JP2006286910A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
- Publication number
- JP2006286910A JP2006286910A JP2005104512A JP2005104512A JP2006286910A JP 2006286910 A JP2006286910 A JP 2006286910A JP 2005104512 A JP2005104512 A JP 2005104512A JP 2005104512 A JP2005104512 A JP 2005104512A JP 2006286910 A JP2006286910 A JP 2006286910A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- gan
- sic
- based semiconductor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 155
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000013078 crystal Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 15
- 238000005229 chemical vapour deposition Methods 0.000 claims description 5
- 238000001312 dry etching Methods 0.000 claims description 4
- 230000015556 catabolic process Effects 0.000 abstract description 27
- 108091006146 Channels Proteins 0.000 description 65
- 229910002704 AlGaN Inorganic materials 0.000 description 19
- 230000000694 effects Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 108010075750 P-Type Calcium Channels Proteins 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/26—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys
- H01L29/267—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, elements provided for in two or more of the groups H01L29/16, H01L29/18, H01L29/20, H01L29/22, H01L29/24, e.g. alloys in different semiconductor regions, e.g. heterojunctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1025—Channel region of field-effect devices
- H01L29/1029—Channel region of field-effect devices of field-effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7782—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
- H01L29/7783—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7788—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7789—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface the two-dimensional charge carrier gas being at least partially not parallel to a main surface of the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/80—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier
- H01L29/802—Field effect transistors with field effect produced by a PN or other rectifying junction gate, i.e. potential-jump barrier with heterojunction gate, e.g. transistors with semiconductor layer acting as gate insulating layer, MIS-like transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0646—PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Junction Field-Effect Transistors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
【解決手段】 基板(10)と、該基板上に形成され、SiCドリフト層(14)と、GaN系半導体層(18)と、GaN系半導体層上に形成されたソース電極(60)若しくはエミッタ電極並びにゲート電極(62)と、前記SiCドリフト層の前記GaN系半導体層と相対する面に接続されたドレイン電極(64)またはコレクタ電極と、を具備する半導体装置およびその製造方法である。SiCドリフト層を有することによりドリフト層の厚膜化が可能となりドレイン耐圧が高くできる。さらに、チャネル移動度の高いGaN系半導体層をチャネル層として用いることによりオン抵抗が低い半導体装置およびその製造方法を提供することができる。
【選択図】 図2
Description
