KR20060105577A - 레이저가공기 - Google Patents

레이저가공기 Download PDF

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Publication number
KR20060105577A
KR20060105577A KR1020060028939A KR20060028939A KR20060105577A KR 20060105577 A KR20060105577 A KR 20060105577A KR 1020060028939 A KR1020060028939 A KR 1020060028939A KR 20060028939 A KR20060028939 A KR 20060028939A KR 20060105577 A KR20060105577 A KR 20060105577A
Authority
KR
South Korea
Prior art keywords
laser
optical path
optical
optical system
total reflection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020060028939A
Other languages
English (en)
Korean (ko)
Inventor
아츠시 사이토
가오루 마츠무라
Original Assignee
히다치 비아 메카닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히다치 비아 메카닉스 가부시키가이샤 filed Critical 히다치 비아 메카닉스 가부시키가이샤
Publication of KR20060105577A publication Critical patent/KR20060105577A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Laser Beam Processing (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
KR1020060028939A 2005-03-31 2006-03-30 레이저가공기 Withdrawn KR20060105577A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00104326 2005-03-31
JP2005104326A JP2006281268A (ja) 2005-03-31 2005-03-31 レーザ加工機

Publications (1)

Publication Number Publication Date
KR20060105577A true KR20060105577A (ko) 2006-10-11

Family

ID=37029564

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060028939A Withdrawn KR20060105577A (ko) 2005-03-31 2006-03-30 레이저가공기

Country Status (4)

Country Link
JP (1) JP2006281268A (enExample)
KR (1) KR20060105577A (enExample)
CN (1) CN1840278A (enExample)
TW (1) TW200633807A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101134937B1 (ko) * 2009-10-14 2012-04-17 주식회사 한광옵토 레이저 조사장치

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4765474B2 (ja) * 2005-08-16 2011-09-07 パナソニック株式会社 レーザ加工装置
JP4490410B2 (ja) * 2006-11-28 2010-06-23 住友重機械工業株式会社 レーザ照射装置及びレーザ加工方法
DE102007056254B4 (de) * 2007-11-21 2009-10-29 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels paralleler Laserstrahlen
DE502008001155D1 (de) * 2008-05-02 2010-09-30 Leister Process Tech Verfahren und Laservorrichtung zum Bearbeiten und/oder Verbinden von Werkstücken mittels Laserstrahlung mit Leistungswirk- und Pilotlaser und mindestens einem diffraktiven optischen Element
JP6430790B2 (ja) 2014-11-25 2018-11-28 株式会社ディスコ レーザー加工装置
JP6851751B2 (ja) 2016-08-30 2021-03-31 キヤノン株式会社 光学装置、加工装置、および物品製造方法
JP6844901B2 (ja) * 2017-05-26 2021-03-17 株式会社ディスコ レーザ加工装置及びレーザ加工方法
TWI843784B (zh) * 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
JP7462219B2 (ja) * 2020-05-08 2024-04-05 パナソニックＩｐマネジメント株式会社 レーザ加工装置
CN112538566B (zh) * 2020-11-25 2022-07-29 中国科学院宁波材料技术与工程研究所 一种激光冲击强化加工系统
WO2024241936A1 (ja) * 2023-05-25 2024-11-28 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101134937B1 (ko) * 2009-10-14 2012-04-17 주식회사 한광옵토 레이저 조사장치

Also Published As

Publication number Publication date
TW200633807A (en) 2006-10-01
JP2006281268A (ja) 2006-10-19
CN1840278A (zh) 2006-10-04

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Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20060330

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid