JP4761846B2 - 圧力逃がし通路を有する研磨パッド - Google Patents
圧力逃がし通路を有する研磨パッド Download PDFInfo
- Publication number
- JP4761846B2 JP4761846B2 JP2005175893A JP2005175893A JP4761846B2 JP 4761846 B2 JP4761846 B2 JP 4761846B2 JP 2005175893 A JP2005175893 A JP 2005175893A JP 2005175893 A JP2005175893 A JP 2005175893A JP 4761846 B2 JP4761846 B2 JP 4761846B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- layer
- pressure relief
- polishing pad
- relief passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
- Y10T428/24331—Composite web or sheet including nonapertured component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24744—Longitudinal or transverse tubular cavity or cell
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
Claims (10)
- ケミカルメカニカル研磨パッドであって、
研磨面及び透明な窓を有する研磨層と、
空隙を有する下層と
を含み、
研磨層が、下層の上にあり、下層の空隙が、研磨層の研磨面とは反対の透明な窓の面の透明な窓の下にあり、空隙−圧力逃がし通路が、空隙から研磨パッドの周辺部まで延び、空隙−圧力逃がし通路が、研磨面まで延びない、研磨パッド。 - 空隙−圧力逃がし通路が、研磨層に設けられている、請求項1記載の研磨パッド。
- 研磨層と下層との間に置かれた接着剤層をさらに含み、空隙−圧力逃がし通路が、接着剤層に設けられている、請求項1記載の研磨パッド。
- 空隙−圧力逃がし通路が、下層に設けられている、請求項1記載の研磨パッド。
- 空隙−圧力逃がし通路が、幅0.70mm〜6.50mmである、請求項1記載の研磨パッド。
- 幅が、空隙と研磨パッドの周辺部との間で変化する、請求項5記載の研磨パッド。
- 空隙−圧力逃がし通路が、深さ0.38mm〜1.53mmである、請求項1記載の研磨パッド。
- ケミカルメカニカル研磨パッドであって、
研磨面及びそれに形成された透明な窓を有する研磨層並びに下層を含み、研磨層が、下層の上にあり、透明な窓が、研磨面とは反対の研磨層の面で空隙に露出し、研磨層中に設けられた空隙−圧力逃がし通路が、空隙に露出した透明な窓の面から研磨層の周辺部まで延び、空隙−圧力逃がし通路が、研磨面まで延びない、研磨パッド。 - ケミカルメカニカル研磨パッドであって、
下層の上にある研磨層と、
研磨層と下層との間に配置された接着剤層と、
研磨層に形成され、研磨パッドの研磨面とは反対のその面で空隙に露出している透明な窓と、
空隙から接着剤層の周辺部まで接着剤層中に設けられた空隙−圧力逃がし通路と
を含み、
空隙−圧力逃がし通路が、研磨面まで延びない、研磨パッド。 - ケミカルメカニカル研磨パッドであって、
下層の上にある研磨層と、
研磨層と下層との間に配置された接着剤層と、
研磨層に形成され、研磨パッドの研磨面とは反対のその面で空隙に露出している透明な窓と、
空隙から下層の周辺部まで下層中に設けられた空隙−圧力逃がし通路と
を含み、
空隙−圧力逃がし通路が、研磨面まで延びない、研磨パッド。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/869,657 US7252871B2 (en) | 2004-06-16 | 2004-06-16 | Polishing pad having a pressure relief channel |
US10/869,657 | 2004-06-16 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006005358A JP2006005358A (ja) | 2006-01-05 |
JP2006005358A5 JP2006005358A5 (ja) | 2008-07-17 |
JP4761846B2 true JP4761846B2 (ja) | 2011-08-31 |
Family
ID=35480929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005175893A Active JP4761846B2 (ja) | 2004-06-16 | 2005-06-16 | 圧力逃がし通路を有する研磨パッド |
Country Status (5)
Country | Link |
---|---|
US (1) | US7252871B2 (ja) |
JP (1) | JP4761846B2 (ja) |
KR (1) | KR20060048382A (ja) |
CN (1) | CN100388431C (ja) |
TW (1) | TW200602156A (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100580885C (zh) * | 2006-02-06 | 2010-01-13 | 东丽株式会社 | 研磨垫、研磨装置、研磨装置用保护膜以及研磨方法 |
US7455571B1 (en) * | 2007-06-20 | 2008-11-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Window polishing pad |
US8684794B2 (en) * | 2008-04-11 | 2014-04-01 | Fns Tech Co., Ltd. | Chemical mechanical planarization pad with void network |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
JP2012106328A (ja) * | 2010-03-25 | 2012-06-07 | Toyo Tire & Rubber Co Ltd | 積層研磨パッド |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
TWI635929B (zh) | 2013-07-11 | 2018-09-21 | 日商荏原製作所股份有限公司 | 研磨裝置及研磨狀態監視方法 |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
SG10202002601QA (en) | 2014-10-17 | 2020-05-28 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US11123215B2 (en) | 2016-08-16 | 2021-09-21 | Renuka Pradhan | Pressure relief apparatus for wound |
US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
