JP2006229175A5 - - Google Patents

Download PDF

Info

Publication number
JP2006229175A5
JP2006229175A5 JP2005044820A JP2005044820A JP2006229175A5 JP 2006229175 A5 JP2006229175 A5 JP 2006229175A5 JP 2005044820 A JP2005044820 A JP 2005044820A JP 2005044820 A JP2005044820 A JP 2005044820A JP 2006229175 A5 JP2006229175 A5 JP 2006229175A5
Authority
JP
Japan
Prior art keywords
pads
switches
input
output pads
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005044820A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006229175A (ja
JP4386851B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005044820A priority Critical patent/JP4386851B2/ja
Priority claimed from JP2005044820A external-priority patent/JP4386851B2/ja
Publication of JP2006229175A publication Critical patent/JP2006229175A/ja
Publication of JP2006229175A5 publication Critical patent/JP2006229175A5/ja
Application granted granted Critical
Publication of JP4386851B2 publication Critical patent/JP4386851B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005044820A 2005-02-21 2005-02-21 半導体装置の製造方法 Expired - Fee Related JP4386851B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005044820A JP4386851B2 (ja) 2005-02-21 2005-02-21 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005044820A JP4386851B2 (ja) 2005-02-21 2005-02-21 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006229175A JP2006229175A (ja) 2006-08-31
JP2006229175A5 true JP2006229175A5 (enExample) 2007-07-05
JP4386851B2 JP4386851B2 (ja) 2009-12-16

Family

ID=36990225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005044820A Expired - Fee Related JP4386851B2 (ja) 2005-02-21 2005-02-21 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4386851B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016162925A (ja) * 2015-03-03 2016-09-05 力晶科技股▲ふん▼有限公司 Momキャパシタ回路及び半導体装置
CN113225953B (zh) * 2021-05-07 2022-12-13 江西雕视信息技术股份有限公司 一种可支持高分辨率点对点显示编码解码的装置及方法

Similar Documents

Publication Publication Date Title
JP2006523036A5 (enExample)
JP2005527968A5 (enExample)
JP2004063767A5 (enExample)
JP2005520342A5 (enExample)
JP2006507686A5 (enExample)
CN106575652B (zh) 用于系统级封装(sip)器件的改良基板
TW200737536A (en) Bendable solid state planar light source, a flexible substrate therefor, and a manufacturing method therewith
JP2004523912A5 (enExample)
JPH113984A (ja) 半導体集積回路装置
JP2009277916A5 (enExample)
JP2008520111A5 (enExample)
KR100910231B1 (ko) 웨이퍼 레벨 반도체 패키지 및 이의 제조 방법
JP2006190771A (ja) 半導体装置
KR20170005000A (ko) 반도체 디바이스 내의 금속 라인 상호연결부로서 형성된 범프 결합부
TWM343241U (en) Semiconductor chip package structure
TW200743199A (en) Bonding pad structure and semiconductor chip
JP2006229175A5 (enExample)
JP2011222901A (ja) 半導体装置
JP2004031790A5 (enExample)
TW200603353A (en) Chip structure with redistribution circuit, chip package and manufacturing process thereof
TWM534895U (zh) 多層晶片封裝結構
JP2016192447A (ja) 半導体装置
JP4813786B2 (ja) 集積回路および集積回路アセンブリ
JP2009049170A5 (enExample)
JP3227930B2 (ja) 複合半導体装置及びその製造方法