JP2004031790A - 半導体チップ - Google Patents

半導体チップ Download PDF

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Publication number
JP2004031790A
JP2004031790A JP2002188053A JP2002188053A JP2004031790A JP 2004031790 A JP2004031790 A JP 2004031790A JP 2002188053 A JP2002188053 A JP 2002188053A JP 2002188053 A JP2002188053 A JP 2002188053A JP 2004031790 A JP2004031790 A JP 2004031790A
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JP
Japan
Prior art keywords
semiconductor chip
circuit
input
layer
insulating layer
Prior art date
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Pending
Application number
JP2002188053A
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English (en)
Japanese (ja)
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JP2004031790A5 (enExample
Inventor
Tomonori Kanai
金井　友範
Seiji Kishimoto
岸本　清治
Hiroyuki Tsukamoto
塚本　博之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP2002188053A priority Critical patent/JP2004031790A/ja
Publication of JP2004031790A publication Critical patent/JP2004031790A/ja
Publication of JP2004031790A5 publication Critical patent/JP2004031790A5/ja
Pending legal-status Critical Current

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  • Semiconductor Integrated Circuits (AREA)
JP2002188053A 2002-06-27 2002-06-27 半導体チップ Pending JP2004031790A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002188053A JP2004031790A (ja) 2002-06-27 2002-06-27 半導体チップ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002188053A JP2004031790A (ja) 2002-06-27 2002-06-27 半導体チップ

Publications (2)

Publication Number Publication Date
JP2004031790A true JP2004031790A (ja) 2004-01-29
JP2004031790A5 JP2004031790A5 (enExample) 2005-05-12

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ID=31182914

Family Applications (1)

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JP2002188053A Pending JP2004031790A (ja) 2002-06-27 2002-06-27 半導体チップ

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JP (1) JP2004031790A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006059547A1 (ja) * 2004-12-03 2006-06-08 Rohm Co., Ltd 半導体装置
JP2007035686A (ja) * 2005-07-22 2007-02-08 Oki Electric Ind Co Ltd 半導体装置
JP2009081416A (ja) * 2007-09-04 2009-04-16 Epson Imaging Devices Corp 半導体装置、半導体実装構造、電気光学装置
JP2009117475A (ja) * 2007-11-02 2009-05-28 Seiko Epson Corp 電子部品
JP2009212481A (ja) * 2007-04-27 2009-09-17 Sharp Corp 半導体装置及び半導体装置の製造方法
JP2012094704A (ja) * 2010-10-27 2012-05-17 Ricoh Co Ltd 半導体パッケージ
JP2016051775A (ja) * 2014-08-29 2016-04-11 豊田合成株式会社 Ｍｉｓ型半導体装置
WO2017163924A1 (ja) * 2016-03-24 2017-09-28 ソニー株式会社 撮像装置、電子機器
CN110010583A (zh) * 2015-04-28 2019-07-12 东芝存储器株式会社 半导体装置
JP2022078279A (ja) * 2017-11-29 2022-05-24 ラピスセミコンダクタ株式会社 半導体装置及び半導体装置の製造方法

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101814458B (zh) * 2004-12-03 2012-05-30 罗姆股份有限公司 半导体装置
JPWO2006059547A1 (ja) * 2004-12-03 2008-06-05 ローム株式会社 半導体装置
WO2006059547A1 (ja) * 2004-12-03 2006-06-08 Rohm Co., Ltd 半導体装置
JP5039384B2 (ja) * 2004-12-03 2012-10-03 ローム株式会社 半導体装置
JP2007035686A (ja) * 2005-07-22 2007-02-08 Oki Electric Ind Co Ltd 半導体装置
US7479690B2 (en) 2005-07-22 2009-01-20 Oki Electric Industry Co., Ltd. Semiconductor device
JP2009212481A (ja) * 2007-04-27 2009-09-17 Sharp Corp 半導体装置及び半導体装置の製造方法
US7906856B2 (en) 2007-04-27 2011-03-15 Sharp Kabushiki Kaisha Semiconductor device and method for manufacturing semiconductor device
JP2009081416A (ja) * 2007-09-04 2009-04-16 Epson Imaging Devices Corp 半導体装置、半導体実装構造、電気光学装置
JP2009117475A (ja) * 2007-11-02 2009-05-28 Seiko Epson Corp 電子部品
US8178968B2 (en) 2007-11-02 2012-05-15 Seiko Epson Corporation Electronic component
JP2012094704A (ja) * 2010-10-27 2012-05-17 Ricoh Co Ltd 半導体パッケージ
JP2016051775A (ja) * 2014-08-29 2016-04-11 豊田合成株式会社 Ｍｉｓ型半導体装置
CN110010583A (zh) * 2015-04-28 2019-07-12 东芝存储器株式会社 半导体装置
CN110010583B (zh) * 2015-04-28 2023-11-21 铠侠股份有限公司 半导体装置
WO2017163924A1 (ja) * 2016-03-24 2017-09-28 ソニー株式会社 撮像装置、電子機器
US10529752B2 (en) 2016-03-24 2020-01-07 Sony Corporation Image pickup device and electronic apparatus
US11984462B2 (en) 2016-03-24 2024-05-14 Sony Group Corporation Image pickup device and electronic apparatus
JP2022078279A (ja) * 2017-11-29 2022-05-24 ラピスセミコンダクタ株式会社 半導体装置及び半導体装置の製造方法
JP7303343B2 (ja) 2017-11-29 2023-07-04 ラピスセミコンダクタ株式会社 半導体装置及び半導体装置の製造方法

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