JP2006193578A - 潜在性硬化剤 - Google Patents
潜在性硬化剤 Download PDFInfo
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- JP2006193578A JP2006193578A JP2005005029A JP2005005029A JP2006193578A JP 2006193578 A JP2006193578 A JP 2006193578A JP 2005005029 A JP2005005029 A JP 2005005029A JP 2005005029 A JP2005005029 A JP 2005005029A JP 2006193578 A JP2006193578 A JP 2006193578A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/703—Isocyanates or isothiocyanates transformed in a latent form by physical means
- C08G18/705—Dispersions of isocyanates or isothiocyanates in a liquid medium
- C08G18/706—Dispersions of isocyanates or isothiocyanates in a liquid medium the liquid medium being water
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
- C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
- C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
- C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
- C08G18/8022—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
- C08G18/8029—Masked aromatic polyisocyanates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
- C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
- C08G18/8093—Compounds containing active methylene groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4028—Isocyanates; Thioisocyanates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/70—Chelates
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Epoxy Resins (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Valve-Gear Or Valve Arrangements (AREA)
- Valve Device For Special Equipments (AREA)
Abstract
【解決手段】
潜在性硬化剤は、アルミニウムキレート剤が、多官能イソシアネート化合物を界面重合させて得た多孔性樹脂に保持されており、この潜在性硬化剤を硬化型エポキシ樹脂系DSC測定用組成物に配合した場合に、非水極性溶媒で浸漬処理した潜在性硬化剤を配合した硬化型エポキシ樹脂系DSC測定用組成物のDSC発熱ピーク温度を、浸漬処理していない潜在性硬化剤を配合した硬化型エポキシ樹脂系DSC測定用組成物のDSC発熱ピーク温度以上にすることが可能なものである。
【選択図】 図1
Description
アルミニウムモノアセチルアセトネートビス(エチルアセトアセテート)の24%イソプロパノール溶液(アルミキレートD、川研ファインケミカル(株))11重量部と、メチレンジフェニル−4,4’−ジイソシアネート(3モル)のトリメチロールプロパン(1モル)付加物(D−109、三井武田ケミカル(株))11重量部とを、酢酸エチル30重量部に溶解し、油相溶液を得た。
超音波ホモジナイザーに代えて、超音波洗浄器(Bransonic 2500J-DTH,ブランソン社)を使用する以外は、実施例1と同様に潜在性硬化剤を20重量部得た。
蒸留水800重量部と、界面活性剤(ニューレックスR−T、日本油脂(株))0.05重量部と、分散剤としてポリビニルアルコール(PVA−205、(株)クラレ)4重量部とを、温度計を備えた3リットルの界面重合容器に入れ、均一に混合した。この混合液に、更に、アルミニウムモノアセチルアセトネートビス(エチルアセトアセテート)の24%イソプロパノール溶液(アルミキレートD、川研ファインケミカル(株))11重量部と、メチレンジフェニル−4,4’−ジイソシアネート(3モル)のトリメチロールプロパン(1モル)付加物(D−109、三井武田ケミカル(株))11重量部とを、酢酸エチル30重量部に溶解した油相溶液を投入し、ホモジナイザー(11000rpm/10分、IKA(株))で乳化混合後、60℃で一晩界面重合させた。
実施例1、2及び比較例1の潜在性硬化剤を、それぞれ二つに分け、その一方の潜在性硬化剤を、室温で100容量倍の非水極性溶媒(プロピレングリコールモノメチルエーテルアセテート(PGMEA))に投入し、超音波洗浄器を用いて超音波分散した後、PGMEAに浸漬させたまま30℃の恒温槽中で4時間放置した後に濾取し、乾燥させることにより、非水極性溶媒に浸漬処理した潜在性硬化剤を得た。
Claims (9)
- アルミニウムキレート剤が、多官能イソシアネート化合物を界面重合させて得た多孔性樹脂に保持されてなる潜在性硬化剤であって、この潜在性硬化剤を硬化型エポキシ樹脂系DSC測定用組成物に配合した場合に、非水極性溶媒で浸漬処理した潜在性硬化剤を配合した硬化型エポキシ樹脂系DSC測定用組成物のDSC発熱ピーク温度を、浸漬処理していない潜在性硬化剤を配合した硬化型エポキシ樹脂系DSC測定用組成物のDSC発熱ピーク温度以上にすることが可能な潜在性硬化剤。
- 非水極性有機溶媒での浸漬処理を行っていない潜在性硬化剤を配合した硬化型エポキシ樹脂系DSC測定用組成物のDSC発熱ピーク強度に対する、浸漬処理を行った潜在性硬化剤を配合した硬化型エポキシ樹脂系DSC測定用組成物のDSC発熱ピーク強度の比率が60%以上である請求項1記載の潜在性硬化剤。
- 非水極性有機溶媒が、エステル基、カルボニル基、もしくはヒドロキシル基を有する有機溶媒である請求項1又は2記載の潜在性硬化剤。
- アルミニウムキレート剤が、配位子であるβ−ケトエノラート陰イオンがアルミニウムに配位した錯体化合物である請求項1記載の潜在性硬化剤。