SiCはSiなどの元素半導体と異なり、Si原子だけでなくC原子が存在するため熱酸化によって1〜2原子オーダで酸化シリコン膜を形成するのは困難である。このため良質な酸化シリコン膜は期待できない。よって、SiCと酸化シリコン膜の界面準位密度を高移動度の反転層を形成するのに必要とされる1×1011cm−2以下まで低減するのは難しい。
12、82 SiCバッファ層
14、84 SiCドリフト層(SiCチャネル層)
15 p型SiC層
16 p型SiC領域
18 高濃度p型SiC領域
20、40 AlGaN層
22、42 GaNチャネル層
24、44 AlGaNキャップ層
28、38、48、92 GaN系半導体層
30 AlGaNドレイン層
32 GaNチャネル層
34 AlGaNソース層
36 キャップ層
37、47、102開口部
60 ソース電極
62、66、98ゲート電極
64 ドレイン電極
86 GaNコレクタ層
88 GaNチャネル層
90 GaNエミッタ層
94 キャップ層
96 エミッタ電極
100 コレクタ電極
Claims (23)
- 基板と、
該基板上に形成されたSiCドリフト層と、
該SiCドリフト層上に形成されたGaN系半導体層と、
該GaN系半導体層上に形成されたソース電極並びにゲート電極と、
前記ソース電極および前記ゲート電極下の前記SiCドリフト層の一部に形成されたp型SiC領域と、
前記SiCドリフト層の前記GaN系半導体層と相対する面に接続されたドレイン電極と、を具備する半導体装置。 - 前記GaN系半導体層は、GaN、AlNおよびInNの少なくとも1つからなる結晶層または混晶層を含む請求項1記載の半導体装置。
- 前記p型SiC領域は、前記GaN系半導体層と接している請求項1または2記載の半導体装置。
- 前記GaN系半導体層は、チャネル層と、チャネル層よりバンドギャップの大きいキャップ層を含む請求項1から3のいずれか一項記載の半導体装置。
- 前記基板がSiC基板またはSi基板である請求項1から4のいずれか一項記載の半導体装置。
- 前記SiCドリフト層が1μm以上の膜厚を有する請求項1から5のいずれか一項記載の半導体装置。
- 基板と、
該基板上に形成され、p型SiC層を含み、少なくともp型SiC層より深い開口部を有するSiCドリフト層と、
前記開口部を有する前記SiCドリフト層上に形成されたGaN系半導体層と、
該GaN系半導体層上に形成されたソース電極若しくはエミッタ電極並びにゲート電極と、
前記SiCドリフト層の前記GaN系半導体層と相対する面に接続されたドレイン電極またはコレクタ電極と、を具備する半導体装置。 - 前記GaN系半導体層は、GaN、AlNおよびInNの少なくとも1つからなる結晶層または混晶層を含む請求項7記載の半導体装置。
- 前記p型SiC層は、前記GaN系半導体層と接している請求項7または8記載の半導体装置。
- 前記GaN系半導体層は、チャネル層と、チャネル層よりバンドギャップの大きいキャップ層を含む請求項7から9のいずれか一項記載の半導体装置。
- 前記基板がSiC基板またはSi基板である請求項7から10のいずれか一項記載の半導体装置。
- 前記SiCドリフト層が1μm以上の膜厚を有する請求項7から10のいずれか一項記載の半導体装置。
- 基板と、
該基板上に形成されたSiCドリフト層と、
該SiCドリフト層上に形成され、チャネル層を含み、少なくとも前記チャネル層より深い開口部を有するGaN系半導体層と、
前記開口部の前記チャネル層の側面に形成され、前記チャネル層よりバンドギャップの大きいキャップ層と、
前記チャネル層の前記開口部の側面に前記キャップ層を介し形成されたゲート電極と、
前記GaN系半導体層上に形成されたソース電極またはエミッタ電極と、
前記SiCドリフト層の前記GaN系半導体層と相対する面に接続されたドレイン電極またはコレクタ電極と、を具備する半導体装置。 - 前記GaN系半導体層は、GaN、AlNおよびInNの少なくとも1つからなる結晶層または混晶層を含む請求項13記載の半導体装置。
- 前記基板がSiC基板またはSi基板である請求項13または14記載の半導体装置。
- 前記SiCドリフト層が1μm以上の膜厚を有する請求項13から15のいずれか一項記載の半導体装置。
- 基板上に、SiCドリフト層を形成する工程と、
前記SiCドリフト層内にp型SiC領域を形成する工程と、
前記SiCドリフト層上にGaN系半導体層を形成する工程と、
前記p型SiC領域上であって前記GaN系半導体層上にゲート電極を形成する工程と、
前記p型SiC領域上であって前記GaN系半導体層上にソース電極を形成する工程と、
前記SiCドリフト層の前記GaN系半導体層と相対する面に接続するドレイン電極を形成する工程と、を具備する半導体装置の製造方法。 - 基板上に、p型SiC層を含むSiCドリフト層を形成する工程と、
前記SiCドリフト層に少なくとも前記p型SiC層を除去し開口部を形成する工程と、
前記開口部を有する前記SiCドリフト層上にGaN系半導体層を形成する工程と、
前記p型SiC層上であって前記GaN系半導体層上にゲート電極を形成する工程と、
前記p型SiC層上であって前記GaN系半導体層上にソース電極またはエミッタ電極を形成する工程と、
前記SiCドリフト層の前記GaN系半導体層と相対する面に接続するドレイン電極またはコレクタ電極を形成する工程と、を具備する半導体装置の製造方法。 - 基板上に、SiCドリフト層を形成する工程と、
前記SiCドリフト層上にチャネル層を含むGaN系半導体層を形成する工程と、
前記GaN系半導体層に、少なくとも前記チャネル層を除去し開口部を形成する工程と、
前記チャネル層の前記開口部の側面にキャップ層を形成する工程と、
前記チャネル層の前記開口部の側面に前記キャップ層を介しゲート電極を形成する工程と、
前記GaN系半導体層上にソース電極またはエミッタ電極を形成する工程と、
前記SiCドリフト層の前記GaN系半導体層と相対する面に接続するドレイン電極またはコレクタ電極を形成する工程と、を具備する半導体装置の製造方法。 - 前記基板はSiC基板またはSi基板である請求項17から19のいずれか一項記載の半導体装置の製造方法。
- 前記ドリフト層は1μm以上の膜厚を有する請求項17から19のいずれか一項記載の半導体装置の製造方法。
- 前記SiCドリフト層を形成する工程と前記GaN系半導体層を形成する工程は、CVD法を用いる請求項17から19のいずれか一項記載の半導体装置の製造方法。
