad |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
CN113829176B (en) * | 2021-08-31 | 2023-04-14 | 北京航天控制仪器研究所 | Grinding flat plate for grinding and polishing beryllium mirror body and grinding and polishing method |
CN114274043B (en) * | 2021-12-29 | 2023-02-24 | 湖北鼎汇微电子材料有限公司 | Polishing pad |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
KR20030005405A (en) * | 2000-05-27 | 2003-01-17 | 로델 홀딩스 인코포레이티드 | Grooved polishing pads for chemical mechanical planarization |
JP2004034176A (en) * | 2002-06-28 | 2004-02-05 | Jsr Corp | Polishing pad |
JP2004167605A (en) * | 2002-11-15 | 2004-06-17 | Rodel Nitta Co | Polishing pad and polishing device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6736709B1 (en) * | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
CN100356515C (en) * | 2002-04-03 | 2007-12-19 | 东邦工程株式会社 | Polishing pad and semiconductor substrate manufacturing method using the polishing pad |
TWI250572B (en) * | 2002-06-03 | 2006-03-01 | Jsr Corp | Polishing pad and multi-layer polishing pad |
JP3849582B2 (en) * | 2002-06-03 | 2006-11-22 | Jsr株式会社 | Polishing pad and multilayer polishing pad |
JP2004071985A (en) * | 2002-08-08 | 2004-03-04 | Jsr Corp | Working method for grinding pad for semiconductor wafer and grinding pad for semiconductor wafer |
JP3872081B2 (en) * | 2004-12-29 | 2007-01-24 | 東邦エンジニアリング株式会社 | Polishing pad |
CN101024260A (en) * | 2006-02-24 | 2007-08-29 | 三芳化学工业股份有限公司 | Polishign cushion with surface grains and its making method and apparatus |
US8192257B2 (en) * | 2006-04-06 | 2012-06-05 | Micron Technology, Inc. | Method of manufacture of constant groove depth pads |
-
2010
- 2010-07-15 WO PCT/US2010/042073 patent/WO2011008918A2/en active Application Filing
- 2010-07-15 SG SG2012002234A patent/SG177625A1/en unknown
- 2010-07-15 JP JP2012520766A patent/JP2012533888A/en active Pending
- 2010-07-15 CN CN2010800414168A patent/CN102498549A/en active Pending
- 2010-07-15 KR KR1020127003925A patent/KR101478414B1/en not_active IP Right Cessation
- 2010-07-15 SG SG10201404152UA patent/SG10201404152UA/en unknown
- 2010-07-16 US US12/837,705 patent/US20110014858A1/en not_active Abandoned
- 2010-07-16 TW TW099123549A patent/TWI519384B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
KR20030005405A (en) * | 2000-05-27 | 2003-01-17 | 로델 홀딩스 인코포레이티드 | Grooved polishing pads for chemical mechanical planarization |
JP2004034176A (en) * | 2002-06-28 | 2004-02-05 | Jsr Corp | Polishing pad |
JP2004167605A (en) * | 2002-11-15 | 2004-06-17 | Rodel Nitta Co | Polishing pad and polishing device |
Also Published As
Publication number | Publication date |
---|---|
CN102498549A (en) | 2012-06-13 |
TW201121711A (en) | 2011-07-01 |
JP2012533888A (en) | 2012-12-27 |
KR20120042985A (en) | 2012-05-03 |
US20110014858A1 (en) | 2011-01-20 |
TWI519384B (en) | 2016-02-01 |
SG10201404152UA (en) | 2014-09-26 |
SG177625A1 (en) | 2012-02-28 |
WO2011008918A2 (en) | 2011-01-20 |
KR101478414B1 (en) | 2014-12-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2011008918A3 (en) | Grooved cmp polishing pad | |
USD813180S1 (en) | Elastic membrane for semiconductor wafer polishing apparatus | |
WO2011103538A3 (en) | Post-cmp cleaning brush | |
MY154071A (en) | Polishing pad | |
TW200510124A (en) | Polishing pad for electrochemical-mechanical polishing | |
TW200633814A (en) | CMP pad having a radially alternating groove segment configuration | |
USD808349S1 (en) | Elastic membrane for semiconductor wafer polishing apparatus | |
CL2014003100A1 (en) | An absorbent article comprising a structure comprising, a top and bottom canvas, a core disposed between both canvases, a first and a second end portion, a belt portion with a first and a second texture zone, where the second zone It comprises a second portion of substrates and elastic elements. | |
USD854902S1 (en) | Polishing or grinding pad | |
WO2011162987A3 (en) | Cutting elements for downhole cutting tools | |
MX2016003383A (en) | Multipurpose consumer scrubbing cloths and methods of making same. | |
PL2144724T3 (en) | Cutting insert cutting eight ways, and tool holder for same | |
EP2040878A4 (en) | Polishing pad having micro-grooves on the pad surface | |
WO2012002657A3 (en) | Flooring material having superior nonslip characteristics, and synthetic wood flooring using same | |
USD899597S1 (en) | Unitary spinal disc implant with at least one conic protrusion | |
WO2012094691A3 (en) | Friction material | |
USD775676S1 (en) | Button drill bit | |
EP3523388A4 (en) | Surface covering with wear layer having dispersed therein wear-resistant additives and method of making the same | |
EP3374580A4 (en) | Surface covering having an improved wear layer | |
MX2015001483A (en) | Tire with laminate. | |
USD803653S1 (en) | Rotary cleaning tool for hardened surfaces | |
WO2011146672A3 (en) | Apparatuses and methods for scrubbing substrates | |
IN2014DN08611A (en) | ||
WO2012146626A3 (en) | Superhard constructions | |
USD770990S1 (en) | Elastic membrane for semiconductor wafer polishing apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080041416.8 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10800519 Country of ref document: EP Kind code of ref document: A2 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2012520766 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20127003925 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10800519 Country of ref document: EP Kind code of ref document: A2 |