JP2006005358A5 - - Google Patents
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- Publication number
- JP2006005358A5 JP2006005358A5 JP2005175893A JP2005175893A JP2006005358A5 JP 2006005358 A5 JP2006005358 A5 JP 2006005358A5 JP 2005175893 A JP2005175893 A JP 2005175893A JP 2005175893 A JP2005175893 A JP 2005175893A JP 2006005358 A5 JP2006005358 A5 JP 2006005358A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- layer
- polishing pad
- pressure relief
- relief passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 41
- 239000011800 void material Substances 0.000 claims 7
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive Effects 0.000 claims 5
- 239000000126 substance Substances 0.000 claims 4
- 239000004821 Contact adhesive Substances 0.000 claims 1
- 238000005296 abrasive Methods 0.000 claims 1
- 230000002093 peripheral Effects 0.000 claims 1
Claims (10)
- ケミカルメカニカル研磨パッドであって、
研磨面及び透明な窓を有する研磨層と、
空隙を有する下層と
を含み、
研磨層が、下層の上にあり、下層の空隙が、研磨層の研磨面とは反対の透明な窓の面の透明な窓の下にあり、空隙−圧力逃がし通路が、空隙から研磨パッドの周辺部まで延び、空隙−圧力逃がし通路が、研磨面まで延びない、研磨パッド。 - 空隙−圧力逃がし通路が、研磨層に設けられている、請求項１記載の研磨パッド。
- 研磨層と下層との間に置かれた接着剤層をさらに含み、空隙−圧力逃がし通路が、接着剤層に設けられている、請求項１記載の研磨パッド。
- 空隙−圧力逃がし通路が、下層に設けられている、請求項１記載の研磨パッド。
- 空隙−圧力逃がし通路が、幅０．７０mm〜６．５０mmである、請求項１記載の研磨パッド。
- 幅が、空隙と研磨パッドの周辺部との間で変化する、請求項５記載の研磨パッド。
- 空隙−圧力逃がし通路が、深さ０．３８mm〜１．５３mmである、請求項１記載の研磨パッド。
- ケミカルメカニカル研磨パッドであって、
研磨面及びそれに形成された透明な窓を有する研磨層並びに下層を含み、研磨層が、下層の上にあり、透明な窓が、研磨面とは反対の研磨層の面で空隙に露出し、研磨層中に設けられた空隙−圧力逃がし通路が、空隙に露出した透明な窓の面から研磨層の周辺部まで延び、空隙−圧力逃がし通路が、研磨面まで延びない、研磨パッド。 - ケミカルメカニカル研磨パッドであって、
下層の上にある研磨層と、
研磨層と下層との間に配置された接着剤層と、
研磨層に形成され、研磨パッドの研磨面とは反対のその面で空隙に露出している透明な窓と、
空隙から接着剤層の周辺部まで接着剤層中に設けられた空隙−圧力逃がし通路と
を含み、
空隙−圧力逃がし通路が、研磨面まで延びない、研磨パッド。 - ケミカルメカニカル研磨パッドであって、
下層の上にある研磨層と、
研磨層と下層との間に配置された接着剤層と、
研磨層に形成され、研磨パッドの研磨面とは反対のその面で空隙に露出している透明な窓と、
空隙から下層の周辺部まで下層中に設けられた空隙−圧力逃がし通路と
を含み、
空隙−圧力逃がし通路が、研磨面まで延びない、研磨パッド。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/869,657 | 2004-06-16 | ||
| US10/869,657 US7252871B2 (en) | 2004-06-16 | 2004-06-16 | Polishing pad having a pressure relief channel |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006005358A JP2006005358A (ja) | 2006-01-05 |
| JP2006005358A5 true JP2006005358A5 (ja) | 2008-07-17 |
| JP4761846B2 JP4761846B2 (ja) | 2011-08-31 |
Family
ID=35480929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005175893A Active JP4761846B2 (ja) | 2004-06-16 | 2005-06-16 | 圧力逃がし通路を有する研磨パッド |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7252871B2 (ja) |
| JP (1) | JP4761846B2 (ja) |
| KR (1) | KR20060048382A (ja) |
| CN (1) | CN100388431C (ja) |
| TW (1) | TW200602156A (ja) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1983558A4 (en) * | 2006-02-06 | 2011-08-10 | Toray Industries | ABRASIVE SKATE AND ABRASIVE DEVICE |
| US7455571B1 (en) * | 2007-06-20 | 2008-11-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Window polishing pad |
| CN102015212A (zh) * | 2008-04-11 | 2011-04-13 | 音诺帕德股份有限公司 | 具有孔隙网络的化学机械平坦化垫 |
| US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
| JP2012106328A (ja) * | 2010-03-25 | 2012-06-07 | Toyo Tire & Rubber Co Ltd | 積層研磨パッド |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| TWI675721B (zh) | 2013-07-11 | 2019-11-01 | 日商荏原製作所股份有限公司 | 研磨裝置及研磨狀態監視方法 |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| KR102295988B1 (ko) | 2014-10-17 | 2021-09-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성 |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US10618141B2 (en) | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US11123215B2 (en) | 2016-08-16 | 2021-09-21 | Renuka Pradhan | Pressure relief apparatus for wound |
| US10596763B2 (en) | 2017-04-21 | 2020-03-24 | Applied Materials, Inc. | Additive manufacturing with array of energy sources |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| JP7299970B2 (ja) | 2018-09-04 | 2023-06-28 | アプライド マテリアルズ インコーポレイテッド | 改良型研磨パッドのための配合物 |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08108372A (ja) * | 1994-10-07 | 1996-04-30 | Mitsubishi Electric Corp | 研磨布 |
| US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
| JP2000254860A (ja) * | 1999-03-08 | 2000-09-19 | Nikon Corp | 研磨装置 |
| JP2001150333A (ja) * | 1999-11-29 | 2001-06-05 | Nec Corp | 研磨パッド |
| JP2002001647A (ja) * | 2000-06-19 | 2002-01-08 | Rodel Nitta Co | 研磨パッド |
| JP2002001652A (ja) * | 2000-06-22 | 2002-01-08 | Nikon Corp | 研磨パッド及び研磨装置及び素子製造方法 |
| US6623331B2 (en) * | 2001-02-16 | 2003-09-23 | Cabot Microelectronics Corporation | Polishing disk with end-point detection port |
| JP2003163191A (ja) * | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | 機械化学的研磨装置用の研磨パッド |
| US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
| JP3878016B2 (ja) * | 2001-12-28 | 2007-02-07 | 株式会社荏原製作所 | 基板研磨装置 |
| JP2003300150A (ja) * | 2002-04-03 | 2003-10-21 | Sony Corp | 研磨パッド、研磨装置および研磨方法 |
| CN1302522C (zh) * | 2002-05-15 | 2007-02-28 | 旺宏电子股份有限公司 | 一种化学机械抛光装置的终点侦测系统 |
| US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
-
2004
- 2004-06-16 US US10/869,657 patent/US7252871B2/en not_active Expired - Fee Related
-
2005
- 2005-05-23 TW TW094116736A patent/TW200602156A/zh unknown
- 2005-06-15 CN CNB2005100779492A patent/CN100388431C/zh not_active Expired - Fee Related
- 2005-06-15 KR KR1020050051542A patent/KR20060048382A/ko not_active Application Discontinuation
- 2005-06-16 JP JP2005175893A patent/JP4761846B2/ja active Active
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