- 前記開口部を形成する工程は、ドライエッチングにより前記開口部を形成する工程である請求項18または19記載の半導体装置の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005104512A JP5051980B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置 |
EP11188204A EP2418682A3 (en) | 2005-03-31 | 2006-03-30 | Semiconductor device and fabrication method of the same |
US11/392,517 US7723751B2 (en) | 2005-03-31 | 2006-03-30 | Semiconductor device and fabrication method of the same |
EP06251774A EP1708275B1 (en) | 2005-03-31 | 2006-03-30 | Semiconductor device and fabrication method of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005104512A JP5051980B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006286910A true JP2006286910A (ja) | 2006-10-19 |
JP2006286910A5 JP2006286910A5 (ja) | 2008-05-15 |
JP5051980B2 JP5051980B2 (ja) | 2012-10-17 |
Family
ID=36643825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005104512A Expired - Fee Related JP5051980B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7723751B2 (ja) |
EP (2) | EP1708275B1 (ja) |
JP (1) | JP5051980B2 (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008153371A (ja) * | 2006-12-15 | 2008-07-03 | Furukawa Electric Co Ltd:The | 縦型電界効果トランジスタ |
WO2008108456A1 (ja) * | 2007-03-08 | 2008-09-12 | Rohm Co., Ltd. | GaN系半導体素子 |
WO2008111518A1 (ja) * | 2007-03-12 | 2008-09-18 | Rohm Co., Ltd. | 窒化物半導体積層構造の形成方法および窒化物半導体素子の製造方法 |
US20100078688A1 (en) * | 2007-01-26 | 2010-04-01 | Rohm Co., Ltd | Nitride semiconductor device, nitride semiconductor package, and method for manufacturing nitride semiconductor device |
JP2013507789A (ja) * | 2009-10-13 | 2013-03-04 | クリー インコーポレイテッド | 異なる半導体材料の半導体相互接続層及び半導体チャネル層を備えたトランジスタ |
US8563984B2 (en) | 2009-07-10 | 2013-10-22 | Sanken Electric Co., Ltd. | Semiconductor device |
US8921890B2 (en) | 2012-01-11 | 2014-12-30 | Samsung Electronics Co., Ltd. | Substrate structure, semiconductor device fabricated from the same, and method of fabricating the semiconductor device |
WO2015029578A1 (ja) * | 2013-08-27 | 2015-03-05 | 富士電機株式会社 | 半導体装置の製造方法および半導体装置 |
WO2017138398A1 (ja) * | 2016-02-08 | 2017-08-17 | パナソニック株式会社 | 半導体装置 |
JPWO2020017437A1 (ja) * | 2018-07-17 | 2021-08-02 | パナソニック株式会社 | 窒化物半導体装置 |
WO2023162521A1 (ja) * | 2022-02-22 | 2023-08-31 | ローム株式会社 | 窒化物半導体装置およびその製造方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008078604A (ja) * | 2006-08-24 | 2008-04-03 | Rohm Co Ltd | Mis型電界効果トランジスタおよびその製造方法 |
EP2117040B1 (en) * | 2007-02-27 | 2018-05-16 | Fujitsu Limited | Compound semiconductor device and process for producing the same |
JP5208463B2 (ja) * | 2007-08-09 | 2013-06-12 | ローム株式会社 | 窒化物半導体素子および窒化物半導体素子の製造方法 |
FR2924270B1 (fr) * | 2007-11-27 | 2010-08-27 | Picogiga Internat | Procede de fabrication d'un dispositif electronique |
US8242510B2 (en) * | 2010-01-28 | 2012-08-14 | Intersil Americas Inc. | Monolithic integration of gallium nitride and silicon devices and circuits, structure and method |
JP5880311B2 (ja) * | 2012-06-26 | 2016-03-09 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
