JP4813786B2 - 集積回路および集積回路アセンブリ - Google Patents
集積回路および集積回路アセンブリ Download PDFInfo
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- JP4813786B2 JP4813786B2 JP2004283743A JP2004283743A JP4813786B2 JP 4813786 B2 JP4813786 B2 JP 4813786B2 JP 2004283743 A JP2004283743 A JP 2004283743A JP 2004283743 A JP2004283743 A JP 2004283743A JP 4813786 B2 JP4813786 B2 JP 4813786B2
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- substrate
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73207—Bump and wire connectors
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H01L2924/19041—Component type being a capacitor
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- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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Description
14 半導体基板
16 相互接続基板
20 第一のボンディングパッド
24 第二のボンディングパッド
28 相互接続層
29 周辺領域
30 ワイヤボンド
32 フィルタコンデンサ
50 集積回路
54 半導体基板
62 第一のボンディングパッド
64 第二のボンディングパッド
66 ワイヤボンド
70 相互接続基板
73 周辺領域
74 フィルタコンデンサ
Claims (6)
- 第一の複数のボンディングパッドを有する第一の基板を備え、該第一の基板が配置された表面側に開口する空洞が設けられた集積回路パッケージと、
前記集積回路パッケージの前記空洞に配置された半導体基板であって、該半導体基板は、第二の複数のボンディングパッドを備えると共に、ある表面積を有しており、前記半導体基板の第一の面は、前記空洞内に配置され、前記半導体基板における前記第一の面と反対側に位置する第二の面は、前記集積回路パッケージの表面と略同一平面上になるように配置されている、半導体基板と、
前記第一の複数のボンディングパッドから選択されたものを前記第二の複数のボンディングパッドの選択されたものへと接続する複数のワイヤボンドと、
前記半導体基板上に取り付けられ、前記半導体基板の前記表面積よりも小さい表面積を有し、前記半導体基板へフリップチップボンディングされており、及び前記第一の複数のボンディングパッドから選択されたものが複数のワイヤボンドにより接続されている、相互接続基板と
を備えたことを特徴とする集積回路。 - 前記相互接続基板が、有機材料、セラミックおよびシリコンのうちの1つから形成されていることを特徴とする、請求項1に記載の集積回路。
- 前記相互接続基板が、その上に導電性の相互接続層を備えていることを特徴とする、請求項1又は請求項2に記載の集積回路。
- 前記半導体基板が、前記相互接続基板を取り囲む周辺領域を有し、前記第二の複数のボンディングパッドの少なくとも一部が、前記周辺領域中にあることを特徴とする、請求項1から請求項3のいずれかに記載の集積回路。
- 前記相互接続基板が、少なくとも1つのフィルタコンデンサを備えていることを特徴とする、請求項1から請求項4のいずれかに記載の集積回路。
- 前記相互接続基板及び前記集積回路パッケージ上の前記第一の基板が、略同一平面上になるように配置されていることを特徴とする請求項1から請求項5のいずれかに記載の集積回路。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/678,495 US7262508B2 (en) | 2003-10-03 | 2003-10-03 | Integrated circuit incorporating flip chip and wire bonding |
US10/678495 | 2003-10-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005117038A JP2005117038A (ja) | 2005-04-28 |
JP4813786B2 true JP4813786B2 (ja) | 2011-11-09 |
Family
ID=34393949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004283743A Expired - Fee Related JP4813786B2 (ja) | 2003-10-03 | 2004-09-29 | 集積回路および集積回路アセンブリ |
Country Status (3)
Country | Link |
---|---|
US (1) | US7262508B2 (ja) |
JP (1) | JP4813786B2 (ja) |
DE (1) | DE102004030541B4 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070164446A1 (en) * | 2006-01-13 | 2007-07-19 | Hawk Donald E Jr | Integrated circuit having second substrate to facilitate core power and ground distribution |
KR100763345B1 (ko) * | 2006-08-30 | 2007-10-04 | 삼성전기주식회사 | 전자소자 내장형 인쇄회로기판의 제조방법 |
US9799627B2 (en) * | 2012-01-19 | 2017-10-24 | Semiconductor Components Industries, Llc | Semiconductor package structure and method |
