JP2006222471A5 - - Google Patents
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- Publication number
- JP2006222471A5 JP2006222471A5 JP2006148106A JP2006148106A JP2006222471A5 JP 2006222471 A5 JP2006222471 A5 JP 2006222471A5 JP 2006148106 A JP2006148106 A JP 2006148106A JP 2006148106 A JP2006148106 A JP 2006148106A JP 2006222471 A5 JP2006222471 A5 JP 2006222471A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- semiconductor device
- encapsulated semiconductor
- die pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims description 341
- 238000007789 sealing Methods 0.000 claims description 58
- 229920005989 resin Polymers 0.000 claims description 53
- 239000011347 resin Substances 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 42
- 229910052751 metal Inorganic materials 0.000 claims description 42
- 229910001111 Fine metal Inorganic materials 0.000 claims description 26
- 238000006011 modification reaction Methods 0.000 description 54
- 230000004048 modification Effects 0.000 description 52
- 238000000034 method Methods 0.000 description 50
- 239000000725 suspension Substances 0.000 description 38
- 238000005530 etching Methods 0.000 description 22
- 238000004519 manufacturing process Methods 0.000 description 18
- 238000010586 diagram Methods 0.000 description 15
- 238000003780 insertion Methods 0.000 description 15
- 238000000926 separation method Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 10
- 238000007747 plating Methods 0.000 description 9
- 238000003825 pressing Methods 0.000 description 7
- 230000003014 reinforcing Effects 0.000 description 7
- 238000004891 communication Methods 0.000 description 6
- 230000000630 rising Effects 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 240000004282 Grewia occidentalis Species 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000002093 peripheral Effects 0.000 description 3
- 230000000875 corresponding Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 210000003165 Abomasum Anatomy 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 229920001721 Polyimide Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002250 progressing Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- -1 silicon germanium carbon Chemical compound 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006148106A JP4652281B2 (ja) | 2006-05-29 | 2006-05-29 | 樹脂封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006148106A JP4652281B2 (ja) | 2006-05-29 | 2006-05-29 | 樹脂封止型半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004117283A Division JP3913228B2 (ja) | 2004-04-12 | 2004-04-12 | 樹脂封止型半導体装置及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010106155A Division JP2010166100A (ja) | 2010-05-06 | 2010-05-06 | 樹脂封止型半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006222471A JP2006222471A (ja) | 2006-08-24 |
| JP2006222471A5 true JP2006222471A5 (ko) | 2007-01-18 |
| JP4652281B2 JP4652281B2 (ja) | 2011-03-16 |
Family
ID=36984521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006148106A Expired - Fee Related JP4652281B2 (ja) | 2006-05-29 | 2006-05-29 | 樹脂封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4652281B2 (ko) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008117875A (ja) * | 2006-11-02 | 2008-05-22 | Renesas Technology Corp | 半導体装置および半導体装置の製造方法 |
| JP4380748B2 (ja) | 2007-08-08 | 2009-12-09 | ヤマハ株式会社 | 半導体装置、及び、マイクロフォンパッケージ |
| JP5499437B2 (ja) * | 2008-01-10 | 2014-05-21 | 株式会社デンソー | モールドパッケージ |
| KR101657330B1 (ko) | 2009-05-15 | 2016-09-13 | 로무 가부시키가이샤 | 반도체 장치 |
| JP5953703B2 (ja) | 2011-10-31 | 2016-07-20 | ソニー株式会社 | リードフレームおよび半導体装置 |
| JPWO2023008252A1 (ko) * | 2021-07-26 | 2023-02-02 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100221562B1 (ko) * | 1997-02-17 | 1999-09-15 | 마이클 디. 오브라이언 | 볼 그리드 어레이 반도체 패키지의 구조 및 그 제조 방법 |
| JP2000299423A (ja) * | 1999-04-16 | 2000-10-24 | Hitachi Ltd | リードフレームおよびそれを用いた半導体装置ならびにその製造方法 |
| JP2001345411A (ja) * | 2000-05-31 | 2001-12-14 | Matsushita Electric Ind Co Ltd | リードフレームとそれを用いた半導体装置及びその生産方法 |
-
2006
- 2006-05-29 JP JP2006148106A patent/JP4652281B2/ja not_active Expired - Fee Related
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