US9252324B2 (en) | 2013-05-30 | 2016-02-02 | Globalfoundries Inc | Heterojunction light emitting diode |
JP2015056556A (ja) * | 2013-09-12 | 2015-03-23 | 株式会社東芝 | 半導体装置 |
US20150108500A1 (en) * | 2013-10-18 | 2015-04-23 | Infineon Technologies Austria Ag | Semiconductor Device and Method of Manufacturing the Same |
US20150270356A1 (en) * | 2014-03-20 | 2015-09-24 | Massachusetts Institute Of Technology | Vertical nitride semiconductor device |
US20160293596A1 (en) | 2015-03-30 | 2016-10-06 | Texas Instruments Incorporated | Normally off iii-nitride transistor |
KR20160136813A (ko) * | 2015-05-21 | 2016-11-30 | 서울반도체 주식회사 | 수직형 컨택 구조를 구비하는 질화물계 다이오드 소자 및 이의 제조 방법 |
WO2017071635A1 (en) * | 2015-10-30 | 2017-05-04 | The Hong Kong University Of Science And Technology | Semiconductor device with iii-nitride channel region and silicon carbide drift region |
US10062630B2 (en) * | 2015-12-31 | 2018-08-28 | Infineon Technologies Austria Ag | Water and ion barrier for the periphery of III-V semiconductor dies |
CN107146811B (zh) * | 2017-03-29 | 2019-12-10 | 西安电子科技大学 | 基于阻挡层调制结构的电流孔径功率晶体管及其制作方法 |
US20220336600A1 (en) * | 2021-04-20 | 2022-10-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Ohmic electrode for two-dimensional carrier gas (2dcg) semiconductor device |
US20230078017A1 (en) * | 2021-09-16 | 2023-03-16 | Wolfspeed, Inc. | Semiconductor device incorporating a substrate recess |
CN117810250B (zh) * | 2024-02-23 | 2024-06-11 | 深圳天狼芯半导体有限公司 | 增强型垂直hemt器件 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003069041A (ja) * | 2001-08-29 | 2003-03-07 | Denso Corp | 炭化珪素半導体装置及びその製造方法 |
JP2003229566A (ja) * | 2001-11-27 | 2003-08-15 | Furukawa Electric Co Ltd:The | 電力変換装置及びそれに用いるGaN系半導体装置 |
JP2003273358A (ja) * | 2002-03-15 | 2003-09-26 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0537889A2 (en) * | 1991-10-14 | 1993-04-21 | Fujitsu Limited | Quantum interference effect semiconductor device and method of producing the same |
US5557115A (en) * | 1994-08-11 | 1996-09-17 | Rohm Co. Ltd. | Light emitting semiconductor device with sub-mount |
JP3461274B2 (ja) * | 1996-10-16 | 2003-10-27 | 株式会社東芝 | 半導体装置 |
WO1998037584A1 (en) * | 1997-02-20 | 1998-08-27 | The Board Of Trustees Of The University Of Illinois | Solid state power-control device using group iii nitrides |
US5877047A (en) * | 1997-08-15 | 1999-03-02 | Motorola, Inc. | Lateral gate, vertical drift region transistor |
JP4667556B2 (ja) * | 2000-02-18 | 2011-04-13 | 古河電気工業株式会社 | 縦型GaN系電界効果トランジスタ、バイポーラトランジスタと縦型GaN系電界効果トランジスタの製造方法 |
JP3815335B2 (ja) * | 2002-01-18 | 2006-08-30 | ソニー株式会社 | 半導体発光素子及びその製造方法 |
JP4865189B2 (ja) * | 2002-02-21 | 2012-02-01 | 古河電気工業株式会社 | GaN系電界効果トランジスタ |
US6830945B2 (en) * | 2002-09-16 | 2004-12-14 | Hrl Laboratories, Llc | Method for fabricating a non-planar nitride-based heterostructure field effect transistor |
