JP2006190956A - イメージ・センサ用fbga及びcobパッケージ構造 - Google Patents
イメージ・センサ用fbga及びcobパッケージ構造 Download PDFInfo
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
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- 238000001039 wet etching Methods 0.000 description 1
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- H01L27/144—Devices controlled by radiation
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- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
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Abstract
【解決手段】プリント基板上に置かれたダイを含むパッケージの構造。ガラス基板とチップとの間に空隙領域を形成するために、ガラス基板が接着膜パターン上に接着されている。マイクロレンズがチップ上に配置されている。レンズ・ホルダーが、プリント基板上に固定されている。ガラス基板は、マイクロレンズを粒子汚染から防止する。
【選択図】 図5
Description
110、121、131:ダイ
111、123、132:ガラス(透明材料)
112、124、133:ガラス膜(接着膜)パターン、弾性膜パターン
114、141:マイクロレンズ領域
115:空隙
125、136:ボンディング・ワイヤ(ワイヤ)
113、128、135:導体パッド、接続パッド(第1のパッド)
129、134:導体パッド、Alパッド(第2のパッド)
126、137:保護材料
Claims (7)
- FBGAパッケージ構造であって、
マイクロレンズ領域を有する、基板上に形成されたダイと、
前記ダイ上に形成された接着膜パターンと、
前記チップ上の前記マイクロレンズ領域を覆うために、前記接着膜パターン上に接着された透明材料であって、それにより、それらの間に空隙を生成する、透明材料と、
前記基板上に形成された第1のパッド及び前記ダイ上に形成された第2のパッドと、
前記第1のパッドと第2のパッドとの間に接続されたワイヤと、
前記ワイヤを略覆うモールディング材料と、
前記基板の下面に取り付けられた導電性のバンプと、を含む、
構造。 - 前記ダイがイメージ・センサであり、前記接着膜パターンの材料が弾性材料であり、前記弾性材料がUVタイプ又はサーマル・タイプの材料を有する、請求項1に記載の構造。
- 前記透明材料がガラス又は石英を含み、前記モールディング材料が混合物又は液体混合物を含み、前記モールディング材料がモールディング又は接着法によって形成された、請求項1に記載の構造。
- パッケージ・モジュールのCOB構造であって、
基板と、
複数のボンディング・ワイヤを介して、それぞれ、複数の接続パッドに接続された複数のボンディング・パッドを有する、前記基板上に置かれたダイと、
前記ダイの上に形成された接着膜パターンと、
前記ダイの上のマイクロレンズ領域を覆うために、前記接着膜パターン上に接着された透明材料であって、それにより、それらの間に空隙を生成する、透明材料と、
その中に少なくとも1つのレンズが置かれた、前記基板上に固定されたレンズ・ホルダーと、
前記基板上に形成された第1のパッド及び前記ダイ上に形成された第2のパッドと、
前記第1のパッドと第2のパッドとの間に接続されたワイヤと、
前記ワイヤを略覆うモールディング材料と、を含む、
構造。 - 前記ダイがイメージ・センサであり、前記接着膜が弾性材料であり、前記弾性材料がUVタイプ又はサーマル・タイプの材料を有する、請求項4に記載の構造。
- 前記透明材料がガラス又は石英を含み、前記基板がプリント基板を含み、前記モールディング材料が混合物又は液体混合物を含む、請求項4に記載の構造。
- 前記レンズ・ホルダー内に形成されたフィルタを更に含み、前記フィルタが前記基板の表面上に形成されたIRフィルタ層であり、前記IRフィルタ層の材料がTiO2光触媒を含み、前記フィルタが前記レンズ・ホルダー内に固定されたIRフィルタである、請求項4に記載の構造。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/029,929 US7279782B2 (en) | 2005-01-05 | 2005-01-05 | FBGA and COB package structure for image sensor |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007259393A Division JP2008079321A (ja) | 2005-01-05 | 2007-10-03 | イメージ・センサ用cobパッケージ構造 |
Publications (1)
Publication Number | Publication Date |
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JP2006190956A true JP2006190956A (ja) | 2006-07-20 |
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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JP2005203794A Pending JP2006190956A (ja) | 2005-01-05 | 2005-07-13 | イメージ・センサ用fbga及びcobパッケージ構造 |
JP2007259393A Withdrawn JP2008079321A (ja) | 2005-01-05 | 2007-10-03 | イメージ・センサ用cobパッケージ構造 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2007259393A Withdrawn JP2008079321A (ja) | 2005-01-05 | 2007-10-03 | イメージ・センサ用cobパッケージ構造 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7279782B2 (ja) |
