JP2004031790A5 - - Google Patents
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- Publication number
- JP2004031790A5 JP2004031790A5 JP2002188053A JP2002188053A JP2004031790A5 JP 2004031790 A5 JP2004031790 A5 JP 2004031790A5 JP 2002188053 A JP2002188053 A JP 2002188053A JP 2002188053 A JP2002188053 A JP 2002188053A JP 2004031790 A5 JP2004031790 A5 JP 2004031790A5
- Authority
- JP
- Japan
- Prior art keywords
- input
- output terminals
- layer
- semiconductor chip
- rewiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002188053A JP2004031790A (ja) | 2002-06-27 | 2002-06-27 | 半導体チップ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002188053A JP2004031790A (ja) | 2002-06-27 | 2002-06-27 | 半導体チップ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004031790A JP2004031790A (ja) | 2004-01-29 |
| JP2004031790A5 true JP2004031790A5 (enExample) | 2005-05-12 |
Family
ID=31182914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002188053A Pending JP2004031790A (ja) | 2002-06-27 | 2002-06-27 | 半導体チップ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004031790A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5039384B2 (ja) * | 2004-12-03 | 2012-10-03 | ローム株式会社 | 半導体装置 |
| JP4774248B2 (ja) | 2005-07-22 | 2011-09-14 | Ｏｋｉセミコンダクタ株式会社 | 半導体装置 |
| JP2009212481A (ja) | 2007-04-27 | 2009-09-17 | Sharp Corp | 半導体装置及び半導体装置の製造方法 |
| JP4683082B2 (ja) * | 2007-09-04 | 2011-05-11 | エプソンイメージングデバイス株式会社 | 半導体装置、半導体実装構造、電気光学装置 |
| JP4645635B2 (ja) * | 2007-11-02 | 2011-03-09 | セイコーエプソン株式会社 | 電子部品 |
| JP5655197B2 (ja) * | 2010-10-27 | 2015-01-21 | リコー電子デバイス株式会社 | 半導体パッケージ |
| JP6194516B2 (ja) * | 2014-08-29 | 2017-09-13 | 豊田合成株式会社 | Ｍｉｓ型半導体装置 |
| US9589946B2 (en) * | 2015-04-28 | 2017-03-07 | Kabushiki Kaisha Toshiba | Chip with a bump connected to a plurality of wirings |
| JP2017174994A (ja) | 2016-03-24 | 2017-09-28 | ソニー株式会社 | 撮像装置、電子機器 |
| JP7303343B2 (ja) * | 2017-11-29 | 2023-07-04 | ラピスセミコンダクタ株式会社 | 半導体装置及び半導体装置の製造方法 |
-
2002
- 2002-06-27 JP JP2002188053A patent/JP2004031790A/ja active Pending
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