JP4477296B2 (ja) | 2002-11-14 | 2010-06-09 | 古河電気工業株式会社 | 電界効果トランジスタ及びその製造方法 |
JP4530171B2 (ja) * | 2003-08-08 | 2010-08-25 | サンケン電気株式会社 | 半導体装置 |
WO2005024955A1 (ja) * | 2003-09-05 | 2005-03-17 | Sanken Electric Co., Ltd. | 半導体装置 |
US7439555B2 (en) * | 2003-12-05 | 2008-10-21 | International Rectifier Corporation | III-nitride semiconductor device with trench structure |
US7407837B2 (en) * | 2004-01-27 | 2008-08-05 | Fuji Electric Holdings Co., Ltd. | Method of manufacturing silicon carbide semiconductor device |
US7098093B2 (en) * | 2004-09-13 | 2006-08-29 | Northrop Grumman Corporation | HEMT device and method of making |
US7348612B2 (en) * | 2004-10-29 | 2008-03-25 | Cree, Inc. | Metal-semiconductor field effect transistors (MESFETs) having drains coupled to the substrate and methods of fabricating the same |
JP4986406B2 (ja) * | 2005-03-31 | 2012-07-25 | 住友電工デバイス・イノベーション株式会社 | 半導体装置の製造方法 |
JP4916671B2 (ja) * | 2005-03-31 | 2012-04-18 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
-
2005
- 2005-03-31 JP JP2005104512A patent/JP5051980B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-30 US US11/392,517 patent/US7723751B2/en not_active Expired - Fee Related
- 2006-03-30 EP EP06251774A patent/EP1708275B1/en not_active Expired - Fee Related
- 2006-03-30 EP EP11188204A patent/EP2418682A3/en not_active Ceased
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003069041A (ja) * | 2001-08-29 | 2003-03-07 | Denso Corp | 炭化珪素半導体装置及びその製造方法 |
JP2003229566A (ja) * | 2001-11-27 | 2003-08-15 | Furukawa Electric Co Ltd:The | 電力変換装置及びそれに用いるGaN系半導体装置 |
JP2003273358A (ja) * | 2002-03-15 | 2003-09-26 | Denso Corp | 炭化珪素半導体装置およびその製造方法 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008153371A (ja) * | 2006-12-15 | 2008-07-03 | Furukawa Electric Co Ltd:The | 縦型電界効果トランジスタ |
US20100078688A1 (en) * | 2007-01-26 | 2010-04-01 | Rohm Co., Ltd | Nitride semiconductor device, nitride semiconductor package, and method for manufacturing nitride semiconductor device |
WO2008108456A1 (ja) * | 2007-03-08 | 2008-09-12 | Rohm Co., Ltd. | GaN系半導体素子 |
WO2008111518A1 (ja) * | 2007-03-12 | 2008-09-18 | Rohm Co., Ltd. | 窒化物半導体積層構造の形成方法および窒化物半導体素子の製造方法 |
JP2008227073A (ja) * | 2007-03-12 | 2008-09-25 | Rohm Co Ltd | 窒化物半導体積層構造の形成方法および窒化物半導体素子の製造方法 |
US8035131B2 (en) | 2007-03-12 | 2011-10-11 | Rohm Co., Ltd. | Method for forming a nitride semiconductor laminated structure and method for manufacturing a nitride semiconductor element |
US8563984B2 (en) | 2009-07-10 | 2013-10-22 | Sanken Electric Co., Ltd. | Semiconductor device |
US9312343B2 (en) | 2009-10-13 | 2016-04-12 | Cree, Inc. | Transistors with semiconductor interconnection layers and semiconductor channel layers of different semiconductor materials |
JP2013507789A (ja) * | 2009-10-13 | 2013-03-04 | クリー インコーポレイテッド | 異なる半導体材料の半導体相互接続層及び半導体チャネル層を備えたトランジスタ |