- アルミニウムキレート剤が、アルミニウムモノアセチルアセトネートビス(エチルアセトアセテート)である請求項1記載の潜在性硬化剤。
- 請求項1記載の潜在性硬化剤の製造方法であって、アルミニウムキレート剤と多官能イソシアネート化合物とを揮発性有機溶媒に溶解させて得た溶液に、乳化剤を含有する水性液を投入し、超音波ホモジナイズ処理して乳化し、得られた乳化液を、分散剤を含有する水相に乳化分散した後、加熱撹拌することにより界面重合させることを特徴とする製造方法。
- 揮発性有機溶媒が、低級アルキル酢酸エステルである請求項6記載の製造方法。
- 請求項1〜5のいずれかに記載の潜在性硬化剤とシランカップリング剤と熱硬化型樹脂とを含有することを特徴とする熱硬化型樹脂組成物。
- 熱硬化型樹脂が熱硬化型エポキシ樹脂である請求項8記載の熱硬化型樹脂組成物。
Priority Applications (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005005029A JP4811555B2 (ja) | 2005-01-12 | 2005-01-12 | 潜在性硬化剤 |
CN2005800463040A CN101098905B (zh) | 2005-01-12 | 2005-08-04 | 潜在性固化剂 |
PCT/JP2005/014276 WO2006075415A1 (ja) | 2005-01-12 | 2005-08-04 | 潜在性硬化剤 |
EP10162712.3A EP2210909B1 (en) | 2005-01-12 | 2005-08-04 | Latent curing agent |
DE602005022625T DE602005022625D1 (de) | 2005-01-12 | 2005-08-04 | Latenter härter |
US11/813,825 US8039522B2 (en) | 2005-01-12 | 2005-08-04 | Latent curing agent |
KR1020077015811A KR101126904B1 (ko) | 2005-01-12 | 2005-08-04 | 잠재성 경화제 |
AT05768744T ATE475682T1 (de) | 2005-01-12 | 2005-08-04 | Latenter härter |
EP05768744A EP1837358B1 (en) | 2005-01-12 | 2005-08-04 | Latent curing agent |
TW094126937A TWI288169B (en) | 2005-01-12 | 2005-08-09 | Latent curing agent |
HK08106634.1A HK1116506A1 (en) | 2005-01-12 | 2008-06-17 | Latent curing agent |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005005029A JP4811555B2 (ja) | 2005-01-12 | 2005-01-12 | 潜在性硬化剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006193578A true JP2006193578A (ja) | 2006-07-27 |
JP4811555B2 JP4811555B2 (ja) | 2011-11-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005005029A Active JP4811555B2 (ja) | 2005-01-12 | 2005-01-12 | 潜在性硬化剤 |
Country Status (10)
Country | Link |
---|---|
US (1) | US8039522B2 (ja) |
EP (2) | EP1837358B1 (ja) |
JP (1) | JP4811555B2 (ja) |
KR (1) | KR101126904B1 (ja) |
CN (1) | CN101098905B (ja) |
AT (1) | ATE475682T1 (ja) |
DE (1) | DE602005022625D1 (ja) |
HK (1) | HK1116506A1 (ja) |
TW (1) | TWI288169B (ja) |
WO (1) | WO2006075415A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009019906A1 (ja) * | 2007-08-03 | 2009-02-12 | Sony Chemical & Information Device Corporation | 潜在性硬化剤 |
JP2009191267A (ja) * | 2009-02-12 | 2009-08-27 | Sony Chemical & Information Device Corp | 潜在性硬化剤の製造方法、及び接着剤の製造方法 |
JP2020139169A (ja) * | 2020-06-09 | 2020-09-03 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤の製造方法及び熱硬化型エポキシ樹脂組成物 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4381255B2 (ja) | 2003-09-08 | 2009-12-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 潜在性硬化剤 |
JP4811555B2 (ja) | 2005-01-12 | 2011-11-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 潜在性硬化剤 |
JP5146645B2 (ja) * | 2007-08-28 | 2013-02-20 | デクセリアルズ株式会社 | マイクロカプセル型潜在性硬化剤 |
JP5321082B2 (ja) * | 2009-01-21 | 2013-10-23 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤及びその製造方法 |
JP6489494B2 (ja) * | 2014-09-09 | 2019-03-27 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤、その製造方法及び熱硬化型エポキシ樹脂組成物 |
JP6875999B2 (ja) * | 2015-12-17 | 2021-05-26 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤の製造方法及び熱硬化型エポキシ樹脂組成物 |
CN108940363B (zh) * | 2017-05-19 | 2021-01-01 | 宁波大学 | 一种大孔/介孔复合型光催化剂及其制备方法 |
CN108940229B (zh) * | 2017-05-19 | 2020-12-22 | 宁波大学 | 一种环氧基大孔/介孔聚合物材料及其制备方法 |
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JPH11343332A (ja) * | 1998-06-02 | 1999-12-14 | Nitto Denko Corp | マイクロカプセル型硬化剤、マイクロカプセル型硬化促進剤およびそれらの製法、ならびにエポキシ樹脂組成物、半導体封止用エポキシ樹脂組成物 |
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2005
- 2005-01-12 JP JP2005005029A patent/JP4811555B2/ja active Active
- 2005-08-04 KR KR1020077015811A patent/KR101126904B1/ko active IP Right Grant
- 2005-08-04 WO PCT/JP2005/014276 patent/WO2006075415A1/ja active Application Filing
- 2005-08-04 EP EP05768744A patent/EP1837358B1/en active Active
- 2005-08-04 DE DE602005022625T patent/DE602005022625D1/de active Active
- 2005-08-04 US US11/813,825 patent/US8039522B2/en active Active
- 2005-08-04 CN CN2005800463040A patent/CN101098905B/zh active Active
- 2005-08-04 AT AT05768744T patent/ATE475682T1/de not_active IP Right Cessation
- 2005-08-04 EP EP10162712.3A patent/EP2210909B1/en active Active
- 2005-08-09 TW TW094126937A patent/TWI288169B/zh active
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2008
- 2008-06-17 HK HK08106634.1A patent/HK1116506A1/xx unknown
Patent Citations (5)
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JPH11343332A (ja) * | 1998-06-02 | 1999-12-14 | Nitto Denko Corp | マイクロカプセル型硬化剤、マイクロカプセル型硬化促進剤およびそれらの製法、ならびにエポキシ樹脂組成物、半導体封止用エポキシ樹脂組成物 |
JP2002363255A (ja) * | 2001-06-06 | 2002-12-18 | Sony Chem Corp | 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤 |
JP2002368047A (ja) * | 2001-06-06 | 2002-12-20 | Sony Chem Corp | 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤 |
JP2006070051A (ja) * | 2003-09-08 | 2006-03-16 | Sony Chem Corp | 潜在性硬化剤 |
JP2009203477A (ja) * | 2003-09-08 | 2009-09-10 | Sony Chemical & Information Device Corp | 潜在性硬化剤 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2009019906A1 (ja) * | 2007-08-03 | 2009-02-12 | Sony Chemical & Information Device Corporation | 潜在性硬化剤 |
JP2009191267A (ja) * | 2009-02-12 | 2009-08-27 | Sony Chemical & Information Device Corp | 潜在性硬化剤の製造方法、及び接着剤の製造方法 |
JP2020139169A (ja) * | 2020-06-09 | 2020-09-03 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤の製造方法及び熱硬化型エポキシ樹脂組成物 |
JP7028280B2 (ja) | 2020-06-09 | 2022-03-02 | デクセリアルズ株式会社 | アルミニウムキレート系潜在性硬化剤の製造方法及び熱硬化型エポキシ樹脂組成物 |
Also Published As
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EP1837358A1 (en) | 2007-09-26 |
US20090209669A1 (en) | 2009-08-20 |
CN101098905A (zh) | 2008-01-02 |
ATE475682T1 (de) | 2010-08-15 |
EP1837358A4 (en) | 2008-04-16 |
DE602005022625D1 (de) | 2010-09-09 |
KR20070102679A (ko) | 2007-10-19 |
EP1837358B1 (en) | 2010-07-28 |
CN101098905B (zh) | 2011-02-02 |
KR101126904B1 (ko) | 2012-03-19 |
TW200624531A (en) | 2006-07-16 |
JP4811555B2 (ja) | 2011-11-09 |
HK1116506A1 (en) | 2008-12-24 |
WO2006075415A1 (ja) | 2006-07-20 |
TWI288169B (en) | 2007-10-11 |
US8039522B2 (en) | 2011-10-18 |
EP2210909A1 (en) | 2010-07-28 |
EP2210909B1 (en) | 2014-04-23 |
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