JP2009531192A5 - - Google Patents

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Publication number
JP2009531192A5
JP2009531192A5 JP2009503109A JP2009503109A JP2009531192A5 JP 2009531192 A5 JP2009531192 A5 JP 2009531192A5 JP 2009503109 A JP2009503109 A JP 2009503109A JP 2009503109 A JP2009503109 A JP 2009503109A JP 2009531192 A5 JP2009531192 A5 JP 2009531192A5
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JP
Japan
Prior art keywords
polishing
layer
height
opposing
plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009503109A
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English (en)
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JP2009531192A (ja
Filing date
Publication date
Priority claimed from US11/390,292 external-priority patent/US7179151B1/en
Application filed filed Critical
Publication of JP2009531192A publication Critical patent/JP2009531192A/ja
Publication of JP2009531192A5 publication Critical patent/JP2009531192A5/ja
Pending legal-status Critical Current

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Claims (3)

  1. 第１研磨表面、
    前記第１研磨表面に対向する第１対向表面、及び、
    第１層を貫通して延在する第１開口を備える、第１層と、
    取付け表面、
    前記取付け表面に対向し、かつ、前記第１層の前記第１研磨表面に比べて、前記第１層の前記第１対向表面の近くに位置する第２対向表面、及び、
    前記第２層を貫通して延在し、前記第１層の前記第１開口に実質的に隣接する第２開口を備える、第２層と、
    前記第１開口内に設けられるパッド窓と、前記パッド窓は、
    前記第１研磨表面に実質的に隣接する第２研磨表面、及び、
    前記第２研磨表面に対向する第３対向表面を備え、前記第３対向表面は、前記第１層の前記第１研磨表面と前記第２層の前記取付け表面との間の領域内に位置し、パッド窓は、気体透過性材料からなることとを備える研磨パッド。
  2. 前記第１層の前記第１研磨表面及び前記パッド窓の前記第２研磨表面は、実質的に研磨平面に沿って位置し、
    前記パッド窓の前記第３対向表面から前記研磨平面までの第１高さは、前記取付け表面から前記研磨平面までの第２高さより小さい請求項１に記載の研磨パッド。
  3. 前記第１高さは、前記第１層の前記第１対向表面から前記研磨平面までの第３高さより小さい請求項２に記載の研磨パッド。
JP2009503109A 2006-03-27 2007-02-20 研磨パッド、研磨装置、及び研磨パッドの使用方法 Pending JP2009531192A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/390,292 US7179151B1 (en) 2006-03-27 2006-03-27 Polishing pad, a polishing apparatus, and a process for using the polishing pad
PCT/US2007/062400 WO2007120982A2 (en) 2006-03-27 2007-02-20 Polishing pad, a polishing apparatus, and a process for using the polishing pad

Publications (2)

Publication Number Publication Date
JP2009531192A JP2009531192A (ja) 2009-09-03
JP2009531192A5 true JP2009531192A5 (ja) 2010-04-08

Family

ID=37744898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009503109A Pending JP2009531192A (ja) 2006-03-27 2007-02-20 研磨パッド、研磨装置、及び研磨パッドの使用方法

Country Status (6)

Country Link
US (1) US7179151B1 (ja)
JP (1) JP2009531192A (ja)
KR (1) KR20080100277A (ja)
CN (1) CN101400479B (ja)
TW (1) TW200744796A (ja)
WO (1) WO2007120982A2 (ja)

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US7520797B2 (en) * 2005-09-06 2009-04-21 Freescale Semiconductor, Inc. Platen endpoint window with pressure relief
US7534162B2 (en) * 2005-09-06 2009-05-19 Freescale Semiconductor, Inc. Grooved platen with channels or pathway to ambient air
US7497763B2 (en) * 2006-03-27 2009-03-03 Freescale Semiconductor, Inc. Polishing pad, a polishing apparatus, and a process for using the polishing pad
JP5363470B2 (ja) * 2007-06-08 2013-12-11 アプライド マテリアルズ インコーポレイテッド 窓付きの薄い研磨パッド及び成形プロセス
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
DE102010011470B9 (de) * 2010-03-09 2016-09-29 Nagel Maschinen- Und Werkzeugfabrik Gmbh Verfahren und Vorrichtung zur messungsunterstützten Feinbearbeitung von Werkstückoberflächen sowie Messsystem
JP5526911B2 (ja) * 2010-03-25 2014-06-18 東レ株式会社 研磨パッド
US8393940B2 (en) * 2010-04-16 2013-03-12 Applied Materials, Inc. Molding windows in thin pads
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
JP2014113644A (ja) * 2012-12-06 2014-06-26 Toyo Tire & Rubber Co Ltd 研磨パッド
US9868185B2 (en) * 2015-11-03 2018-01-16 Cabot Microelectronics Corporation Polishing pad with foundation layer and window attached thereto
US10213894B2 (en) 2016-02-26 2019-02-26 Applied Materials, Inc. Method of placing window in thin polishing pad
US11072050B2 (en) * 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
CN109202693B (zh) * 2017-10-16 2021-10-12 Skc索密思株式会社 防泄漏抛光垫及其制造方法
KR101890331B1 (ko) * 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
JP7041638B2 (ja) * 2019-01-10 2022-03-24 株式会社荏原製作所 研磨装置
US20220226956A1 (en) * 2021-01-15 2022-07-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacture of polishing pads having two or more endpoint detection windows

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US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
US5461007A (en) 1994-06-02 1995-10-24 Motorola, Inc. Process for polishing and analyzing a layer over a patterned semiconductor substrate
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
US6146248A (en) * 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6323046B1 (en) * 1998-08-25 2001-11-27 Micron Technology, Inc. Method and apparatus for endpointing a chemical-mechanical planarization process
US6280289B1 (en) * 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
JP2001062703A (ja) * 1999-08-27 2001-03-13 Asahi Chem Ind Co Ltd 多孔性樹脂窓付き研磨パッド
US6454630B1 (en) * 1999-09-14 2002-09-24 Applied Materials, Inc. Rotatable platen having a transparent window for a chemical mechanical polishing apparatus and method of making the same
JP2001110762A (ja) * 1999-10-04 2001-04-20 Asahi Kasei Corp 研磨パッド
JP3826728B2 (ja) * 2001-04-25 2006-09-27 Ｊｓｒ株式会社 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法
US6599765B1 (en) 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
CN1445060A (zh) * 2002-03-07 2003-10-01 株式会社荏原制作所 抛光装置
US6937915B1 (en) * 2002-03-28 2005-08-30 Lam Research Corporation Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control
CN1302522C (zh) * 2002-05-15 2007-02-28 旺宏电子股份有限公司 一种化学机械抛光装置的终点侦测系统
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US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US7132033B2 (en) * 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad

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