KR101126904B1 - 잠재성 경화제 - Google Patents

잠재성 경화제 Download PDF

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Publication number
KR101126904B1
KR101126904B1 KR1020077015811A KR20077015811A KR101126904B1 KR 101126904 B1 KR101126904 B1 KR 101126904B1 KR 1020077015811 A KR1020077015811 A KR 1020077015811A KR 20077015811 A KR20077015811 A KR 20077015811A KR 101126904 B1 KR101126904 B1 KR 101126904B1
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KR
South Korea
Prior art keywords
curing agent
latent curing
latent
epoxy resin
dsc
Prior art date
Application number
KR1020077015811A
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English (en)
Korean (ko)
Other versions
KR20070102679A (ko
Inventor
가즈노부 가미야
Original Assignee
소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤
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Application filed by 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 filed Critical 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤
Publication of KR20070102679A publication Critical patent/KR20070102679A/ko
Application granted granted Critical
Publication of KR101126904B1 publication Critical patent/KR101126904B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/703—Isocyanates or isothiocyanates transformed in a latent form by physical means
    • C08G18/705—Dispersions of isocyanates or isothiocyanates in a liquid medium
    • C08G18/706—Dispersions of isocyanates or isothiocyanates in a liquid medium the liquid medium being water
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8003—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
    • C08G18/8006—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
    • C08G18/8009—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
    • C08G18/8022—Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
    • C08G18/8029—Masked aromatic polyisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
    • C08G18/8093—Compounds containing active methylene groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/70—Chelates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Valve-Gear Or Valve Arrangements (AREA)
  • Valve Device For Special Equipments (AREA)
KR1020077015811A 2005-01-12 2005-08-04 잠재성 경화제 KR101126904B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005005029A JP4811555B2 (ja) 2005-01-12 2005-01-12 潜在性硬化剤
JPJP-P-2005-00005029 2005-01-12
PCT/JP2005/014276 WO2006075415A1 (ja) 2005-01-12 2005-08-04 潜在性硬化剤

Publications (2)

Publication Number Publication Date
KR20070102679A KR20070102679A (ko) 2007-10-19
KR101126904B1 true KR101126904B1 (ko) 2012-03-19

Family

ID=36677451

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077015811A KR101126904B1 (ko) 2005-01-12 2005-08-04 잠재성 경화제

Country Status (10)

Country Link
US (1) US8039522B2 (ja)
EP (2) EP1837358B1 (ja)
JP (1) JP4811555B2 (ja)
KR (1) KR101126904B1 (ja)
CN (1) CN101098905B (ja)
AT (1) ATE475682T1 (ja)
DE (1) DE602005022625D1 (ja)
HK (1) HK1116506A1 (ja)
TW (1) TWI288169B (ja)
WO (1) WO2006075415A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4381255B2 (ja) * 2003-09-08 2009-12-09 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤
JP4811555B2 (ja) 2005-01-12 2011-11-09 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤
JP5212597B2 (ja) * 2007-08-03 2013-06-19 デクセリアルズ株式会社 潜在性硬化剤
JP5146645B2 (ja) * 2007-08-28 2013-02-20 デクセリアルズ株式会社 マイクロカプセル型潜在性硬化剤
JP5321082B2 (ja) * 2009-01-21 2013-10-23 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤及びその製造方法
JP5360378B2 (ja) * 2009-02-12 2013-12-04 デクセリアルズ株式会社 潜在性硬化剤の製造方法、及び接着剤の製造方法
JP6489494B2 (ja) * 2014-09-09 2019-03-27 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤、その製造方法及び熱硬化型エポキシ樹脂組成物
JP6875999B2 (ja) * 2015-12-17 2021-05-26 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤の製造方法及び熱硬化型エポキシ樹脂組成物
CN108940363B (zh) * 2017-05-19 2021-01-01 宁波大学 一种大孔/介孔复合型光催化剂及其制备方法
CN108940229B (zh) * 2017-05-19 2020-12-22 宁波大学 一种环氧基大孔/介孔聚合物材料及其制备方法
JP7028280B2 (ja) * 2020-06-09 2022-03-02 デクセリアルズ株式会社 アルミニウムキレート系潜在性硬化剤の製造方法及び熱硬化型エポキシ樹脂組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368047A (ja) 2001-06-06 2002-12-20 Sony Chem Corp 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
WO2003068840A1 (fr) 2002-02-18 2003-08-21 Sony Chemicals Corporation Durcisseur latent, procede de production et adhesif contenant un durcisseur latent