JP (2) | JP2006190956A (ja) |
KR (1) | KR100724194B1 (ja) |
CN (1) | CN1801493A (ja) |
DE (1) | DE102005018990A1 (ja) |
SG (1) | SG123651A1 (ja) |
TW (1) | TWI278121B (ja) |
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JP2013235933A (ja) * | 2012-05-08 | 2013-11-21 | Nikon Corp | 撮像素子および撮像素子の製造方法 |
WO2016038874A1 (ja) * | 2014-09-08 | 2016-03-17 | 株式会社ケンコー・トキナー | フィルターユニット |
JP2021501984A (ja) * | 2018-09-21 | 2021-01-21 | 中芯集成電路(寧波)有限公司上海分公司Ningbo Semiconductor International Corporation(Shanghai Branch) | イメージセンサモジュール及びその製造方法 |
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JP2004006694A (ja) * | 2002-03-29 | 2004-01-08 | Toshiba Corp | 受光素子及び光半導体装置 |
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DE102004007541B4 (de) * | 2004-02-11 | 2006-11-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren für eine Bearbeitung großflächiger Bearbeitungsbereiche von Werkstücken mittels Laserstrahlung |
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-
2005
- 2005-01-05 US US11/029,929 patent/US7279782B2/en active Active
- 2005-03-24 TW TW094109159A patent/TWI278121B/zh active
- 2005-03-29 SG SG200502546A patent/SG123651A1/en unknown
- 2005-04-07 CN CNA2005100638579A patent/CN1801493A/zh active Pending
- 2005-04-18 KR KR1020050031897A patent/KR100724194B1/ko active IP Right Grant
- 2005-04-22 DE DE102005018990A patent/DE102005018990A1/de not_active Withdrawn
- 2005-07-13 JP JP2005203794A patent/JP2006190956A/ja active Pending
-
2007
- 2007-10-03 JP JP2007259393A patent/JP2008079321A/ja not_active Withdrawn
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100842479B1 (ko) | 2006-12-28 | 2008-07-01 | 동부일렉트로닉스 주식회사 | 스캐너의 렌즈계의 오염 방지 방법 및 장치 |
JP2013235933A (ja) * | 2012-05-08 | 2013-11-21 | Nikon Corp | 撮像素子および撮像素子の製造方法 |
WO2016038874A1 (ja) * | 2014-09-08 | 2016-03-17 | 株式会社ケンコー・トキナー | フィルターユニット |
JP2016057384A (ja) * | 2014-09-08 | 2016-04-21 | 株式会社ケンコー・トキナー | フィルターユニット |
US10209478B2 (en) | 2014-09-08 | 2019-02-19 | Kenko Tokina Co., Ltd. | Filter unit |
JP2021501984A (ja) * | 2018-09-21 | 2021-01-21 | 中芯集成電路(寧波)有限公司上海分公司Ningbo Semiconductor International Corporation(Shanghai Branch) | イメージセンサモジュール及びその製造方法 |
JP7072266B2 (ja) | 2018-09-21 | 2022-05-20 | 中芯集成電路(寧波)有限公司上海分公司 | イメージセンサモジュール及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI278121B (en) | 2007-04-01 |
US7279782B2 (en) | 2007-10-09 |
CN1801493A (zh) | 2006-07-12 |
DE102005018990A1 (de) | 2006-07-13 |
US20060145325A1 (en) | 2006-07-06 |
TW200625660A (en) | 2006-07-16 |
SG123651A1 (en) | 2006-07-26 |
JP2008079321A (ja) | 2008-04-03 |
KR20060080521A (ko) | 2006-07-10 |
KR100724194B1 (ko) | 2007-05-31 |
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