JPWO2023008252A1 - - Google Patents
Info
- Publication number
- JPWO2023008252A1 JPWO2023008252A1 JP2023538453A JP2023538453A JPWO2023008252A1 JP WO2023008252 A1 JPWO2023008252 A1 JP WO2023008252A1 JP 2023538453 A JP2023538453 A JP 2023538453A JP 2023538453 A JP2023538453 A JP 2023538453A JP WO2023008252 A1 JPWO2023008252 A1 JP WO2023008252A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021121281 | 2021-07-26 | ||
PCT/JP2022/028038 WO2023008252A1 (ja) | 2021-07-26 | 2022-07-19 | パッケージおよびパワーモジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023008252A1 true JPWO2023008252A1 (ko) | 2023-02-02 |
JPWO2023008252A5 JPWO2023008252A5 (ko) | 2024-03-25 |
Family
ID=85087939
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023538453A Pending JPWO2023008252A1 (ko) | 2021-07-26 | 2022-07-19 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2023008252A1 (ko) |
WO (1) | WO2023008252A1 (ko) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11111909A (ja) * | 1997-10-07 | 1999-04-23 | Seiichi Serizawa | 半導体装置用リードフレーム |
JP4652281B2 (ja) * | 2006-05-29 | 2011-03-16 | パナソニック株式会社 | 樹脂封止型半導体装置 |
JP2020155699A (ja) * | 2019-03-22 | 2020-09-24 | 日本碍子株式会社 | パッケージ、および、パワー半導体モジュールの製造方法 |
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2022
- 2022-07-19 JP JP2023538453A patent/JPWO2023008252A1/ja active Pending
- 2022-07-19 WO PCT/JP2022/028038 patent/WO2023008252A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2023008252A1 (ja) | 2023-02-02 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231222 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231222 |