HK1116506A1 - Latent curing agent - Google Patents

Latent curing agent

Info

Publication number
HK1116506A1
HK1116506A1 HK08106634.1A HK08106634A HK1116506A1 HK 1116506 A1 HK1116506 A1 HK 1116506A1 HK 08106634 A HK08106634 A HK 08106634A HK 1116506 A1 HK1116506 A1 HK 1116506A1
Authority
HK
Hong Kong
Prior art keywords
curing agent
latent curing
dsc
resin composition
epoxy resin
Prior art date
Application number
HK08106634.1A
Other languages
English (en)
Inventor
Kazunobu Kamiya
Original Assignee
Sony Chem & Inf Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chem & Inf Device Corp filed Critical Sony Chem & Inf Device Corp
Publication of HK1116506A1 publication Critical patent/HK1116506A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/703—Isocyanates or isothiocyanates transformed in a latent form by physical means
    • C08G18/705—Dispersions of isocyanates or isothiocyanates in a liquid medium
    • C08G18/706—Dispersions of isocyanates or isothiocyanates in a liquid medium the liquid medium being water
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
    • C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
    • C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
    • C08G18/8022—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
    • C08G18/8029—Masked aromatic polyisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
    • C08G18/8093—Compounds containing active methylene groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Valve-Gear Or Valve Arrangements (AREA)
  • Valve Device For Special Equipments (AREA)
HK08106634.1A 2005-01-12 2008-06-17 Latent curing agent HK1116506A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005005029A JP4811555B2 (ja) 2005-01-12 2005-01-12 潜在性硬化剤
PCT/JP2005/014276 WO2006075415A1 (ja) 2005-01-12 2005-08-04 潜在性硬化剤

Publications (1)

Publication Number Publication Date
HK1116506A1 true HK1116506A1 (en) 2008-12-24

Family

ID=36677451

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08106634.1A HK1116506A1 (en) 2005-01-12 2008-06-17 Latent curing agent

Country Status (10)

Country Link
US (1) US8039522B2 (ja)
EP (2) EP1837358B1 (ja)
JP (1) JP4811555B2 (ja)
KR (1) KR101126904B1 (ja)
CN (1) CN101098905B (ja)
AT (1) ATE475682T1 (ja)
DE (1) DE602005022625D1 (ja)
HK (1) HK1116506A1 (ja)
TW (1) TWI288169B (ja)
WO (1) WO2006075415A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4381255B2 (ja) * 2003-09-08 2009-12-09 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤
JP4811555B2 (ja) 2005-01-12 2011-11-09 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤
JP5212597B2 (ja) * 2007-08-03 2013-06-19 デクセリアルズ株式会社 潜在性硬化剤
JP5146645B2 (ja) * 2007-08-28 2013-02-20 デクセリアルズ株式会社 マイクロカプセル型潜在性硬化剤
JP5321082B2 (ja) * 2009-01-21 2013-10-23 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤及びその製造方法
JP5360378B2 (ja) * 2009-02-12 2013-12-04 デクセリアルズ株式会社 潜在性硬化剤の製造方法、及び接着剤の製造方法
JP6489494B2 (ja) * 2014-09-09 2019-03-27 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤、その製造方法及び熱硬化型エポキシ樹脂組成物
JP6875999B2 (ja) * 2015-12-17 2021-05-26 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤の製造方法及び熱硬化型エポキシ樹脂組成物
CN108940363B (zh) * 2017-05-19 2021-01-01 宁波大学 一种大孔/介孔复合型光催化剂及其制备方法
CN108940229B (zh) * 2017-05-19 2020-12-22 宁波大学 一种环氧基大孔/介孔聚合物材料及其制备方法
JP7028280B2 (ja) * 2020-06-09 2022-03-02 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤の製造方法及び熱硬化型エポキシ樹脂組成物

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3231597A (en) * 1957-07-03 1966-01-25 Aerojet General Co Polyurethane preparation
JPH078899B2 (ja) * 1987-03-12 1995-02-01 田岡化学工業株式会社 硬化性組成物
US5684079A (en) * 1990-11-20 1997-11-04 Dainippon Ink And Chemicals Inc. Curing composition
DE69423719T2 (de) * 1993-07-14 2000-07-27 Asahi Glass Co Ltd Beschichtungsharzzusammensetzung
JP3957239B2 (ja) * 1998-06-02 2007-08-15 日東電工株式会社 エポキシ樹脂用マイクロカプセル型硬化剤、エポキシ樹脂用マイクロカプセル型硬化促進剤およびそれらの製法、ならびにエポキシ樹脂組成物、半導体封止用エポキシ樹脂組成物
KR100815314B1 (ko) * 2000-03-31 2008-03-19 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착필름, 반도체 탑재용 기판 및 반도체 장치
KR100841684B1 (ko) * 2000-11-02 2008-06-27 다우 글로벌 테크놀로지스 인크. 하이브리드 폴리우레탄 입자의 수성 분산액의 제조방법
JP2002212537A (ja) 2001-01-24 2002-07-31 Sony Chem Corp 接着剤及び電気装置
JP3802373B2 (ja) * 2001-06-06 2006-07-26 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
JP3565797B2 (ja) * 2001-06-06 2004-09-15 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
JP3875859B2 (ja) * 2001-06-27 2007-01-31 ソニーケミカル＆インフォメーションデバイス株式会社 硬化剤粒子、硬化剤粒子の製造方法及び接着剤
US6649084B2 (en) * 2001-07-25 2003-11-18 Nippon Polyurethane Industry Co., Ltd. Polyisocyanate curing agent for laminate adhesive, and laminate adhesive using the same
JP4148685B2 (ja) 2002-02-18 2008-09-10 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
MY139328A (en) * 2002-05-20 2009-09-30 Nitto Denko Corp Thermosetting resin composition and semiconductor device obtained with the same
JP2004109943A (ja) * 2002-09-20 2004-04-08 Ricoh Co Ltd 画像形成装置
CN1285660C (zh) * 2002-12-05 2006-11-22 索尼化学株式会社 潜在性硬化剂、其制造方法及粘接剂
JP4178549B2 (ja) 2003-02-17 2008-11-12 カシオ計算機株式会社 音楽教習装置および音楽教習プログラム
JP4381255B2 (ja) * 2003-09-08 2009-12-09 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤
JP5417982B2 (ja) * 2003-09-08 2014-02-19 デクセリアルズ株式会社 潜在性硬化剤
JP4811555B2 (ja) 2005-01-12 2011-11-09 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤

Also Published As

Publication number Publication date
US8039522B2 (en) 2011-10-18
JP4811555B2 (ja) 2011-11-09
EP2210909A1 (en) 2010-07-28
TWI288169B (en) 2007-10-11
KR20070102679A (ko) 2007-10-19
ATE475682T1 (de) 2010-08-15
CN101098905A (zh) 2008-01-02
EP1837358A1 (en) 2007-09-26
DE602005022625D1 (de) 2010-09-09
WO2006075415A1 (ja) 2006-07-20
US20090209669A1 (en) 2009-08-20
TW200624531A (en) 2006-07-16
CN101098905B (zh) 2011-02-02
EP1837358A4 (en) 2008-04-16
EP2210909B1 (en) 2014-04-23
EP1837358B1 (en) 2010-07-28
KR101126904B1 (ko) 2012-03-19
JP2006193578A (ja) 2006-07-27

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