CN1840278A - 激光加工装置 - Google Patents

激光加工装置 Download PDF

Info

Publication number
CN1840278A
CN1840278A CNA2006100573189A CN200610057318A CN1840278A CN 1840278 A CN1840278 A CN 1840278A CN A2006100573189 A CNA2006100573189 A CN A2006100573189A CN 200610057318 A CN200610057318 A CN 200610057318A CN 1840278 A CN1840278 A CN 1840278A
Authority
CN
China
Prior art keywords
laser
light path
laser beam
optical system
processing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006100573189A
Other languages
English (en)
Chinese (zh)
Inventor
斋藤敦
松村薰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Via Mechanics Ltd
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of CN1840278A publication Critical patent/CN1840278A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626Energy control of the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Laser Beam Processing (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
CNA2006100573189A 2005-03-31 2006-03-08 激光加工装置 Pending CN1840278A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005104326 2005-03-31
JP2005104326A JP2006281268A (ja) 2005-03-31 2005-03-31 レーザ加工機

Publications (1)

Publication Number Publication Date
CN1840278A true CN1840278A (zh) 2006-10-04

Family

ID=37029564

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2006100573189A Pending CN1840278A (zh) 2005-03-31 2006-03-08 激光加工装置

Country Status (4)

Country Link
JP (1) JP2006281268A (enExample)
KR (1) KR20060105577A (enExample)
CN (1) CN1840278A (enExample)
TW (1) TW200633807A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101569959B (zh) * 2008-05-02 2011-11-30 莱丹加工技术公司 激光器运行方法和激光装置
CN101878089B (zh) * 2007-11-21 2013-02-20 Lpkf激光和电子股份公司 用于借助于平行的激光射线加工工件的装置
CN105618928A (zh) * 2014-11-25 2016-06-01 株式会社迪思科 激光加工装置
CN112867578A (zh) * 2019-01-31 2021-05-28 伊雷克托科学工业股份有限公司 激光加工设备、其操作方法及使用其加工工件的方法
CN113618231A (zh) * 2020-05-08 2021-11-09 松下知识产权经营株式会社 激光加工装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4765474B2 (ja) * 2005-08-16 2011-09-07 パナソニック株式会社 レーザ加工装置
JP4490410B2 (ja) * 2006-11-28 2010-06-23 住友重機械工業株式会社 レーザ照射装置及びレーザ加工方法
KR101134937B1 (ko) * 2009-10-14 2012-04-17 주식회사 한광옵토 레이저 조사장치
JP6851751B2 (ja) 2016-08-30 2021-03-31 キヤノン株式会社 光学装置、加工装置、および物品製造方法
JP6844901B2 (ja) * 2017-05-26 2021-03-17 株式会社ディスコ レーザ加工装置及びレーザ加工方法
CN112538566B (zh) * 2020-11-25 2022-07-29 中国科学院宁波材料技术与工程研究所 一种激光冲击强化加工系统
WO2024241936A1 (ja) * 2023-05-25 2024-11-28 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101878089B (zh) * 2007-11-21 2013-02-20 Lpkf激光和电子股份公司 用于借助于平行的激光射线加工工件的装置
CN101569959B (zh) * 2008-05-02 2011-11-30 莱丹加工技术公司 激光器运行方法和激光装置
CN105618928A (zh) * 2014-11-25 2016-06-01 株式会社迪思科 激光加工装置
CN105618928B (zh) * 2014-11-25 2019-04-26 株式会社迪思科 激光加工装置
DE102015223172B4 (de) 2014-11-25 2025-11-20 Disco Corporation Laserbearbeitungsvorrichtung
CN112867578A (zh) * 2019-01-31 2021-05-28 伊雷克托科学工业股份有限公司 激光加工设备、其操作方法及使用其加工工件的方法
CN113618231A (zh) * 2020-05-08 2021-11-09 松下知识产权经营株式会社 激光加工装置

Also Published As

Publication number Publication date
TW200633807A (en) 2006-10-01
KR20060105577A (ko) 2006-10-11
JP2006281268A (ja) 2006-10-19

Similar Documents

Publication Publication Date Title
CN1840278A (zh) 激光加工装置
CN101041204A (zh) 激光焊接装置及其方法
CN1319695C (zh) 多束激光开孔加工装置
US6875951B2 (en) Laser machining device
CN1162245C (zh) 激光加工装置及方法
CN109891294B (zh) 光学组件、多点扫描显微镜和用于运行显微镜的方法
US7599115B2 (en) Raster microscope
JPH08150485A (ja) レーザマーキング装置
CN1232380C (zh) 激光加工装置
KR20110081164A (ko) 마이크로 기계가공 용례를 위한 레이저 비임의 포스트 렌즈 조향
US11525989B2 (en) Optical assembly for scanning excitation radiation and/or manipulation radiation in a laser scanning microscope, and laser scanning microscope
CN120190473B (zh) 一种可切换的双激光头加工光路系统及装置
CN104741779B (zh) 一种激光输出头及激光加工机台
JP3365388B2 (ja) レーザ加工光学装置
CN2598002Y (zh) 一种多光点激光加工镜头
JP4171787B2 (ja) 試料または観察対象物の情報取得のための光学装置
CN210090821U (zh) 激光扫描和成像装置及激光显微切割仪
CN218555918U (zh) 一种多光束异分布图形数据同步加工设备
JPH07294833A (ja) レーザ光分割装置
CN1049740C (zh) 激光变长线扫描系统
CN220863001U (zh) 一种多束光发射装置及激光加工设备
WO2023131466A1 (de) SCANNERSCHWEIßVORRICHTUNG UND VERFAHREN ZUM SCANNERSCHWEIßEN VON ZUMINDEST ZWEI WERKSTÜCKEN
HK1090599A (en) Laser machining apparatus
CN116275529B (zh) 一种激光-电弧复合熔丝系统
CN101579785A (zh) 激光加工装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1090599

Country of ref document: HK

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication
REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1090599

Country of ref document: HK