JP2006281268A - レーザ加工機 - Google Patents

レーザ加工機 Download PDF

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Publication number
JP2006281268A
JP2006281268A JP2005104326A JP2005104326A JP2006281268A JP 2006281268 A JP2006281268 A JP 2006281268A JP 2005104326 A JP2005104326 A JP 2005104326A JP 2005104326 A JP2005104326 A JP 2005104326A JP 2006281268 A JP2006281268 A JP 2006281268A
Authority
JP
Japan
Prior art keywords
laser
optical path
laser beam
total reflection
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005104326A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006281268A5 (enExample
Inventor
Atsushi Saito
敦 齋藤
Kaoru Matsumura
薫 松村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Priority to JP2005104326A priority Critical patent/JP2006281268A/ja
Priority to TW095105909A priority patent/TW200633807A/zh
Priority to CNA2006100573189A priority patent/CN1840278A/zh
Priority to KR1020060028939A priority patent/KR20060105577A/ko
Publication of JP2006281268A publication Critical patent/JP2006281268A/ja
Publication of JP2006281268A5 publication Critical patent/JP2006281268A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Laser Beam Processing (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
JP2005104326A 2005-03-31 2005-03-31 レーザ加工機 Pending JP2006281268A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005104326A JP2006281268A (ja) 2005-03-31 2005-03-31 レーザ加工機
TW095105909A TW200633807A (en) 2005-03-31 2006-02-22 Laser machining apparatus
CNA2006100573189A CN1840278A (zh) 2005-03-31 2006-03-08 激光加工装置
KR1020060028939A KR20060105577A (ko) 2005-03-31 2006-03-30 레이저가공기

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005104326A JP2006281268A (ja) 2005-03-31 2005-03-31 レーザ加工機

Publications (2)

Publication Number Publication Date
JP2006281268A true JP2006281268A (ja) 2006-10-19
JP2006281268A5 JP2006281268A5 (enExample) 2007-04-12

Family

ID=37029564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005104326A Pending JP2006281268A (ja) 2005-03-31 2005-03-31 レーザ加工機

Country Status (4)

Country Link
JP (1) JP2006281268A (enExample)
KR (1) KR20060105577A (enExample)
CN (1) CN1840278A (enExample)
TW (1) TW200633807A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007050414A (ja) * 2005-08-16 2007-03-01 Matsushita Electric Ind Co Ltd レーザ加工装置
JP2008132517A (ja) * 2006-11-28 2008-06-12 Sumitomo Heavy Ind Ltd レーザ照射装置及びレーザ加工方法
TWI406730B (zh) * 2007-11-21 2013-09-01 Lpkf Laser & Electronics Ag 利用平行雷射光束將工作物加工的裝置
CN112538566A (zh) * 2020-11-25 2021-03-23 中国科学院宁波材料技术与工程研究所 一种激光冲击强化加工系统
KR20210111246A (ko) * 2019-01-31 2021-09-10 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저-가공 장치, 이의 작동 방법 및 이를 사용한 작업물 가공 방법
WO2024241936A1 (ja) * 2023-05-25 2024-11-28 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE502008001155D1 (de) * 2008-05-02 2010-09-30 Leister Process Tech Verfahren und Laservorrichtung zum Bearbeiten und/oder Verbinden von Werkstücken mittels Laserstrahlung mit Leistungswirk- und Pilotlaser und mindestens einem diffraktiven optischen Element
KR101134937B1 (ko) * 2009-10-14 2012-04-17 주식회사 한광옵토 레이저 조사장치
JP6430790B2 (ja) 2014-11-25 2018-11-28 株式会社ディスコ レーザー加工装置
JP6851751B2 (ja) 2016-08-30 2021-03-31 キヤノン株式会社 光学装置、加工装置、および物品製造方法
JP6844901B2 (ja) * 2017-05-26 2021-03-17 株式会社ディスコ レーザ加工装置及びレーザ加工方法
JP7462219B2 (ja) * 2020-05-08 2024-04-05 パナソニックＩｐマネジメント株式会社 レーザ加工装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007050414A (ja) * 2005-08-16 2007-03-01 Matsushita Electric Ind Co Ltd レーザ加工装置
JP2008132517A (ja) * 2006-11-28 2008-06-12 Sumitomo Heavy Ind Ltd レーザ照射装置及びレーザ加工方法
TWI406730B (zh) * 2007-11-21 2013-09-01 Lpkf Laser & Electronics Ag 利用平行雷射光束將工作物加工的裝置
KR20210111246A (ko) * 2019-01-31 2021-09-10 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저-가공 장치, 이의 작동 방법 및 이를 사용한 작업물 가공 방법
JP2022518898A (ja) * 2019-01-31 2022-03-17 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ加工装置、これを動作させる方法、及びこれを用いてワークピースを加工する方法
JP7573535B2 (ja) 2019-01-31 2024-10-25 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザ加工装置、これを動作させる方法、及びこれを用いてワークピースを加工する方法
KR102795535B1 (ko) 2019-01-31 2025-04-16 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저-가공 장치, 이의 작동 방법 및 이를 사용한 작업물 가공 방법
CN112538566A (zh) * 2020-11-25 2021-03-23 中国科学院宁波材料技术与工程研究所 一种激光冲击强化加工系统
WO2024241936A1 (ja) * 2023-05-25 2024-11-28 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
TW200633807A (en) 2006-10-01
KR20060105577A (ko) 2006-10-11
CN1840278A (zh) 2006-10-04

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