TW200633807A - Laser machining apparatus - Google Patents

Laser machining apparatus

Info

Publication number
TW200633807A
TW200633807A TW095105909A TW95105909A TW200633807A TW 200633807 A TW200633807 A TW 200633807A TW 095105909 A TW095105909 A TW 095105909A TW 95105909 A TW95105909 A TW 95105909A TW 200633807 A TW200633807 A TW 200633807A
Authority
TW
Taiwan
Prior art keywords
total reflection
reflection mirror
laser beam
reflected
laser
Prior art date
Application number
TW095105909A
Other languages
English (en)
Chinese (zh)
Inventor
Atsushi Saito
Kaoru Matsumura
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of TW200633807A publication Critical patent/TW200633807A/zh

Links

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Laser Beam Processing (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
TW095105909A 2005-03-31 2006-02-22 Laser machining apparatus TW200633807A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005104326A JP2006281268A (ja) 2005-03-31 2005-03-31 レーザ加工機

Publications (1)

Publication Number Publication Date
TW200633807A true TW200633807A (en) 2006-10-01

Family

ID=37029564

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105909A TW200633807A (en) 2005-03-31 2006-02-22 Laser machining apparatus

Country Status (4)

Country Link
JP (1) JP2006281268A (enExample)
KR (1) KR20060105577A (enExample)
CN (1) CN1840278A (enExample)
TW (1) TW200633807A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI642970B (zh) * 2016-08-30 2018-12-01 日商佳能股份有限公司 光學裝置、加工裝置及物品製造方法
TWI746853B (zh) * 2017-05-26 2021-11-21 日商迪思科股份有限公司 雷射加工裝置及雷射加工方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4765474B2 (ja) * 2005-08-16 2011-09-07 パナソニック株式会社 レーザ加工装置
JP4490410B2 (ja) * 2006-11-28 2010-06-23 住友重機械工業株式会社 レーザ照射装置及びレーザ加工方法
DE102007056254B4 (de) * 2007-11-21 2009-10-29 Lpkf Laser & Electronics Ag Vorrichtung zur Bearbeitung eines Werkstücks mittels paralleler Laserstrahlen
DE502008001155D1 (de) * 2008-05-02 2010-09-30 Leister Process Tech Verfahren und Laservorrichtung zum Bearbeiten und/oder Verbinden von Werkstücken mittels Laserstrahlung mit Leistungswirk- und Pilotlaser und mindestens einem diffraktiven optischen Element
KR101134937B1 (ko) * 2009-10-14 2012-04-17 주식회사 한광옵토 레이저 조사장치
JP6430790B2 (ja) 2014-11-25 2018-11-28 株式会社ディスコ レーザー加工装置
TWI843784B (zh) * 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
JP7462219B2 (ja) * 2020-05-08 2024-04-05 パナソニックＩｐマネジメント株式会社 レーザ加工装置
CN112538566B (zh) * 2020-11-25 2022-07-29 中国科学院宁波材料技术与工程研究所 一种激光冲击强化加工系统
WO2024241936A1 (ja) * 2023-05-25 2024-11-28 東京エレクトロン株式会社 基板処理方法及び基板処理装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI642970B (zh) * 2016-08-30 2018-12-01 日商佳能股份有限公司 光學裝置、加工裝置及物品製造方法
US10845589B2 (en) 2016-08-30 2020-11-24 Canon Kabushiki Kaisha Optical apparatus, machining apparatus, and article manufacturing method
TWI746853B (zh) * 2017-05-26 2021-11-21 日商迪思科股份有限公司 雷射加工裝置及雷射加工方法

Also Published As

Publication number Publication date
KR20060105577A (ko) 2006-10-11
JP2006281268A (ja) 2006-10-19
CN1840278A (zh) 2006-10-04

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