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US3231597A (en) * 1957-07-03 1966-01-25 Aerojet General Co Polyurethane preparation
JPH078899B2 (ja) * 1987-03-12 1995-02-01 田岡化学工業株式会社 硬化性組成物
US5684079A (en) * 1990-11-20 1997-11-04 Dainippon Ink And Chemicals Inc. Curing composition
DE69423719T2 (de) * 1993-07-14 2000-07-27 Asahi Glass Co Ltd Beschichtungsharzzusammensetzung
JP3957239B2 (ja) * 1998-06-02 2007-08-15 日東電工株式会社 エポキシ樹脂用マイクロカプセル型硬化剤、エポキシ樹脂用マイクロカプセル型硬化促進剤およびそれらの製法、ならびにエポキシ樹脂組成物、半導体封止用エポキシ樹脂組成物
KR100815314B1 (ko) * 2000-03-31 2008-03-19 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그의 제조 방법, 이것을 사용한 접착필름, 반도체 탑재용 기판 및 반도체 장치
KR100841684B1 (ko) * 2000-11-02 2008-06-27 다우 글로벌 테크놀로지스 인크. 하이브리드 폴리우레탄 입자의 수성 분산액의 제조방법
JP2002212537A (ja) 2001-01-24 2002-07-31 Sony Chem Corp 接着剤及び電気装置
JP3802373B2 (ja) * 2001-06-06 2006-07-26 ソニーケミカル株式会社 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
JP3875859B2 (ja) * 2001-06-27 2007-01-31 ソニーケミカル＆インフォメーションデバイス株式会社 硬化剤粒子、硬化剤粒子の製造方法及び接着剤
US6649084B2 (en) * 2001-07-25 2003-11-18 Nippon Polyurethane Industry Co., Ltd. Polyisocyanate curing agent for laminate adhesive, and laminate adhesive using the same
MY139328A (en) * 2002-05-20 2009-09-30 Nitto Denko Corp Thermosetting resin composition and semiconductor device obtained with the same
JP2004109943A (ja) * 2002-09-20 2004-04-08 Ricoh Co Ltd 画像形成装置
CN1285660C (zh) * 2002-12-05 2006-11-22 索尼化学株式会社 潜在性硬化剂、其制造方法及粘接剂
JP4178549B2 (ja) 2003-02-17 2008-11-12 カシオ計算機株式会社 音楽教習装置および音楽教習プログラム
JP4381255B2 (ja) * 2003-09-08 2009-12-09 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤
JP5417982B2 (ja) * 2003-09-08 2014-02-19 デクセリアルズ株式会社 潜在性硬化剤
JP4811555B2 (ja) 2005-01-12 2011-11-09 ソニーケミカル＆インフォメーションデバイス株式会社 潜在性硬化剤

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368047A (ja) 2001-06-06 2002-12-20 Sony Chem Corp 潜在性硬化剤、潜在性硬化剤の製造方法及び接着剤
WO2003068840A1 (fr) 2002-02-18 2003-08-21 Sony Chemicals Corporation Durcisseur latent, procede de production et adhesif contenant un durcisseur latent

Also Published As

Publication number Publication date
US8039522B2 (en) 2011-10-18
JP4811555B2 (ja) 2011-11-09
HK1116506A1 (en) 2008-12-24
EP2210909A1 (en) 2010-07-28
TWI288169B (en) 2007-10-11
KR20070102679A (ko) 2007-10-19
ATE475682T1 (de) 2010-08-15
CN101098905A (zh) 2008-01-02
EP1837358A1 (en) 2007-09-26
DE602005022625D1 (de) 2010-09-09
WO2006075415A1 (ja) 2006-07-20
US20090209669A1 (en) 2009-08-20
TW200624531A (en) 2006-07-16
CN101098905B (zh) 2011-02-02
EP1837358A4 (en) 2008-04-16
EP2210909B1 (en) 2014-04-23
EP1837358B1 (en) 2010-07-28
JP2006193578A (ja) 2006-07-27

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