US8921890B2 (en) | 2012-01-11 | 2014-12-30 | Samsung Electronics Co., Ltd. | Substrate structure, semiconductor device fabricated from the same, and method of fabricating the semiconductor device |
WO2015029578A1 (ja) * | 2013-08-27 | 2015-03-05 | 富士電機株式会社 | 半導体装置の製造方法および半導体装置 |
WO2017138398A1 (ja) * | 2016-02-08 | 2017-08-17 | パナソニック株式会社 | 半導体装置 |
JPWO2017138398A1 (ja) * | 2016-02-08 | 2018-11-29 | パナソニック株式会社 | 半導体装置 |
US10686042B2 (en) | 2016-02-08 | 2020-06-16 | Panasonic Corporation | Semiconductor device |
JPWO2020017437A1 (ja) * | 2018-07-17 | 2021-08-02 | パナソニック株式会社 | 窒化物半導体装置 |
JP7303807B2 (ja) | 2018-07-17 | 2023-07-05 | パナソニックホールディングス株式会社 | 窒化物半導体装置 |
WO2023162521A1 (ja) * | 2022-02-22 | 2023-08-31 | ローム株式会社 | 窒化物半導体装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1708275B1 (en) | 2013-02-27 |
JP5051980B2 (ja) | 2012-10-17 |
EP1708275A2 (en) | 2006-10-04 |
EP2418682A2 (en) | 2012-02-15 |
EP1708275A3 (en) | 2008-05-28 |
EP2418682A3 (en) | 2012-07-25 |
US7723751B2 (en) | 2010-05-25 |
US20060219997A1 (en) | 2006-10-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5051980B2 (ja) | 半導体装置 | |
Shibata et al. | 1.7 kV/1.0 mΩcm 2 normally-off vertical GaN transistor on GaN substrate with regrown p-GaN/AlGaN/GaN semipolar gate structure | |
TWI445093B (zh) | 具有下凹閘極之iii族氮化物元件 | |
JP4916671B2 (ja) | 半導体装置 | |
JP5730332B2 (ja) | 低リークganmosfet | |
US7759699B2 (en) | III-nitride enhancement mode devices | |
JP4940557B2 (ja) | 電界効果トランジスタ及びその製造方法 | |
CN102969354B (zh) | 半导体器件 | |
JP5203725B2 (ja) | Iii族窒化物パワー半導体デバイス | |
JP5731687B2 (ja) | 窒化物半導体素子及びその製造方法 | |
JP2010153493A (ja) | 電界効果半導体装置及びその製造方法 | |
JP2008235613A (ja) | 半導体装置 | |
JP2011124572A (ja) | 高電圧耐久iii族窒化物半導体デバイス | |
KR20140042470A (ko) | 노멀리 오프 고전자이동도 트랜지스터 | |
JP2007142243A (ja) | 窒化物半導体電界効果トランジスタ及びその製造方法 | |
JP5468609B2 (ja) | 縦型トランジスタ及びその製造方法、並びに半導体装置 | |
JP2008147593A (ja) | Mis構造を内蔵するhemt | |
JP5098293B2 (ja) | ワイドバンドギャップ半導体を用いた絶縁ゲート型半導体装置およびその製造方法 | |
JP2006114795A (ja) | 半導体装置 | |
Uesugi et al. | GaN power switching devices for automotive applications | |
KR102067596B1 (ko) | 질화물 반도체 소자 및 그 제조 방법 | |
US8421182B2 (en) | Field effect transistor having MOS structure made of nitride compound semiconductor | |
JP2007088186A (ja) | 半導体装置及びその製造方法 | |
JP5458084B2 (ja) | 半導体装置の製造方法 | |
JP4876418B2 (ja) | 半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080317 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080317 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111125 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111206 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120118 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120306 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120409 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20120724 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20120724 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20150803 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |