JP2009049170A5 - - Google Patents

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Publication number
JP2009049170A5
JP2009049170A5 JP2007213554A JP2007213554A JP2009049170A5 JP 2009049170 A5 JP2009049170 A5 JP 2009049170A5 JP 2007213554 A JP2007213554 A JP 2007213554A JP 2007213554 A JP2007213554 A JP 2007213554A JP 2009049170 A5 JP2009049170 A5 JP 2009049170A5
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JP
Japan
Prior art keywords
bumps
semiconductor device
circuit
mounting
connection
Prior art date
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Granted
Application number
JP2007213554A
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English (en)
Japanese (ja)
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JP5144170B2 (ja
JP2009049170A (ja
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Priority to JP2007213554A priority Critical patent/JP5144170B2/ja
Priority claimed from JP2007213554A external-priority patent/JP5144170B2/ja
Publication of JP2009049170A publication Critical patent/JP2009049170A/ja
Publication of JP2009049170A5 publication Critical patent/JP2009049170A5/ja
Application granted granted Critical
Publication of JP5144170B2 publication Critical patent/JP5144170B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007213554A 2007-08-20 2007-08-20 半導体装置の実装方法 Expired - Fee Related JP5144170B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007213554A JP5144170B2 (ja) 2007-08-20 2007-08-20 半導体装置の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007213554A JP5144170B2 (ja) 2007-08-20 2007-08-20 半導体装置の実装方法

Publications (3)

Publication Number Publication Date
JP2009049170A JP2009049170A (ja) 2009-03-05
JP2009049170A5 true JP2009049170A5 (enExample) 2010-09-30
JP5144170B2 JP5144170B2 (ja) 2013-02-13

Family

ID=40501128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007213554A Expired - Fee Related JP5144170B2 (ja) 2007-08-20 2007-08-20 半導体装置の実装方法

Country Status (1)

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JP (1) JP5144170B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5342422B2 (ja) 2009-12-10 2013-11-13 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
CN110473839B (zh) 2018-05-11 2025-03-21 三星电子株式会社 半导体封装系统
US10991638B2 (en) 2018-05-14 2021-04-27 Samsung Electronics Co., Ltd. Semiconductor package system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63271966A (ja) * 1987-04-28 1988-11-09 Nec Corp 半導体集積回路
JPH03172782A (ja) * 1989-12-01 1991-07-26 Hitachi Ltd 半導体集積回路
JP4509437B2 (ja) * 2000-09-11 2010-07-21 Ｈｏｙａ株式会社 多層配線基板の製造方法
JP2004335858A (ja) * 2003-05-09 2004-11-25 Murata Mfg Co Ltd 電子部品およびそれを用いた電子機器
JP2004078996A (ja) * 2003-11-17 2004-03-11 Renesas Technology Corp データ処理装置
JP2007115904A (ja) * 2005-10-20 2007-05-10 Renesas Technology Corp 半導体装置の製造方法

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