US10672696B2 (en) * | 2017-11-22 | 2020-06-02 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
CN110828496B (zh) * | 2019-11-15 | 2022-10-11 | 华天科技(昆山)电子有限公司 | 半导体器件及其制造方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS589223A (ja) * | 1981-07-10 | 1983-01-19 | Fujitsu Ltd | 光学的記録再生装置 |
JPH04127531A (ja) * | 1990-09-19 | 1992-04-28 | Fujitsu Ltd | 半導体装置及びその製造方法 |
JPH05211279A (ja) * | 1991-11-20 | 1993-08-20 | Nec Corp | 混成集積回路 |
JP3173308B2 (ja) * | 1995-02-14 | 2001-06-04 | 住友金属工業株式会社 | 半導体集積回路装置 |
TW373308B (en) * | 1995-02-24 | 1999-11-01 | Agere Systems Inc | Thin packaging of multi-chip modules with enhanced thermal/power management |
KR100386061B1 (ko) | 1995-10-24 | 2003-08-21 | 오끼 덴끼 고오교 가부시끼가이샤 | 크랙을방지하기위한개량된구조를가지는반도체장치및리이드프레임 |
FR2758935B1 (fr) | 1997-01-28 | 2001-02-16 | Matra Marconi Space France | Boitier micro-electronique multi-niveaux |
JPH10321791A (ja) * | 1997-03-17 | 1998-12-04 | Tokai Rika Co Ltd | オペアンプ装置 |
US5798567A (en) * | 1997-08-21 | 1998-08-25 | Hewlett-Packard Company | Ball grid array integrated circuit package which employs a flip chip integrated circuit and decoupling capacitors |
US6683384B1 (en) * | 1997-10-08 | 2004-01-27 | Agere Systems Inc | Air isolated crossovers |
US6150724A (en) * | 1998-03-02 | 2000-11-21 | Motorola, Inc. | Multi-chip semiconductor device and method for making the device by using multiple flip chip interfaces |
JP2000156435A (ja) * | 1998-06-22 | 2000-06-06 | Fujitsu Ltd | 半導体装置及びその製造方法 |
US6429530B1 (en) | 1998-11-02 | 2002-08-06 | International Business Machines Corporation | Miniaturized chip scale ball grid array semiconductor package |
JP3418134B2 (ja) * | 1999-02-12 | 2003-06-16 | ローム株式会社 | チップ・オン・チップ構造の半導体装置 |
US6228682B1 (en) * | 1999-12-21 | 2001-05-08 | International Business Machines Corporation | Multi-cavity substrate structure for discrete devices |
SG95637A1 (en) * | 2001-03-15 | 2003-04-23 | Micron Technology Inc | Semiconductor/printed circuit board assembly, and computer system |
US20030038356A1 (en) * | 2001-08-24 | 2003-02-27 | Derderian James M | Semiconductor devices including stacking spacers thereon, assemblies including the semiconductor devices, and methods |
TW582100B (en) * | 2002-05-30 | 2004-04-01 | Fujitsu Ltd | Semiconductor device having a heat spreader exposed from a seal resin |
-
2003
- 2003-10-03 US US10/678,495 patent/US7262508B2/en not_active Expired - Lifetime
-
2004
- 2004-06-24 DE DE102004030541A patent/DE102004030541B4/de not_active Expired - Fee Related
- 2004-09-29 JP JP2004283743A patent/JP4813786B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102004030541B4 (de) | 2007-02-08 |
DE102004030541A1 (de) | 2005-05-12 |
JP2005117038A (ja) | 2005-04-28 |
US20050073054A1 (en) | 2005-04-07 |
US7262508B2 (en) | 2007-08-28 |
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