JP2006346856A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006346856A5 JP2006346856A5 JP2006166826A JP2006166826A JP2006346856A5 JP 2006346856 A5 JP2006346856 A5 JP 2006346856A5 JP 2006166826 A JP2006166826 A JP 2006166826A JP 2006166826 A JP2006166826 A JP 2006166826A JP 2006346856 A5 JP2006346856 A5 JP 2006346856A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- grooves
- primary
- groove
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims 19
- 230000004913 activation Effects 0.000 claims 1
- 230000000875 corresponding Effects 0.000 claims 1
- 230000003287 optical Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Claims (3)
- ａ）研磨媒体の存在で磁性、光学及び半導体基材の少なくとも一つを研磨するために設計された、研磨面を含み、研磨面に対して垂直に延びる厚さを有する研磨層、
ｂ）研磨面中に位置し、研磨層中に厚さより小さい距離だけ延びる複数の一次研磨溝、及び
ｃ）研磨層中に位置する複数の二次研磨溝を含み、
複数の二次溝が、研磨面から計測した複数の活性化深さを有し、複数の二次溝が、複数の一次溝の溝と整合又は交互嵌合しており、複数の二次溝のすべての溝が複数の一次溝のいずれの溝とも交差せず、複数の一次溝が初期研磨媒体容積を有し、研磨層が摩耗して複数の一次溝の容積が初期研磨媒体容積の５０％まで減少すると、複数の二次溝の少なくともいくつかが活性化して初期研磨媒体容積の少なくとも２５％を研磨層に提供する
研磨パッド。 - 複数の二次溝の各溝が複数の一次溝の対応する各溝と整合している、請求項１記載の研磨パッド。
- 複数の二次溝の溝が複数の一次溝の溝と相互嵌合している、請求項１記載の研磨パッド。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US69132105P | 2005-06-16 | 2005-06-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006346856A JP2006346856A (ja) | 2006-12-28 |
| JP2006346856A5 true JP2006346856A5 (ja) | 2009-07-09 |
Family
ID=37643214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006166826A Pending JP2006346856A (ja) | 2005-06-16 | 2006-06-16 | 二次研磨媒体容積制御溝を有するケミカルメカニカル研磨パッド |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7807252B2 (ja) |
| JP (1) | JP2006346856A (ja) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9180570B2 (en) | 2008-03-14 | 2015-11-10 | Nexplanar Corporation | Grooved CMP pad |
| TWI360459B (en) * | 2008-04-11 | 2012-03-21 | Bestac Advanced Material Co Ltd | A polishing pad having groove structure for avoidi |
| JP5600400B2 (ja) * | 2009-05-26 | 2014-10-01 | 株式会社クラレ | 研磨装置及び研磨パッドの固定方法 |
| US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
| US9604339B2 (en) | 2012-10-29 | 2017-03-28 | Wayne O. Duescher | Vacuum-grooved membrane wafer polishing workholder |
| US8998677B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
| US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
| US8998678B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Spider arm driven flexible chamber abrading workholder |
| US8845394B2 (en) | 2012-10-29 | 2014-09-30 | Wayne O. Duescher | Bellows driven air floatation abrading workholder |
| US9233452B2 (en) | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
| US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
| JP2014124718A (ja) * | 2012-12-26 | 2014-07-07 | Toyo Tire & Rubber Co Ltd | 積層研磨パッドの製造方法 |
| US9308620B2 (en) * | 2013-09-18 | 2016-04-12 | Texas Instruments Incorporated | Permeated grooving in CMP polishing pads |
| TWI599447B (zh) | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊 |
| US10189143B2 (en) | 2015-11-30 | 2019-01-29 | Taiwan Semiconductor Manufacturing Company Limited | Polishing pad, method for manufacturing polishing pad, and polishing method |
| US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
| CN114126803A (zh) | 2019-05-07 | 2022-03-01 | Cmc材料股份有限公司 | 具有固定沟槽体积的化学机械平坦化垫 |
| CN110253423A (zh) * | 2019-07-11 | 2019-09-20 | 德淮半导体有限公司 | 一种研磨垫 |
| US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3042593B2 (ja) | 1995-10-25 | 2000-05-15 | 日本電気株式会社 | 研磨パッド |
| IT1285008B1 (it) * | 1996-03-15 | 1998-06-03 | Dylog Italia S R L | Macchina di ispezione non distruttiva a raggi x per l'industria alimentare |
| US6093651A (en) * | 1997-12-23 | 2000-07-25 | Intel Corporation | Polish pad with non-uniform groove depth to improve wafer polish rate uniformity |
| US6331137B1 (en) * | 1998-08-28 | 2001-12-18 | Advanced Micro Devices, Inc | Polishing pad having open area which varies with distance from initial pad surface |
| US6626740B2 (en) * | 1999-12-23 | 2003-09-30 | Rodel Holdings, Inc. | Self-leveling pads and methods relating thereto |
| JP2002192455A (ja) * | 2000-12-25 | 2002-07-10 | Toyobo Co Ltd | 研磨パッド |
| JP2004074314A (ja) * | 2002-08-12 | 2004-03-11 | Nikon Corp | 研磨体、この研磨体を備えた研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの半導体デバイス製造方法により製造された半導体デバイス |
| JP2004202666A (ja) * | 2002-12-26 | 2004-07-22 | Sony Corp | 研磨装置、研磨部材、および研磨方法 |
| JP4292025B2 (ja) * | 2003-05-23 | 2009-07-08 | Ｊｓｒ株式会社 | 研磨パッド |
| US20040259479A1 (en) | 2003-06-23 | 2004-12-23 | Cabot Microelectronics Corporation | Polishing pad for electrochemical-mechanical polishing |
| JP4616571B2 (ja) * | 2004-03-31 | 2011-01-19 | 東洋ゴム工業株式会社 | 研磨パッド |
-
2006
- 2006-05-19 US US11/437,050 patent/US7807252B2/en not_active Expired - Fee Related
- 2006-06-16 JP JP2006166826A patent/JP2006346856A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2006346856A5 (ja) | ||
| JP2010513046A5 (ja) | ||
| JP2009056585A5 (ja) | ||
| JP2006289605A5 (ja) | ||
| JP2009056586A5 (ja) | ||
| TW200613090A (en) | Chemical mechanical polishing pad | |
| JP2009508701A5 (ja) | ||
| TW200602154A (en) | Chemical mechanical polishing pad and chemical mechanical polishing method | |
| US8123597B2 (en) | Polishing pad | |
| TW200642797A (en) | Radial-biased polishing pad | |
| JP2006005358A5 (ja) | ||
| JP2014508652A5 (ja) | ||
| JP2014179160A5 (ja) | ||
| JP2012529077A5 (ja) | ||
| JP2010500124A5 (ja) | ||
| JP2013505145A5 (ja) | ||
| TW200702749A (en) | Polarizing plate | |
| JP2010536583A5 (ja) | ||
| JP2011508265A5 (ja) | ||
| JP2014508650A5 (ja) | ||
| MY159838A (en) | Method of manufacturing a glass substrate for a magnetic disk, glass substrate for a magnetic disk, and magnetic disk | |
| JP2011173411A5 (ja) | ||
| TW200732089A (en) | Polishing pad with surface roughness | |
| JP2008292830A5 (ja) | ||
| JP2014188668A5 (ja) | 基板の製造方法及びキャリア |