JP7299970B2 (ja) | 2018-09-04 | 2023-06-28 | アプライド マテリアルズ インコーポレイテッド | 改良型研磨パッドのための配合物 |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08108372A (ja) * | 1994-10-07 | 1996-04-30 | Mitsubishi Electric Corp | 研磨布 |
US5605760A (en) | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
JP2000254860A (ja) * | 1999-03-08 | 2000-09-19 | Nikon Corp | 研磨装置 |
JP2001150333A (ja) * | 1999-11-29 | 2001-06-05 | Nec Corp | 研磨パッド |
JP2002001647A (ja) * | 2000-06-19 | 2002-01-08 | Rodel Nitta Co | 研磨パッド |
JP2002001652A (ja) * | 2000-06-22 | 2002-01-08 | Nikon Corp | 研磨パッド及び研磨装置及び素子製造方法 |
US6623331B2 (en) * | 2001-02-16 | 2003-09-23 | Cabot Microelectronics Corporation | Polishing disk with end-point detection port |
JP2003163191A (ja) * | 2001-11-28 | 2003-06-06 | Tokyo Seimitsu Co Ltd | 機械化学的研磨装置用の研磨パッド |
US6599765B1 (en) * | 2001-12-12 | 2003-07-29 | Lam Research Corporation | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
JP3878016B2 (ja) * | 2001-12-28 | 2007-02-07 | 株式会社荏原製作所 | 基板研磨装置 |
JP2003300150A (ja) * | 2002-04-03 | 2003-10-21 | Sony Corp | 研磨パッド、研磨装置および研磨方法 |
CN1302522C (zh) * | 2002-05-15 | 2007-02-28 | 旺宏电子股份有限公司 | 一种化学机械抛光装置的终点侦测系统 |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
-
2004
- 2004-06-16 US US10/869,657 patent/US7252871B2/en not_active Expired - Fee Related
-
2005
- 2005-05-23 TW TW094116736A patent/TW200602156A/zh unknown
- 2005-06-15 KR KR1020050051542A patent/KR20060048382A/ko not_active Application Discontinuation
- 2005-06-15 CN CNB2005100779492A patent/CN100388431C/zh not_active Expired - Fee Related
- 2005-06-16 JP JP2005175893A patent/JP4761846B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN1713356A (zh) | 2005-12-28 |
TW200602156A (en) | 2006-01-16 |
CN100388431C (zh) | 2008-05-14 |
US20050281983A1 (en) | 2005-12-22 |
KR20060048382A (ko) | 2006-05-18 |
US7252871B2 (en) | 2007-08-07 |
JP2006005358A (ja) | 2006-01-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4761846B2 (ja) | 圧力逃がし通路を有する研磨パッド | |
JP4834887B2 (ja) | 応力が軽減した窓を有する研磨パッド | |
EP1535699B1 (en) | Polishing pad with high optical transmission window | |
KR101495145B1 (ko) | 국소 투명 구역을 가진 cmp 패드 | |
TWI527836B (zh) | 具有光安定之聚合性終點偵測窗之化學機械研磨墊及以該墊研磨之方法 | |
US9102034B2 (en) | Method of chemical mechanical polishing a substrate | |
TWI474893B (zh) | Polishing pad | |
JP4810173B2 (ja) | ストライエーションが減少した研磨パッドを形成する方法 | |
US8409308B2 (en) | Process for manufacturing polishing pad | |
US8348724B2 (en) | Polishing pad manufacturing method | |
FR3009988A1 (fr) | Tampon de polissage chimique mecanique | |
US20070037487A1 (en) | Polishing pad having a sealed pressure relief channel | |
US10272541B2 (en) | Polishing layer analyzer and method | |
US9737971B2 (en) | Chemical mechanical polishing pad, polishing layer analyzer and method | |
KR102085640B1 (ko) | 홈이 있는 화학기계 연마층의 제조 방법 | |
KR20160082930A (ko) | 화학적 기계적 연마패드를 제조하는 방법 | |
US20170197295A1 (en) | Method of manufacturing chemical mechanical polishing pads | |
WO2016052155A1 (ja) | 研磨パッド | |
JP2016136136A (ja) | ケミカルメカニカルポリッシングパッド、研磨層アナライザー及び方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080530 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080530 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110510 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110607 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140617 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4761846 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |